JPS59117290A - フレキシブル銅貼りプリント基板 - Google Patents
フレキシブル銅貼りプリント基板Info
- Publication number
- JPS59117290A JPS59117290A JP23181082A JP23181082A JPS59117290A JP S59117290 A JPS59117290 A JP S59117290A JP 23181082 A JP23181082 A JP 23181082A JP 23181082 A JP23181082 A JP 23181082A JP S59117290 A JPS59117290 A JP S59117290A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insulating layer
- flexible
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000005524 ceramic coating Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000007575 Calluna vulgaris Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23181082A JPS59117290A (ja) | 1982-12-24 | 1982-12-24 | フレキシブル銅貼りプリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23181082A JPS59117290A (ja) | 1982-12-24 | 1982-12-24 | フレキシブル銅貼りプリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117290A true JPS59117290A (ja) | 1984-07-06 |
| JPS6330798B2 JPS6330798B2 (enrdf_load_stackoverflow) | 1988-06-21 |
Family
ID=16929370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23181082A Granted JPS59117290A (ja) | 1982-12-24 | 1982-12-24 | フレキシブル銅貼りプリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117290A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200159A (ja) * | 2002-12-05 | 2004-07-15 | Midtronics Inc | バッテリテストモジュール |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH027498U (enrdf_load_stackoverflow) * | 1988-06-27 | 1990-01-18 |
-
1982
- 1982-12-24 JP JP23181082A patent/JPS59117290A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200159A (ja) * | 2002-12-05 | 2004-07-15 | Midtronics Inc | バッテリテストモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6330798B2 (enrdf_load_stackoverflow) | 1988-06-21 |
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