JPS59124852A - 無圧成形片面金属箔張り積層板の仕上げ方法 - Google Patents

無圧成形片面金属箔張り積層板の仕上げ方法

Info

Publication number
JPS59124852A
JPS59124852A JP57234624A JP23462482A JPS59124852A JP S59124852 A JPS59124852 A JP S59124852A JP 57234624 A JP57234624 A JP 57234624A JP 23462482 A JP23462482 A JP 23462482A JP S59124852 A JPS59124852 A JP S59124852A
Authority
JP
Japan
Prior art keywords
laminate
metallicfoil
metal foil
laminated board
pressure molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57234624A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035987B2 (https=
Inventor
大泉　正征
八洲男 伏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP57234624A priority Critical patent/JPS59124852A/ja
Publication of JPS59124852A publication Critical patent/JPS59124852A/ja
Publication of JPH035987B2 publication Critical patent/JPH035987B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP57234624A 1982-12-29 1982-12-29 無圧成形片面金属箔張り積層板の仕上げ方法 Granted JPS59124852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57234624A JPS59124852A (ja) 1982-12-29 1982-12-29 無圧成形片面金属箔張り積層板の仕上げ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57234624A JPS59124852A (ja) 1982-12-29 1982-12-29 無圧成形片面金属箔張り積層板の仕上げ方法

Publications (2)

Publication Number Publication Date
JPS59124852A true JPS59124852A (ja) 1984-07-19
JPH035987B2 JPH035987B2 (https=) 1991-01-28

Family

ID=16973952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57234624A Granted JPS59124852A (ja) 1982-12-29 1982-12-29 無圧成形片面金属箔張り積層板の仕上げ方法

Country Status (1)

Country Link
JP (1) JPS59124852A (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596162A (en) * 1945-03-01 1952-05-13 Marco Chemicals Inc Method of polymerizing fiber-reinforced resinous materials and product
JPS55126419A (en) * 1979-03-26 1980-09-30 Kanegafuchi Chem Ind Co Ltd Method and apparatus for continuous preparation of laminated material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596162A (en) * 1945-03-01 1952-05-13 Marco Chemicals Inc Method of polymerizing fiber-reinforced resinous materials and product
JPS55126419A (en) * 1979-03-26 1980-09-30 Kanegafuchi Chem Ind Co Ltd Method and apparatus for continuous preparation of laminated material

Also Published As

Publication number Publication date
JPH035987B2 (https=) 1991-01-28

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