JPS59114892A - 無電解金属めつきの監視方法 - Google Patents

無電解金属めつきの監視方法

Info

Publication number
JPS59114892A
JPS59114892A JP58127060A JP12706083A JPS59114892A JP S59114892 A JPS59114892 A JP S59114892A JP 58127060 A JP58127060 A JP 58127060A JP 12706083 A JP12706083 A JP 12706083A JP S59114892 A JPS59114892 A JP S59114892A
Authority
JP
Japan
Prior art keywords
plating
circuit
walls
sample
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58127060A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0136994B2 (enExample
Inventor
フランク・パオレツテイ
スチ−ブン・アツシユレイ・シユバ−ト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS59114892A publication Critical patent/JPS59114892A/ja
Publication of JPH0136994B2 publication Critical patent/JPH0136994B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Molecular Biology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP58127060A 1982-12-10 1983-07-14 無電解金属めつきの監視方法 Granted JPS59114892A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US448574 1982-12-10
US06/448,574 US4477484A (en) 1982-12-10 1982-12-10 Electroless plating monitor

Publications (2)

Publication Number Publication Date
JPS59114892A true JPS59114892A (ja) 1984-07-03
JPH0136994B2 JPH0136994B2 (enExample) 1989-08-03

Family

ID=23780856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58127060A Granted JPS59114892A (ja) 1982-12-10 1983-07-14 無電解金属めつきの監視方法

Country Status (4)

Country Link
US (1) US4477484A (enExample)
EP (1) EP0113395B1 (enExample)
JP (1) JPS59114892A (enExample)
DE (1) DE3381648D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008104684A (ja) * 2006-10-26 2008-05-08 Matsushita Electric Ind Co Ltd 洗濯機
CN105050318A (zh) * 2015-07-06 2015-11-11 南京本川电子有限公司 具有埋阻测试区的pcb板结构及其测试方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8333355D0 (en) * 1983-12-14 1984-01-18 Rolls Royce Metallic coating layer thickness
EP0194103B1 (en) * 1985-02-28 1990-02-07 C. Uyemura & Co Ltd Method and apparatus for detecting start of electroless plating
US4626446A (en) * 1985-06-03 1986-12-02 International Business Machines Corporation Electroless plating bath monitor
US4755744A (en) * 1986-01-21 1988-07-05 Rohrback Corporation Plated sensor for monitoring corrosion or electroplating
US4820643A (en) * 1986-03-10 1989-04-11 International Business Machines Corporation Process for determining the activity of a palladium-tin catalyst
US4756923A (en) * 1986-07-28 1988-07-12 International Business Machines Corp. Method of controlling resistivity of plated metal and product formed thereby
US4882537A (en) * 1988-05-09 1989-11-21 Rohrback Cosasco Systems, Inc. Method and apparatus for reducing interference in an electrical resistance probe during electrolytic plating
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH05211384A (ja) * 1991-11-20 1993-08-20 Nec Corp 印刷配線板のめっき方法
DE19736113A1 (de) * 1997-08-21 1999-03-18 Pac Tech Gmbh Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad
US6972444B1 (en) * 2003-08-06 2005-12-06 National Semiconductor Corporation Wafer with saw street guide
FR2892595B1 (fr) * 2005-10-21 2010-11-05 Siemens Vdo Automotive Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise
US20090199141A1 (en) * 2008-02-06 2009-08-06 Anritsu Company Systems and methods for prototyping and testing electrical circuits in near real-time
US9201015B2 (en) * 2011-07-14 2015-12-01 International Business Machines Corporation Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component
CN103255398A (zh) * 2013-05-24 2013-08-21 无锡市崇安区科技创业服务中心 一种化学镀镍监测检测系统
CN105758891B (zh) * 2015-07-17 2019-03-05 生益电子股份有限公司 一种pcb的性能检测方法
US10381276B2 (en) * 2015-12-17 2019-08-13 International Business Machines Corporation Test cell for laminate and method
CN111270226A (zh) * 2020-01-15 2020-06-12 武汉光安伦光电技术有限公司 一种芯片用小型化镀装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3134690A (en) * 1960-02-09 1964-05-26 Eriksson Lars Erik Method for deposition of a copper layer on a non-conductive material
US3400014A (en) * 1964-09-15 1968-09-03 Ibm Process control of indium sheet film memories
US3936738A (en) * 1974-01-02 1976-02-03 Drexelbrook Controls, Inc. Method of and apparatus for measuring the amount of coating material applied to substrates
DE2410927C3 (de) * 1974-03-05 1978-11-16 Kollmorgen Corp., Glen Cove, N.Y. (V.St.A.) Meßsonde für Schichtdickenmessungen und Verfahren zur Messung der Schichtdicke bzw. der Abscheidungsgeschwindigkeit mittels dieser Sonde
US4019129A (en) * 1975-06-02 1977-04-19 Bell Telephone Laboratories, Incorporated Metallic plating testing apparatus
DE3034175A1 (de) * 1980-09-11 1982-04-15 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur herstellung chemisch abscheidbarer, elektrisch leitfaehiger schichten

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008104684A (ja) * 2006-10-26 2008-05-08 Matsushita Electric Ind Co Ltd 洗濯機
CN105050318A (zh) * 2015-07-06 2015-11-11 南京本川电子有限公司 具有埋阻测试区的pcb板结构及其测试方法

Also Published As

Publication number Publication date
EP0113395B1 (en) 1990-06-13
JPH0136994B2 (enExample) 1989-08-03
US4477484A (en) 1984-10-16
EP0113395A2 (en) 1984-07-18
EP0113395A3 (en) 1987-09-23
DE3381648D1 (de) 1990-07-19

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