JPS59114026A - Continuous manufacture of thermosetting resin plate - Google Patents
Continuous manufacture of thermosetting resin plateInfo
- Publication number
- JPS59114026A JPS59114026A JP22356982A JP22356982A JPS59114026A JP S59114026 A JPS59114026 A JP S59114026A JP 22356982 A JP22356982 A JP 22356982A JP 22356982 A JP22356982 A JP 22356982A JP S59114026 A JPS59114026 A JP S59114026A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- vacuum chamber
- coated
- pressure
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、内部にボイドのない熱硬化性樹脂板を連続的
に製造する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for continuously manufacturing a thermosetting resin plate without internal voids.
一般的に、熱硬化性樹脂板は、熱硬化性樹脂 1−
を基材に含浸乾燥後、1枚乃至所要枚数を重ね合せ、加
熱加圧し成形されている。しかしながら、この方法は、
樹脂を基材に含浸させるのに溶剤を用いるため取扱いに
難点があり、また多数の工程を要するという欠点があっ
た。一方、溶剤を用いないものとして、連続的に搬送さ
れる基材に、溶融状態もしくは粉末状の熱硬化性樹脂を
塗布、含浸させ、その後この1枚乃至複数枚を重ねて連
続的に加熱加圧成形する連続製造法がある。しかし、こ
の方法では、熱硬化性樹脂を塗布含浸された基材には無
数のボイドが生じており、そのボイドをな(すために成
形の際、高圧をかけかつ基材内部の樹脂を流動させる必
要があった。その流動にともない塗工基材内部の樹脂は
外にあふれ出し、そのため、板厚栽
は薄くなると同時に、反りや捻れが生じ、製造した熱硬
化性樹脂板の加工工程において、不具合いが生じていた
。また、板状体内部にボイドが残留していると、加熱工
程においてブリスターが発生し、致命的な欠点となる。Generally, a thermosetting resin plate is formed by impregnating a base material with thermosetting resin 1- and drying it, then stacking one sheet or a required number of sheets on top of each other, and heating and pressing them. However, this method
Since a solvent is used to impregnate the base material with the resin, it is difficult to handle and requires a large number of steps. On the other hand, as a method that does not use a solvent, a molten or powdered thermosetting resin is coated and impregnated on a continuously conveyed base material, and then one or more sheets are stacked and heated continuously. There is a continuous manufacturing method that involves pressure forming. However, with this method, countless voids occur in the base material coated and impregnated with thermosetting resin, and in order to eliminate these voids, high pressure is applied during molding and the resin inside the base material is fluidized. Due to the flow, the resin inside the coated base material overflowed to the outside, and as a result, the board became thinner and at the same time warped and twisted, which caused problems during the processing process of the manufactured thermosetting resin board. In addition, if voids remain inside the plate-shaped body, blisters will occur during the heating process, which will be a fatal drawback.
2−
本発明は、上記連続的に熱硬化性樹脂板を製造する方法
において、板厚精度を向上させ、かつボイドの発生を抑
えることを目的とするものである。2- The object of the present invention is to improve the plate thickness accuracy and suppress the generation of voids in the method for continuously manufacturing a thermosetting resin plate.
上記目的を達成するために本発明は、1枚乃至複数枚の
連続的した基材に溶融状態もしくは粉末状の熱硬化性樹
脂を塗布含浸させ、その後加熱された減圧室にて脱泡を
行なった後1枚乃至複数枚を重ね合せ連続的に加熱加圧
成形することを特徴とする。In order to achieve the above object, the present invention involves applying and impregnating one or more continuous base materials with a thermosetting resin in a molten state or powder form, and then defoaming the resin in a heated vacuum chamber. After that, one or more sheets are stacked and continuously heated and press-molded.
本発明に用いられる熱硬化性樹脂としては、エポキシ樹
脂、ポリエステル樹脂、ジアリルフタレート樹脂、ポリ
イミド樹脂、ポリブタジェン樹脂などがあげられるが、
室温において固型であるものが好ましい。基材としては
、ガラス布、有機繊維布、ガラスマット、無機或は有機
率
繊維率織布、糸などがあげられる。Thermosetting resins used in the present invention include epoxy resins, polyester resins, diallyl phthalate resins, polyimide resins, polybutadiene resins, etc.
Those that are solid at room temperature are preferred. Examples of the base material include glass cloth, organic fiber cloth, glass mat, inorganic or organic fiber ratio woven cloth, and thread.
熱硬化性樹脂を塗布、含浸後脱泡を行なう加熱された減
圧室において、加熱温度は40〜1700Cであり、好
ましくは80−140°Cである。このこの温度は、熱
硬化性樹脂の溶融粘度が最低点に近くになり、かつ減圧
室に10秒以上置(ことができる時間によって決定され
る。一般嬰と、熱硬化性樹脂の溶融粘度は、図面に示さ
れる様に加熱時間との関数であるため、加熱温度が、1
70°C以上であると、減圧室に置ける時間が10秒以
下となる。10秒以上とするには、硬化に要する時間を
長くする必要があり、加熱加圧成形の際生産性が悪(な
る。また、40’C以下であると、溶融粘度が高く十分
に脱泡できないか、もしくは脱泡するのに時間がかかり
、生産性が悪くなる。更に、熱硬化性樹脂の溶融粘度が
、いン
最低点になっても、減圧時間が10秒以下であ△
ると塗工基材内部が十分に脱泡されず、製造した熱硬化
性樹脂板にボイドが残留するので好ましくない。In a heated vacuum chamber in which the thermosetting resin is applied, impregnated, and then defoamed, the heating temperature is 40 to 1700C, preferably 80 to 140C. This temperature is determined by the time when the melt viscosity of the thermosetting resin is close to its lowest point, and it can be left in a vacuum chamber for 10 seconds or more.In general, the melt viscosity of the thermosetting resin is , as shown in the drawing, is a function of the heating time, so the heating temperature is 1
If the temperature is 70°C or higher, the time that the product can be placed in the decompression chamber is 10 seconds or less. If the temperature is 10 seconds or more, it is necessary to lengthen the time required for curing, which results in poor productivity during hot-pressure molding.In addition, if the temperature is 40'C or less, the melt viscosity is high and it is difficult to degas sufficiently. If the pressure reduction time is 10 seconds or less, even if the melt viscosity of the thermosetting resin reaches its lowest point, the productivity will deteriorate. This is not preferable because the interior of the coated substrate is not sufficiently defoamed and voids remain in the manufactured thermosetting resin plate.
本発明においては、熱硬化性樹脂の中に、無機、有機充
填剤が含有されていても良い。熱硬化性樹脂には、一般
に使用される硬化剤及び硬化促進剤を適宜配合する。な
お、加熱加圧成形に際して塗工基材の両面もしくは片面
に連続した銅箔を配置すれば、銅張り板を作製すること
ができる。In the present invention, an inorganic or organic filler may be contained in the thermosetting resin. The thermosetting resin is appropriately blended with commonly used curing agents and curing accelerators. Note that a copper-clad board can be produced by arranging continuous copper foil on both sides or one side of the coated base material during hot-pressure molding.
本発明の詳細な説明する。The present invention will be described in detail.
実施例
エポキシ樹脂100重量部(以下単に部といミ
う)、ジシアンシア駆ド2部、イミダゾール04部をニ
ーダ−を用いて80°Cにおいて混線を行ない、直下型
のTダイを有する押出機で連続したガラス布基材8枚を
重ねた上ζこ押出す。この構成物の両面に離型フィルム
を配置し、温度120°C1圧力20mmHgの加熱さ
れた減圧室に導き120秒間で通過させた後エンドレス
ベルトにより温度160°C1圧力s Ky / dを
かけて加熱加圧成形した。Example 100 parts by weight of epoxy resin (hereinafter simply referred to as "parts"), 2 parts of dicyanthiaide, and 0.4 parts of imidazole were mixed at 80°C using a kneader, and then mixed continuously using an extruder having a direct-type T-die. 8 sheets of glass cloth substrates were stacked and extruded. A release film was placed on both sides of this structure, and the structure was introduced into a heated vacuum chamber at a temperature of 120°C and a pressure of 20 mmHg for 120 seconds, and then heated using an endless belt at a temperature of 160°C and a pressure of s Ky/d. Pressure molded.
比較例1 0C1圧力4oKy/d(をかけて加熱加圧成形した。Comparative example 1 0C1 pressure of 40Ky/d (hot and pressure molded).
比較例2
5一
実施例にて作製した塗工基材を加熱された減圧室に通さ
ずに、エンドレスベルトにより温度+60°C1圧力5
Ky / dをかけて加熱加圧成形した。Comparative Example 2 5 The coated substrate prepared in Example 5 was heated to +60°C1 pressure 5 using an endless belt without passing it through a heated vacuum chamber.
Ky/d was applied and molded under heat and pressure.
比較例3
実施例にて作製した塗工基材を温度120°C1D
圧力mm1(Hの加熱された減圧室に5秒間通した△
後、エンドレスベルトにより温度160°C1圧力5
Kp / clをかけて加熱加圧成形した。Comparative Example 3 The coated base material prepared in Example was passed through a heated vacuum chamber at a temperature of 120°C, 1D and a pressure of mm1 (H) for 5 seconds, and then reduced to a temperature of 160°C, a pressure of 5mm using an endless belt.
Kp/cl was applied and molded under heat and pressure.
実施例及び比較例1〜3で得た熱硬化性樹脂板の特性試
験結果を第1表に示す。成形した熱硬化性樹脂板の大き
さは3 o Ox 300 IIてあり、約
反り祢れ量の測定はJIS−6481に基づいて行なっ
た。Table 1 shows the characteristics test results of the thermosetting resin plates obtained in Examples and Comparative Examples 1 to 3. The size of the molded thermosetting resin plate was 3 o Ox 300 II, and the amount of warpage was measured based on JIS-6481.
第 1 表
第1表より明らかな様に、本発明によれば板厚精度が良
(残留ボイドのない熱硬化性樹脂板が連続的Iこ能率よ
く製造でき、工業的価値は極めて大である。Table 1 As is clear from Table 1, according to the present invention, thermosetting resin plates with good plate thickness accuracy (no residual voids) can be produced continuously and efficiently, and the industrial value is extremely large. .
図面は塗工基材を加熱したときの温度及び樹脂溶融粘度
の経時変化を示す曲線図である。
特許出願人
7−The drawing is a curve diagram showing changes in temperature and resin melt viscosity over time when the coating substrate is heated. Patent applicant 7-
Claims (1)
粉末状の熱硬化性樹脂を塗布、含浸させ、その後塗工基
材の1枚乃至複数枚を重ね合せて連続的に加熱加圧成形
する方法において、熱硬化性樹脂を塗布、含浸された基
材を加熱された減圧室に導びき脱泡することを特徴とす
る熱硬化性樹脂の連続製造法。 八 2 減圧室の温度が熱硬化性樹脂を最低溶融粘にできる
温度であり、塗工基材を減圧室内にlθ秒以上置(こと
を特徴とする特許請求の範囲第1項記載の熱硬化性樹脂
板の連続製造法。[Scope of Claims] L One or more continuous base materials are coated with and impregnated with a thermosetting resin in a molten state or powdered state, and then one or more coated base materials are stacked one on top of the other to make a continuous process. 1. A method for continuous production of a thermosetting resin, characterized in that a base material coated with a thermosetting resin and impregnated with the thermosetting resin is guided into a heated vacuum chamber to be defoamed. 82. The thermosetting method according to claim 1, characterized in that the temperature of the vacuum chamber is a temperature that allows the thermosetting resin to have the lowest melting viscosity, and the coating substrate is left in the vacuum chamber for lθ seconds or more. Continuous manufacturing method for plastic plates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22356982A JPS59114026A (en) | 1982-12-20 | 1982-12-20 | Continuous manufacture of thermosetting resin plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22356982A JPS59114026A (en) | 1982-12-20 | 1982-12-20 | Continuous manufacture of thermosetting resin plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59114026A true JPS59114026A (en) | 1984-06-30 |
JPS64204B2 JPS64204B2 (en) | 1989-01-05 |
Family
ID=16800214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22356982A Granted JPS59114026A (en) | 1982-12-20 | 1982-12-20 | Continuous manufacture of thermosetting resin plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59114026A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018059091A (en) * | 2016-09-30 | 2018-04-12 | 株式会社チャレンヂ | Method for producing prepreg |
-
1982
- 1982-12-20 JP JP22356982A patent/JPS59114026A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018059091A (en) * | 2016-09-30 | 2018-04-12 | 株式会社チャレンヂ | Method for producing prepreg |
JP2022132657A (en) * | 2016-09-30 | 2022-09-08 | 株式会社チャレンヂ | Prepreg processing method and molded product manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JPS64204B2 (en) | 1989-01-05 |
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