JPS6220916B2 - - Google Patents
Info
- Publication number
- JPS6220916B2 JPS6220916B2 JP57082435A JP8243582A JPS6220916B2 JP S6220916 B2 JPS6220916 B2 JP S6220916B2 JP 57082435 A JP57082435 A JP 57082435A JP 8243582 A JP8243582 A JP 8243582A JP S6220916 B2 JPS6220916 B2 JP S6220916B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- laminate
- adhesive
- film
- chemical plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- IRLQAJPIHBZROB-UHFFFAOYSA-N buta-2,3-dienenitrile Chemical compound C=C=CC#N IRLQAJPIHBZROB-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は化学メツキ用積層板の製造方法に係
り、特にメツキ均一性、半田耐熱性、寸法安定性
に優れた化学メツキ用積層板の製造方法に関す
る。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for producing a laminate for chemical plating, and in particular a method for producing a laminate for chemical plating that has excellent plating uniformity, soldering heat resistance, and dimensional stability. Regarding.
従来複数枚の半硬化状態熱硬化性樹脂含浸基材
の表面に、離形性のプラスチツクフイルムに形成
した接着剤を重ね合わせ、加熱加圧して一体化す
る化学メツキ用積層板の製造方法が行われてい
る。この方法は積層板に接着剤を塗布乾燥した後
に加熱硬化する化学メツキ用積層板の製造方法に
較べ接着剤面の平滑性や接着剤厚さの均一性等に
優れ、また製造工程の短縮化など工業的にも有効
な方法である。
Conventionally, a method for producing chemical plating laminates has been carried out in which adhesive formed from a releasable plastic film is superimposed on the surface of multiple semi-cured thermosetting resin-impregnated substrates and integrated by heating and pressing. It is being said. Compared to the manufacturing method of chemically plated laminates, which involves applying adhesive to the laminate, drying it, and then heating and curing it, this method is superior to the smoothness of the adhesive surface and the uniformity of the adhesive thickness, and also shortens the manufacturing process. This is an industrially effective method.
しかしながら、離形用に使用されるプラスチツ
クフイルムは熱可塑性樹脂であるため加熱加圧で
融着をし、一方半硬化状態熱硬化性樹脂含浸基材
や接着剤に、その製造工程上若干の溶剤あるいは
揮発性低分子化合物が残留している。そのため従
来の積層板製造方法即ち、加熱、加圧、圧力保持
状態で冷却、圧抜き、製品取り出しという工程を
経た場合には、ガス流通面積が小さいため離形性
プラスチツクフイルムと、接着剤との間で加熱硬
化時に発生した揮発性低分子化合物による局部的
なふくれを生ずる。この様な状態の積層板を化学
メツキした場合、ふくれた箇所は無光沢メツキ、
フイルム密着箇所は光沢メツキになるなどメツキ
むらを生じ、時にはブリスターを発生することも
あり、製品不良の大きな要因となつている。 However, since the plastic film used for mold release is a thermoplastic resin, it is fused using heat and pressure. Or volatile low molecular weight compounds remain. Therefore, in the conventional laminate manufacturing method, which involves heating, pressurizing, cooling under pressure holding state, depressurization, and product removal, the gas flow area is small, so the releasable plastic film and adhesive are separated. Localized blistering occurs due to volatile low-molecular compounds generated during heat curing. When chemically plating a laminate in this condition, the swollen areas will be matte plating,
Areas where the film is in close contact cause uneven plating, such as glossy plating, and sometimes blistering, which is a major cause of product defects.
またプリント回路用基材の加工設備は、年々自
動化、大形化が進められており、それに伴ない基
材となる積層板の寸法安定性の改良要求がよいき
びしくなつている。積層板の製造には、加熱加圧
による硬化が必要不可欠である。この加熱加圧状
態で素材となる紙布の伸び応力が、硬化冷却後も
残留し樹脂の硬化収縮にも関連して複雑な内部応
力ひずみとして積層板に残留している。このよう
な状態の積層板をプリント回路用基材へ加工する
時には、加熱打抜工程、レジスト硬化工程などの
加熱工程を経るため、内部応力が緩和し、寸法収
縮という結果になり、穴あけ工程での位置づれ、
スクリーン印刷時の位置づれなどの原因となつて
いる。 Further, processing equipment for printed circuit substrates is becoming more automated and larger year by year, and as a result, demands for improving the dimensional stability of laminates serving as substrates are becoming more and more severe. Curing by heating and pressing is essential to the production of laminates. In this heated and pressurized state, the elongation stress of the paper cloth, which is the raw material, remains even after curing and cooling, and remains in the laminate as a complex internal stress strain related to curing and shrinkage of the resin. When processing a laminate in this state into a substrate for printed circuits, it goes through heating processes such as hot punching and resist hardening, which relieves internal stress and results in dimensional shrinkage, which causes problems in the drilling process. misalignment,
This causes misalignment during screen printing.
本発明はメツキ均一性、半田耐熱性、かつ寸法
安定性に優れた特性を示す化学メツキ用積層板の
製造方法を提供することを目的としている。
An object of the present invention is to provide a method for manufacturing a laminate for chemical plating that exhibits excellent properties in plating uniformity, soldering heat resistance, and dimensional stability.
本発明者らは、化学メツキ用積層板の製造にお
ける前記諸欠点を改良するために鋭意検討した結
果、一体成形後加熱状態のまま圧抜きをし、その
後に冷却する工程を経た場合、メツキ均一性、半
田耐熱性、寸法安定性に優れた化学メツキ用積層
板が得られることを見出した。
As a result of intensive studies to improve the above-mentioned drawbacks in the production of chemically plated laminates, the inventors of the present invention have found that if the pressure is removed in the heated state after integral molding, and then the process of cooling is performed, the plating will be uniform. It was discovered that a laminate for chemical plating with excellent properties, soldering heat resistance, and dimensional stability can be obtained.
即ち、本発明は複数枚の半硬化状態熱硬化性樹
樹含浸基材の表面に、離形性フイルムまたはシー
ト上に形成した接着剤層を重ね合わせ、加熱加圧
して一体に成形後、引き続き加熱状態を保持した
まま圧抜きし冷却することを特徴とする化学メツ
キ用積層板の製造方法である。 That is, in the present invention, an adhesive layer formed on a releasable film or sheet is superimposed on the surface of a plurality of semi-cured thermosetting resin-impregnated substrates, heated and pressed to form an integral body, and then This is a method for manufacturing a laminate for chemical plating, which is characterized by depressurizing and cooling while maintaining a heated state.
本発明に使用する半硬化状態、硬化性樹脂含浸
基材は、エポキシ樹脂、フエノール樹脂、メラミ
ン樹脂等を積層板用基材である紙、ガラスクロス
等に含浸乾燥半硬化状態としたものである。又本
発明に用いる接着剤はブタジエンニトリルラバ
ー、キシレン樹脂、エポキシ樹脂、硫黄及びジシ
アンジアミド、更に微粉末の酸化ケイ素を添加し
たもの等が使用される。又、離形用フイルムまた
はシートは一般に使用されているものが使用でき
る。 The semi-cured, curable resin-impregnated base material used in the present invention is obtained by impregnating epoxy resin, phenol resin, melamine resin, etc. into paper, glass cloth, etc., which is the base material for the laminate, and drying and semi-curing it. . The adhesive used in the present invention includes butadiene nitrile rubber, xylene resin, epoxy resin, sulfur and dicyandiamide, and those to which finely powdered silicon oxide is added. Furthermore, any commonly used release film or sheet can be used.
本発明の方法によれば、含浸基材や接着剤中に
残存する若干の溶剤や揮発性低分子化合物が揮散
するために部分的なふくれが解消され、メツキ均
一性、半田耐熱性に優れていた。又、圧抜状態で
冷却するため、内部応力の発生がなく寸法安定性
の優れたものであるため穴あけ等の位置づれが全
くなくなつた。
According to the method of the present invention, some of the solvent and volatile low-molecular compounds remaining in the impregnated base material and adhesive are evaporated, so that partial blistering is eliminated, resulting in excellent plating uniformity and soldering heat resistance. Ta. In addition, since it is cooled in a depressurized state, no internal stress is generated and the dimensional stability is excellent, so there is no need for positional deviation due to drilling or the like.
次に本発明の実施例を示す。以下部とあるのは
重量部を意味する。
Next, examples of the present invention will be shown. The following parts refer to parts by weight.
実施例 １
ブダジエンニトリルラバー50部、キシレン樹脂
20部、エポキシ樹脂30部、ジシアンジアミド1.2
部、加硫剤２部、微粉末酸化ケイ素20部をメチル
エチルケトン・トルエンの混合溶剤に溶解分散し
て接着剤溶液を調製した。この接着剤溶液を厚さ
50μｍのポリプロピレンフイルムに塗布し、115
℃で10分間乾燥し接着剤層厚さ50μｍの接着剤付
フイルムを作成した。次いで紙基材にエポキシ樹
脂を含浸したプリプレグを６枚重ね、この上下面
に前記接着剤付フイルムをフイルムが外側になる
ように重ね合わせ150℃，50Kg／cm2で90分間加熱
加圧した。次いで加熱状態のまま圧力を抜き０
Kg／cm2とし５分間保持した後冷却を行い温度が30
℃以下になつてから成形機から取り出した。得ら
れた積層板は上下面のフイルムが剥離状態になつ
ており、接着剤表面は平滑均一な塗膜を形成して
いた。この積層板を50℃のクロム酸溶液（無水ク
ロム酸75ｇ、濃硫酸300ml、水700mlからなる）中
に７分間浸漬し、親水化後活性化処理および化学
メツキ処理を順次施して、厚さ約0.5μｍの全面
均一な無光沢状態の銅メツキ層を設け、引き続き
電気メツキを施し、厚さ35μｍのメツキ層を形成
させた。このメツキ表面は均一な光沢を呈し、外
観異常は全く見られなかつた。又このメツキ付積
層板をJIS Ｃ−6481印刷回路用銅張積層板試験法
に準じて測定したところ、引きはがし強さ2.0
Kg／cm、半田耐熱性90秒以上であつた。また130
℃で１時間加熱後の寸法収縮は紙の繊維方向に対
して0.01％繊維の直角方向に対して0.05％であつ
た。Example 1 50 parts of Budadiene nitrile rubber, xylene resin
20 parts, epoxy resin 30 parts, dicyandiamide 1.2
An adhesive solution was prepared by dissolving and dispersing 1 part, 2 parts of a vulcanizing agent, and 20 parts of finely powdered silicon oxide in a mixed solvent of methyl ethyl ketone and toluene. Thicken this adhesive solution
Coated on 50 μm polypropylene film, 115
It was dried at ℃ for 10 minutes to produce an adhesive film with an adhesive layer thickness of 50 μm. Next, six sheets of prepreg impregnated with epoxy resin were stacked on the paper base material, and the adhesive-coated film was stacked on the upper and lower surfaces of the prepreg with the film facing outward, and heated and pressed at 150° C. and 50 kg/cm 2 for 90 minutes. Next, release the pressure while still heating it to 0.
Kg/cm 2 and held for 5 minutes, then cooled to a temperature of 30
It was taken out from the molding machine after the temperature was below ℃. The films on the upper and lower surfaces of the obtained laminate were peeled off, and a smooth and uniform coating was formed on the adhesive surface. This laminate was immersed in a chromic acid solution (consisting of 75 g of chromic anhydride, 300 ml of concentrated sulfuric acid, and 700 ml of water) at 50°C for 7 minutes, and after making it hydrophilic, it was sequentially subjected to activation treatment and chemical plating treatment. A 0.5 μm thick matte copper plating layer was provided over the entire surface, and electroplating was subsequently applied to form a 35 μm thick plating layer. This plating surface exhibited a uniform gloss and no appearance abnormality was observed. In addition, when this plated laminate was measured according to JIS C-6481 Test method for copper-clad laminates for printed circuits, the peel strength was 2.0.
Kg/cm, and soldering heat resistance was 90 seconds or more. 130 again
The dimensional shrinkage after heating for 1 hour at .degree. C. was 0.01% with respect to the fiber direction of the paper and 0.05% with respect to the perpendicular direction of the fibers.
実施例 ２
紙基材にフエノール樹脂を含浸したプリプレグ
を６枚重ね合わせ、実施例１で用いた接着剤付フ
イルムを重ね合わせ、170℃，150Kg／cm2で75分間
加熱加圧した。次いで加熱状態のまま圧力を抜き
０Kg／cm2とし、５分間保持した後冷却を行い、温
度が30℃以下になつてから成形機から取り出し
た。得られた積層板は上下面のフイルムが剥離状
態になつており、接着剤表面は平滑均一な塗膜を
形成していた。この積層板を実施例１と同様に化
学メツキ処理したところ全面的均一な無光沢メツ
キが得られた。さらに化学メツキで厚さ35μｍの
銅箔層を形成させたが外観異常は全く見られず均
一な光沢メツキとなつた。実施例１と同様引きは
がし強さ、半田耐熱性を測定したところ、2.0
Kg／cm，85秒であつた。また130℃１時間加熱後
の寸法収縮は紙の繊維方向に対し0.04％、繊維の
直角方向に対して0.07％であつた。Example 2 Six sheets of prepreg impregnated with phenol resin were stacked on a paper base material, and the adhesive film used in Example 1 was stacked on top of the paper base material, and heated and pressed at 170° C. and 150 kg/cm 2 for 75 minutes. Next, the pressure was released to 0 kg/cm 2 while still in the heated state, and after holding for 5 minutes, cooling was performed, and when the temperature became 30° C. or lower, it was taken out from the molding machine. The films on the upper and lower surfaces of the obtained laminate were peeled off, and a smooth and uniform coating was formed on the adhesive surface. When this laminate was chemically plated in the same manner as in Example 1, uniform matte plating was obtained over the entire surface. Furthermore, a 35 μm thick copper foil layer was formed by chemical plating, but no abnormalities were observed in the appearance and the result was a uniform, glossy plating. Peel strength and soldering heat resistance were measured in the same manner as in Example 1, and the result was 2.0.
Kg/cm, 85 seconds. Further, the dimensional shrinkage after heating at 130° C. for 1 hour was 0.04% in the fiber direction of the paper and 0.07% in the direction perpendicular to the fibers.
比較例 １
実施例１で用いた接着剤付フイルムとプリプレ
グを用いて150℃，50Kg／cm2で90分間加熱加圧
し、圧力を保持した状態で冷却を行い温度が30℃
以下になつてから圧抜きをし成形機から取り出し
た。得られた積層板は上下面のフイルムが部分的
に密着状態と剥離状態になつており、接着剤表面
はフイルムとの密着箇所は光沢があり、剥離箇所
は無光沢な状態であつた。この積層板を実施例１
と同様に化学メツキを施したところ、フイルムと
の密着箇所は化学メツキ、フイルムとの剥離箇所
は無光沢メツキとなり、メツキむらを生じた。次
いで化学メツキにより35μｍの銅箔厚さを形成さ
せたところ、化学メツキで光沢を示した箇所は表
面にザラつきを生じた。またJIS Ｃ−6481に準じ
て引きはがし強さを測定したところ、化学メツキ
で無光沢メツキとなつた箇所は2.0Kg／cmであつ
たが光沢メツキとなつた箇所は化学メツキ層と電
気メツキ層で剥離し測定が不可能であつた。ま
た、化学メツキで光沢となつた箇所の半田耐熱性
は20秒〜60秒とばらつきが広くなり特性値も低下
した。10℃１時間加熱後の寸法収縮は紙の繊維方
向に対して0.09％繊維の直角方向に対して0.14％
であつた。Comparative Example 1 The adhesive film and prepreg used in Example 1 were heated and pressurized at 150℃ and 50Kg/ cm2 for 90 minutes, then cooled while maintaining the pressure until the temperature reached 30℃.
After the temperature reached the following, the pressure was released and the molding machine was taken out. In the obtained laminate, the films on the upper and lower surfaces were partially adhered and peeled off, and the adhesive surface was glossy where it was in close contact with the film, and matte where it was peeled off. Example 1 of this laminate
When chemical plating was applied in the same manner as above, the areas in close contact with the film were chemically plated, and the areas separated from the film were matte plating, resulting in uneven plating. Next, when a copper foil with a thickness of 35 μm was formed by chemical plating, the surface became rough in the areas where the chemical plating gave gloss. In addition, when the peel strength was measured according to JIS C-6481, it was 2.0 Kg/cm in the areas where chemical plating changed to matte plating, but the peel strength in areas where gloss plating changed to chemical plating layer and electroplating layer. It peeled off and measurement was impossible. In addition, the solder heat resistance of the parts that were made glossy by chemical plating varied widely, ranging from 20 seconds to 60 seconds, and the characteristic values also decreased. Dimensional shrinkage after heating at 10°C for 1 hour is 0.09% in the direction of the paper fibers and 0.14% in the direction perpendicular to the fibers.
It was hot.
Claims (1)
表面に、離形性フイルムまたはシート上に形成し
た接着剤層を重ね合わせ、加熱加圧して一体に成
形後、手き続き加熱状態を保持したまま圧抜きし
冷却することを特徴とする化学メツキ用積層板の
製造方法。1. An adhesive layer formed on a release film or sheet is superimposed on the surface of a plurality of semi-cured thermosetting resin-impregnated substrates, heated and pressed to form an integral body, and then heated continuously. A method for manufacturing a laminate for chemical plating, characterized by depressurizing and cooling while holding it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57082435A JPS58199151A (en) | 1982-05-18 | 1982-05-18 | Manufacture of laminated board for chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57082435A JPS58199151A (en) | 1982-05-18 | 1982-05-18 | Manufacture of laminated board for chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58199151A JPS58199151A (en) | 1983-11-19 |
| JPS6220916B2 true JPS6220916B2 (en) | 1987-05-09 |
Family
ID=13774474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57082435A Granted JPS58199151A (en) | 1982-05-18 | 1982-05-18 | Manufacture of laminated board for chemical plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58199151A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6228245A (en) * | 1985-07-30 | 1987-02-06 | 新神戸電機株式会社 | Manufacture of laminated board |
| US6375788B1 (en) * | 1996-07-16 | 2002-04-23 | Premark Rwp Holdings, Inc. | Method of coating melamine resin on laminating paper |
| DE10046877A1 (en) * | 2000-09-22 | 2002-04-11 | Basell Polypropylen Gmbh | Layered composite material with different resin layers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50139171A (en) * | 1974-04-25 | 1975-11-06 |
-
1982
- 1982-05-18 JP JP57082435A patent/JPS58199151A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50139171A (en) * | 1974-04-25 | 1975-11-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58199151A (en) | 1983-11-19 |
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