JPS59116366A - 化学銅めつき液 - Google Patents

化学銅めつき液

Info

Publication number
JPS59116366A
JPS59116366A JP22601882A JP22601882A JPS59116366A JP S59116366 A JPS59116366 A JP S59116366A JP 22601882 A JP22601882 A JP 22601882A JP 22601882 A JP22601882 A JP 22601882A JP S59116366 A JPS59116366 A JP S59116366A
Authority
JP
Japan
Prior art keywords
plating
ion
copper plating
chemical copper
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22601882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337187B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Kikuchi
廣 菊池
Akira Matsuo
明 松尾
Hitoshi Oka
岡　齊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP22601882A priority Critical patent/JPS59116366A/ja
Publication of JPS59116366A publication Critical patent/JPS59116366A/ja
Publication of JPS6337187B2 publication Critical patent/JPS6337187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP22601882A 1982-12-24 1982-12-24 化学銅めつき液 Granted JPS59116366A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22601882A JPS59116366A (ja) 1982-12-24 1982-12-24 化学銅めつき液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22601882A JPS59116366A (ja) 1982-12-24 1982-12-24 化学銅めつき液

Publications (2)

Publication Number Publication Date
JPS59116366A true JPS59116366A (ja) 1984-07-05
JPS6337187B2 JPS6337187B2 (enrdf_load_stackoverflow) 1988-07-25

Family

ID=16838492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22601882A Granted JPS59116366A (ja) 1982-12-24 1982-12-24 化学銅めつき液

Country Status (1)

Country Link
JP (1) JPS59116366A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231382A (ja) * 2010-04-28 2011-11-17 Nagoya Plating Co Ltd 高分子繊維のめっき液並びにこれを用いた高分子繊維のめっき方法及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220339A (en) * 1975-08-08 1977-02-16 Hitachi Ltd Chemical copper plating solution
JPS5419430A (en) * 1977-07-13 1979-02-14 Hitachi Ltd Chemical copper plating solution
JPS56271A (en) * 1979-06-15 1981-01-06 Hitachi Ltd Non-electrolytic copper plating solution
JPS579865A (en) * 1980-06-20 1982-01-19 Hitachi Ltd Electroless copper plating solution

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220339A (en) * 1975-08-08 1977-02-16 Hitachi Ltd Chemical copper plating solution
JPS5419430A (en) * 1977-07-13 1979-02-14 Hitachi Ltd Chemical copper plating solution
JPS56271A (en) * 1979-06-15 1981-01-06 Hitachi Ltd Non-electrolytic copper plating solution
JPS579865A (en) * 1980-06-20 1982-01-19 Hitachi Ltd Electroless copper plating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231382A (ja) * 2010-04-28 2011-11-17 Nagoya Plating Co Ltd 高分子繊維のめっき液並びにこれを用いた高分子繊維のめっき方法及びその製造方法

Also Published As

Publication number Publication date
JPS6337187B2 (enrdf_load_stackoverflow) 1988-07-25

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