JPH09248876A - Prepreg for manufacturing metal foil plated laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the defective molding such as the uneven sheet thickness and the generation of thin spots on the ends of a product, measlings and voids by applying power to metal foils laminated on prepregs composed of epoxy resin of specified reaction rate constant impregnated with a glass cloth base. SOLUTION: Prepregs 1 having the reaction rate constant of 0.10-0.30 are formed by impregnating a glass cloth base with epoxy resin varnish and drying the base. Then two prepregs 1 are overlapped respectively on both sides of inner layer circuit plates 3 with copper foil inner layer circuits 3a on both side of an epoxy resin laminate, and the overlapped material is inserted into between two continuous metal foils 2 to manufacture an combined material of laminated structure, and the metal foils 2 are folded and the combined material 4 is laminated in multi-stages. The material thus formed is set between pressurizing plates 6, and a power source 7 is connected with the metal foils 2, and power is applied to the metal foils 2 while being pressurized by the pressurizing plates 6 in a vacuum chamber to generate heat, and heat and pressure molding is carried out to manufacture a multi-layer copper plated laminate.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a prepreg used for manufacturing a metal foil-clad laminate.

[0002]

2. Description of the Related Art A metal foil-clad laminate used as a printed wiring board is prepared by stacking a plurality of prepregs on one or both outer surfaces of which a metal foil such as a copper foil is heated and pressed. It is manufactured by laminating. In the case of a multilayer printed wiring board, a prepreg is laminated on one side or both sides of the inner layer circuit board, a metal foil is further laminated on the outside of the prepreg, and the foil is manufactured by heating and pressurizing and laminating. And in performing the lamination molding as described above, the combination material in which the above prepreg and the metal foil are stacked, or the combination material in which the inner layer circuit board, the prepreg and the metal foil are stacked, are stacked in multiple stages,
This is generally set by a so-called multi-stage hot press, which is set between hot plates and pressed.

However, in a multi-stage hot press using such a heating plate, the heating temperature differs between the combination material close to the heating plate and the combination material far from the heating plate, which is obtained because of uneven heating temperature. The quality of the metal foil clad laminate may vary. Therefore, in the multi-stage hot press, the number of stages of the combination material that can be stacked is limited.

Therefore, a method of heating the metal foil by connecting a power source to the metal foil and energizing the metal foil to heat the metal foil is provided in Japanese Patent Publication No. 7-508940. FIG. 1 and FIG. 2 each show an example thereof, in which two long metal foils 2 are used, and a plurality of prepregs 1 or prepregs 1 and an inner layer circuit are provided between the two metal foils 2. By sandwiching the stacked plates 3, a combination material 4 composed of the prepreg 1 and the upper and lower metal foils 2, or the prepreg 1 and the inner circuit board 3
A combination material 4 including the upper and lower metal foils 2 is formed.
The metal foils 2 are bent in a meandering shape while forming a plurality of sets of the combination materials 4 in the longitudinal direction of the metal foils 2, and the plurality of combination materials 4 are stacked in multiple stages via the insulating mirror surface plate 5. When this is set between the pressure plates 6 and the power source 7 is connected to the metal foil 2 and the metal foil 2 is energized while cold pressing with the pressure plate 6, the metal foil 2 generates heat due to Joule heat, With this heat generation, each combination material 4 can be heated to perform molding.

According to this method, since the prepreg 1 of each combination material 4 can be directly heated by using the metal foil 2 as a heat source, the prepregs 1 of each combination material 4 stacked in multiple stages can be uniformly heated. Therefore, the metal foil-clad laminate can be obtained by multistage molding without variation in quality.

[0006]

As described above, in the conventional method using multi-stage hot pressing, the heating temperature of the prepreg of each combined material becomes non-uniform, so that the defect occurrence rate is small with respect to the non-uniform heating temperature. A prepreg designed to be used is used. However, in the method of heating by energizing the metal foil to generate heat, the heating temperature for the prepreg of each combined material becomes uniform, so using the prepreg that has been conventionally used as it is does not provide sufficient performance. No metal foil-clad laminate can be obtained. For example, if a prepreg with a slow reaction speed of the impregnated resin is used, the flow of the resin becomes large and the thickness of the product between the center and the end of the product may vary, and the product end may have scrapes or measling. There is a possibility that molding defects may occur, and in order to reduce the flow of such resin, if the melt viscosity of the resin is increased,
Contrary to this, on the contrary, defects such as impregnation during molding and insufficient resin flow are likely to cause scrapes and voids, and in either case, sufficient performance as a laminate of a printed wiring board cannot be obtained.

The present invention has been made in view of the above points, and it is possible to generate heat by energizing a metal foil without causing problems such as variations in plate thickness and defective molding such as scraping, measling, and voids at the end of the product. It is an object of the present invention to provide a prepreg capable of producing a metal foil-clad laminate by a heating method.

[0008]

A prepreg for producing a metal foil-clad laminate according to the present invention according to claim 1 produces a laminate by energizing a metal foil laminated on the prepreg to generate heat in the metal foil. In the prepreg used for that purpose, the reaction rate constant of the epoxy resin with which the glass cloth base material is impregnated is 0.10 to 0.30.

In the first aspect of the invention, it is preferable that the reaction rate constant of the epoxy resin is 0.15 to 0.25. A prepreg for producing a metal foil-clad laminate according to the present invention of claim 3 is a prepreg used for producing a laminate by energizing a metal foil laminated on the prepreg to heat the metal foil. The epoxy resin impregnated in the glass cloth substrate has a reaction rate constant of 0.10 to 0.30 and a melt viscosity at 130 ° C. of 1500 to 50,000 poises. .

In the invention of claim 3, the epoxy resin impregnated in the glass cloth substrate has a reaction rate constant of 0.10 to 0.30 and a melt viscosity at 130 ° C. of 4000 to 10,000 poise. Is preferred.
Further, in the invention of claim 3 above, the epoxy resin with which the glass cloth base material is impregnated has a reaction rate constant of 0.15 to 0.15.
0.25 and a melt viscosity at 130 ° C. of 1500
It is preferably -50000 poise.

In the invention of claim 3, the epoxy resin impregnated in the glass cloth substrate has a reaction rate constant of 0.15 to 0.25 and a melt viscosity at 130 ° C. of 4000 to 10000. Poise is preferred.

[0012]

Embodiments of the present invention will be described below. The prepreg according to the present invention is obtained by impregnating a glass cloth base material made of a woven or non-woven cloth of glass fibers with an epoxy resin varnish and drying the glass cloth base material to obtain B
It is prepared as containing a semi-cured epoxy resin in a stage state. The prepreg is preferably impregnated with an epoxy resin so that the resin content is in the range of 40 to 70% by weight.

In the invention of claim 1, the reaction rate is adjusted so that the epoxy resin in the B-stage state contained in the glass cloth substrate has a reaction rate constant in the range of 0.10 to 0.30. It uses the prepreg. The reaction rate is particularly 0.15 to 0.2 within this range.
A range of 5 is preferred. If the reaction rate constant of the epoxy resin in the prepreg is less than 0.10 (0.15), the flow of the resin during molding becomes too large, and there are molding defects such as variations in plate thickness, scrapes at the end of the product, and measling. It may occur. Conversely, when the reaction rate constant of the epoxy resin in the prepreg exceeds 0.30 (0.25), the resin flow during molding is poor and voids occur between the surface of the inner circuit board and the insulating layer of the prepreg. May occur. The reaction rate constant can be adjusted by any conventionally known method. For example, the reaction rate constant can be adjusted by adjusting the amount of the curing agent or curing accelerator compounded in the epoxy resin.

In the present invention, the reaction rate constant was measured as follows. First, about 2 g of resin powder separated from the glass cloth base material is pressed by rubbing and crushing the prepreg to form a cylindrical pipette, and the temperature is set to 130 by using a high-performance flow tester “CFT-100” manufactured by Shimadzu Corporation.
C, 0.5 mmφ × 1.0 mm nozzle, pressure 3-40
The melt viscosity of the resin pipetted under the condition of kg / cm ² was measured for 10 minutes. And 3 minutes after the start of measurement, 3.5
Minutes and 4 minutes later, the respective melt viscosities were calculated to calculate the arithmetic mean value (denoted as η ₃ ), and 6 minutes, 6.5 minutes, and 7 minutes after the start of measurement The viscosity was calculated and the arithmetic mean value was calculated (this is referred to as η ₆ ), and the reaction rate constant was calculated by the following calculation formula.

Reaction rate constant = (log η ₆ −log η ₃ ) / 3 In the invention of claim 3, the epoxy resin in the B-stage state contained in the glass cloth substrate has a reaction rate constant of 0.10. ~ 0.30 range, and 130 ℃
The prepreg is adjusted to have a melt viscosity in the range of 1500 to 50000 poise. Although it is possible to solve the problems of variation in plate thickness and defective molding only by limiting the reaction rate as in the invention of claim 1,
By controlling the melt viscosity at the same time as the above-mentioned regulation of the reaction rate, it is possible to more reliably solve the problems of variation in plate thickness and defective molding. The reaction rate is particularly preferably in the range of 0.15 to 0.25, and the melt viscosity is particularly 40 in the above range.
The range of 00 to 10,000 poise is preferable. That is,
The reaction rate constant is 0.10 to 0.30, and 130
When the melt viscosity at ℃ is 4000-10000 poise,
Alternatively, it is preferable that the reaction rate constant is 0.15 to 0.25 and the melt viscosity at 130 ° C. is 1500 to 50,000 poise.
0.25 and a melt viscosity at 130 ° C. of 4000
Most preferred is from 1 to 10,000 poise.

When the reaction rate constant of the epoxy resin in the prepreg is less than 0.10 (0.15) and the melt viscosity at 130 ° C. is less than 1500 (4000) poise, the resin flow during molding becomes large. Excessively, there is a risk of variations in plate thickness, defective molding such as scraping at the end of the product, and measling. Conversely, the reaction rate constant of the epoxy resin in the prepreg exceeds 0.30 (0.25) and 130 ℃
If the melt viscosity in (1) exceeds 50,000 (10000) poise, the resin flow during molding is poor, and voids may occur between the surface of the inner layer circuit board and the insulating layer formed by the prepreg. The melt viscosity can be adjusted by any conventionally known method, for example, by adjusting the heating and drying conditions after impregnating the glass cloth substrate with the epoxy resin varnish.

In the present invention, the melt viscosity is measured by rubbing and unraveling a prepreg to press about 2 g of resin powder separated from the glass cloth base material into a cylindrical pipette, which is manufactured by Shimadzu Corporation. "CFT-1
00 ”using a nozzle of 0.5 mmφ × 1.0 mm and a pressure of 3 to 40 kg / cm ² at a temperature of 13
This was done by measuring the melt viscosity of the resin in the pipette at 0 ° C.

Thus, a metal foil-clad laminate can be manufactured by the method shown in FIGS. 1 and 2 using the prepreg adjusted to the above reaction rate constant and melt viscosity. That is, two long metal foils 2 such as copper foil are used,
By sandwiching a plurality of prepregs 1 superposed between the two metal foils 2, a combined material 4 composed of the prepreg 1 and the upper and lower metal foils 2 is formed. The metal foils 2 are bent in a meandering shape while forming a plurality of sets in the longitudinal direction, and a plurality of combination materials 4 are stacked in multiple stages with an insulating mirror surface plate 5 interposed therebetween (FIG. 1).
Alternatively, by sandwiching a stack of the prepreg 1 and the inner layer circuit board 3 between two metal foils 2, a combination material 4 composed of the prepreg 1, the inner layer circuit board 3 and the upper and lower metal foils 2 is formed, and this combination is formed. The metal foils 2 are bent in a meandering shape while forming a plurality of sets of the materials 4 in the longitudinal direction of the metal foils 2, and the plurality of combination materials 4 are stacked in multiple stages via the insulating mirror surface plate 5 (FIG. 2). Then, this is set between the pressure plates 6 and the power source 7 is connected to each of the two metal foils 2, and the metal foils 2 are cold pressed by the pressure plates 6.
Turn on electricity. When the metal foil 2 is energized in this way, the metal foil 2
Since the heat is generated by Joule heat, the heat generation can heat each combination material 4 to perform molding.

Here, when the metal foil 2 is energized at the time of forming, the heating rate is 3 to 8 ° C./min, and the maximum heating temperature is 170.
It is preferable to control the temperature to 185 ° C.
The pressure applied by the pressure plate 6 is 3 to 10 kg / cm ^2.
Is preferably set in the range. By performing the above-mentioned molding under a reduced pressure condition in a vacuum chamber, molding of voidless is further facilitated.

As described above, since the metal foil 2 is heated by energizing the metal foil 2 to generate heat at the time of molding as described above, the prepreg 1 of each combination material 4 can be directly heated by using the metal foil 2 as a heat source. The prepreg 1 of each of the stacked combination materials 4 can be uniformly heated, and the metal foil-clad laminate can be molded without variations in quality. The reaction rate constant of the impregnated epoxy resin for prepreg 1 is 0.10 to 0.3.
0, or because the reaction rate constant of the epoxy resin is in the range of 0.10 to 0.30 and the melt viscosity at 130 ° C. is in the range of 1500 to 50,000 poises,
The flow of the resin at the time of molding is optimized, and the metal foil-clad laminate can be molded without problems such as variations in plate thickness, defective edges of products, measling, voids, and other molding defects.

[0021]

EXAMPLES Next, the present invention will be specifically described with reference to examples. (Preparation of Epoxy Resin Varnish) The respective components were mixed in the compounding amounts of A to F in Table 1 and dissolved in methyl ethyl ketone to prepare an epoxy resin varnish having a concentration of 60% by weight.

[0022]

[Table 1]

(Example 1) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish having a composition of "A" so that the resin content is 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 260 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.10 and 130 ° C. of 1500 poise and a thickness of 0.10 mm was obtained.

Next, the inner layer circuit 3 was formed with copper foil having a thickness of 70 μm on both surfaces of the epoxy resin laminate having a thickness of 1.10 mm.
Two prepregs 1 are stacked on each side of the inner-layer circuit board 3 prepared by providing a and sandwiched between two long metal foils 2 formed of a copper foil having a thickness of 18 μm. The combination material 4 having a laminated structure as in a) is prepared. Then, the metal foil 2 is bent and the combination material 4 is stacked in multiple stages via the mirror plate 5, and the combination material 4 is set between the pressure plates 6 as shown in FIG. 2 and the power supply 7 is connected to the metal foil 2. .

After that, in the chamber evacuated to 100 torr or less, 10 kg / cm is applied by the pressure plate 6.
While pressurizing at a ^second constant pressure conditions, by heating by energizing the metal foil 2, 60 minutes, and heated pressure molding,
A multilayer copper clad laminate having a thickness of 1.6 mm and a size of 340 mm × 510 mm was manufactured. Here, the electric current to the metal foil 2 is
The heat generation temperature of the metal foil 2 is 5 ° C / m in the range of 20 to 80 ° C.
The temperature rise rate is in, and the range from 80 ° C to 180 ° C is 6 ° C.
The temperature was increased to / min and the temperature was kept at 180 ° C for about 25 minutes. The depressurization in the chamber and the pressurization by the pressure plate 6 were started at the same time when the heating by the energization of the metal foil 2 was started and ended at the same time when the heating was completed.

(Example 2) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish having a composition of “A” so that the resin content is 50 to 52% by weight, and dried for 300 seconds in a dryer at a temperature of 170 ° C. to obtain a reaction rate constant. A prepreg 1 having a thickness of 0.10 mm and a melt viscosity of 4000 poises at 0.10 and 130 ° C. was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Example 3) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish having a composition of "A" so that the resin content is 50 to 52% by weight, and dried for 350 seconds in a dryer at a temperature of 170 ° C. to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.10 and 130 ° C. of 10,000 poise and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 4) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish having a composition of "A" so that the resin content is 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C for 360 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity of 50,000 poises at 0.10 and 130 ° C. and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 5) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish of the composition of "B" so that the resin content is 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C for 240 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.15 and 130 ° C. of 1500 poise and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

Example 6 WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish of “B” so as to have a resin content of 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 260 seconds to obtain a reaction rate constant. A prepreg 1 having a thickness of 0.10 mm and a melt viscosity of 4000 poise at 0.15 and 130 ° C. was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Example 7) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish of “B” so as to have a resin content of 50 to 52% by weight and dried in a dryer at a temperature of 170 ° C. for 280 seconds to obtain a reaction rate constant. A prepreg 1 having a thickness of 0.10 mm and a melt viscosity at 0.15 and 130 ° C. of 10,000 poise was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 8) WEA116E manufactured by Nitto Boseki Co., Ltd.
Type glass cloth substrate is impregnated with the epoxy resin varnish of “B” so that the resin content is 50 to 52 wt%, and is dried in a dryer at a temperature of 170 ° C. for 300 seconds to obtain a reaction rate constant. A prepreg 1 having a thickness of 0.10 mm and a melt viscosity of 50,000 poises at 0.15 and 130 ° C. was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 9) WEA116E manufactured by Nitto Boseki Co., Ltd.
Type glass cloth substrate was impregnated with epoxy resin varnish of “C” so that the resin content was 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 120 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.25 and 130 ° C. of 1500 poise and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Example 10) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth base material was impregnated with epoxy resin varnish of “C” so that the resin content was 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C. for 150 seconds to obtain a reaction rate constant. Was obtained, and a prepreg 1 having a melt viscosity at 130 ° C. of 0.25 and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Embodiment 11) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth base material was impregnated with epoxy resin varnish of “C” so that the resin content was 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 155 seconds to give a reaction rate constant. Was obtained, and a prepreg 1 having a melt viscosity of 4000 poise at 130 ° C. of 0.25 and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Example 12) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth base material was impregnated with an epoxy resin varnish of “C” so that the resin content was 50 to 52% by weight, and dried for 170 seconds in a dryer at a temperature of 170 ° C. to obtain a reaction rate constant. Of 0.25 and a melt viscosity at 130 ° C. of 10,000 poise, and a prepreg 1 having a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 13) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth substrate was impregnated with epoxy resin varnish of “C” so that the resin content became 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C. for 180 seconds to obtain a reaction rate constant. Of 0.25 and a melt viscosity at 130 ° C. of 50,000 poise, and a prepreg 1 having a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 14) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with an epoxy resin varnish of “C” so that the resin content was 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 120 seconds to obtain a reaction rate constant. Of 0.25 and a melt viscosity at 130 ° C. of 1500 poise, and a prepreg 1 having a thickness of 0.20 mm was obtained.

Example 1 was repeated except that the prepreg 1 was laminated on both sides of the inner layer circuit board 3 one by one to form a laminated material 4 having a laminated constitution as shown in FIG. 3B.
Stacked and molded in the same way as the, thickness 1.6mm, size 34
A 0 mm × 510 mm multilayer copper clad laminate was produced. (Example 15) A WEA116E type glass cloth base material manufactured by Nitto Boseki Co., Ltd. was impregnated with an epoxy resin varnish containing "D" so that the resin content was 50 to 52% by weight, and the temperature was 17
By drying in a dryer at 0 ° C for 100 seconds, the reaction rate constant was 0.30 and the melt viscosity at 130 ° C was 1500.
A prepreg 1 having a poise thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 mm × 510 m.
m multi-layer copper clad laminate was produced.

(Example 16) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth substrate was impregnated with epoxy resin varnish of “D” so as to have a resin content of 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 110 seconds to obtain a reaction rate constant. Of 0.30, the melt viscosity at 130 ° C. was 4000 poise, and a prepreg 1 having a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Example 17) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth substrate was impregnated with epoxy resin varnish of “D” so as to have a resin content of 50 to 52% by weight and dried in a dryer at a temperature of 170 ° C. for 120 seconds to obtain a reaction rate constant. Of 0.30 and a melt viscosity at 130 ° C. of 10000 poise and a thickness of 0.10 mm were obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Example 18) WEA116 manufactured by Nitto Boseki Co., Ltd.
E type glass cloth base material was impregnated with the epoxy resin varnish of “D” so as to have a resin content of 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C. for 130 seconds to obtain a reaction rate constant. Of 0.30 and a melt viscosity at 130 ° C. of 50,000 poises, and a prepreg 1 having a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

(Comparative Example 1) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish of “E” so that the resin content is 50 to 52% by weight, and is dried in a dryer at a temperature of 170 ° C. for 300 seconds to obtain a reaction rate constant. Prepreg 1 with a melt viscosity of 500 poise at 0.06 and 130 ° C and a thickness of 0.10 mm
I got Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 mm.
A multilayer copper clad laminate having a size of 510 mm was manufactured.

(Comparative Example 2) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish having a composition of "E" so that the resin content is 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C for 320 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity of 1,500 poises at 0.06 and 130 ° C. and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm multilayer copper clad laminate was produced.

(Comparative Example 3) WEA116E manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish having a composition of “E” so that the resin content is 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 440 seconds to obtain a reaction rate constant. A prepreg 1 having a thickness of 0.10 mm and a melt viscosity at 0.06 and 130 ° C. of 60,000 poise was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

Comparative Example 4 WEA116E manufactured by Nitto Boseki Co., Ltd.
Type glass cloth base material is impregnated with epoxy resin varnish of “F” so as to have a resin content of 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C. for 50 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity of 500 poises at 0.35 and 130 ° C. and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 mm ×
A 510 mm multilayer copper clad laminate was produced.

(Comparative Example 5) WEA116E manufactured by Nitto Boseki Co., Ltd.
Type glass cloth base material is impregnated with epoxy resin varnish of “F” so that the resin content is 50 to 52% by weight, and dried by a dryer at a temperature of 170 ° C. for 60 seconds to obtain a reaction rate constant. Prepreg 1 with a melt viscosity of 1500 poise at 0.35 and 130 ° C and a thickness of 0.10 mm 1.
I got Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1, and the thickness is 1.6 mm and the size is 340 mm.
A multilayer copper clad laminate having a size of 510 mm was manufactured.

Comparative Example 6 WEA116E manufactured by Nitto Boseki Co., Ltd.
Type glass cloth base material is impregnated with epoxy resin varnish of “F” so that the resin content is 50 to 52 wt%, and is dried in a dryer at a temperature of 170 ° C. for 100 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.35 and 130 ° C. of 60,000 poise and a thickness of 0.10 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 1 to obtain a thickness of 1.6 mm and a size of 340 mm.
A multilayer copper clad laminate having a size of mm × 510 mm was manufactured.

With respect to the copper-clad laminates produced in the above Examples 1 to 18 and Comparative Examples 1 to 6, the standard deviation of the plate thickness was measured and the appearance after etching was inspected. The standard deviation of the plate thickness was measured by measuring the plate thickness at a total of 9 places, using a micrometer, for each of 10 samples obtained by etching the copper foil on both sides of the copper-clad laminate, based on this measurement result. This was done by determining the standard deviation (σ).

In addition, the appearance after etching was examined by etching the copper foil on both sides of a copper-clad laminate having a size of 340 mm × 510 mm, and then measuring the edges of the peripheral width of 20 cm.
This is performed by checking the presence or absence of scraping and measling with respect to the central portion other than this end portion, and further confirming the presence or absence of a void between the portion of the inner layer circuit 3a of the inner layer circuit board 3 and the insulating layer of the prepreg 1. Done by.

The results are shown in Tables 2 to 6.

[0052]

[Table 2]

[0053]

[Table 3]

[0054]

[Table 4]

[0055]

[Table 5]

[0056]

[Table 6]

(Example 19) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with the epoxy resin varnish of "A" so that the resin content was 40 to 42% by weight, and dried in a dryer at a temperature of 170 ° C for 260 seconds to obtain a reaction rate constant. Of 0.10 and a melt viscosity at 130 ° C. of 1500 poise, and a prepreg 1 having a thickness of 0.20 mm was obtained.

Next, eight pieces of this prepreg 1 were stacked and sandwiched between two long metal foils 2 formed of a copper foil having a thickness of 18 μm, and a combination material having a laminated structure as shown in FIG. I tried to make 4. Then, the metal foil 2 is bent and the combination material 4 is stacked in multiple stages via the mirror surface plate 5, and is set between the pressure plates 6 as shown in FIG. 1, and the power source 7 is connected to the metal foil 2. .

After that, heat and pressure molding was performed under the same conditions as in Example 1 to produce a double-sided copper-clad laminate having a thickness of 1.6 mm and a size of 340 mm × 510 mm. (Example 20) A WEA7628 type glass cloth substrate manufactured by Nitto Boseki Co., Ltd. was impregnated with an epoxy resin varnish containing "A" so that the resin content was 40 to 42% by weight, and the temperature was 17
By drying in a dryer at 0 ° C for 360 seconds, the reaction rate constant was 0.10 and the melt viscosity at 130 ° C was 5000.
A prepreg 1 having 0 poise and a thickness of 0.20 mm was obtained.
Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 19, and the thickness is 1.6 mm and the size is 340 mm × 51.
A 0 mm double sided copper clad laminate was produced.

(Example 21) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with the epoxy resin varnish of "D" so that the resin content was 40 to 42% by weight, and dried by a dryer at a temperature of 170 ° C for 100 seconds to obtain a reaction rate constant. Of 0.30, the melt viscosity at 130 ° C. was 1500 poise, and a prepreg 1 having a thickness of 0.20 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 19 to obtain a thickness of 1.6 mm and a size of 340 mm.
A double-sided copper-clad laminate having a size of mm × 510 mm was manufactured.

(Example 22) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with the epoxy resin varnish of “D” so that the resin content was 40 to 42% by weight, and dried by a dryer at a temperature of 170 ° C. for 130 seconds to obtain a reaction rate constant. Of 0.30 and a melt viscosity at 130 ° C. of 50,000 poises and a thickness of 0.20 mm were obtained. This prepreg 1 was used, and thereafter Example 19 was used.
Stacked and molded in the same way as the, thickness 1.6mm, size 34
A double-sided copper-clad laminate having a size of 0 mm × 510 mm was manufactured.

(Comparative Example 7) WEA7628 manufactured by Nitto Boseki Co., Ltd.
A glass cloth base material of the type is impregnated with an epoxy resin varnish of “E” so that the resin content is 50 to 52% by weight, and is dried in a dryer at a temperature of 170 ° C. for 300 seconds to obtain a reaction rate constant. Prepreg 1 with a melt viscosity of 500 poises at 0.06 and 130 ° C and a thickness of 0.20 mm
I got Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 19, and the thickness is 1.6 mm and the size is 340 m.
An m × 510 mm double-sided copper-clad laminate was produced.

(Comparative Example 8) WEA7628 manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish having a composition of "E" so that the resin content is 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C for 320 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity at 0.06 and 130 ° C. of 1500 poise and a thickness of 0.20 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 19 to obtain a thickness of 1.6 mm and a size of 340 mm.
A double-sided copper-clad laminate having a size of mm × 510 mm was manufactured.

(Comparative Example 9) WEA7628 manufactured by Nitto Boseki Co., Ltd.
A glass cloth substrate of the type is impregnated with an epoxy resin varnish of “E” to a resin content of 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C. for 440 seconds to obtain a reaction rate constant. A prepreg 1 having a melt viscosity of 0.06 and 130 ° C. of 60,000 poise and a thickness of 0.20 mm was obtained. This prepreg 1 was used, and thereafter Example 19 was used.
Stacked and molded in the same way as the, thickness 1.6mm, size 34
A double-sided copper-clad laminate having a size of 0 mm × 510 mm was manufactured.

(Comparative Example 10) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with an epoxy resin varnish of "F" so that the resin content was 50 to 52% by weight, and dried in a dryer at a temperature of 170 ° C for 50 seconds to obtain a reaction rate constant. Of 0.06 and a melt viscosity at 130 ° C. of 500 poise, and a prepreg 1 having a thickness of 0.20 mm was obtained. Using this prepreg 1, the rest is loaded and molded in the same manner as in Example 19, and the thickness is 1.6 mm and the size is 340 mm.
A double-sided copper-clad laminate of × 510 mm was manufactured.

(Comparative Example 11) WEA762 manufactured by Nitto Boseki Co., Ltd.
Eight types of glass cloth base materials were impregnated with an epoxy resin varnish of “F” so that the resin content was 50 to 52% by weight, and dried for 100 seconds in a dryer at a temperature of 170 ° C. to give a reaction rate constant. Of 0.06 and a melt viscosity at 130 ° C. of 60,000 poise, and a prepreg 1 having a thickness of 0.20 mm was obtained. This prepreg 1 was used, and thereafter Example 19 was used.
Stacked and molded in the same way as the, thickness 1.6mm, size 34
A double-sided copper-clad laminate having a size of 0 mm × 510 mm was manufactured.

The above Examples 19-22 and Comparative Examples 7-1
With respect to the copper-clad laminate manufactured in No. 1, the standard deviation of the plate thickness was measured, and the appearance after etching was inspected. The results are shown in Table 7,
It is shown in Table 8.

[0068]

[Table 7]

[0069]

[Table 8]

[0070]

As described above, according to the first aspect of the invention, when a laminated sheet is manufactured by energizing the metal foil laminated on the prepreg to heat the metal foil, the prepreg is used as a glass cloth substrate. Since the impregnated epoxy resin with a reaction rate constant of 0.10 to 0.30 is used, the flow of the resin at the time of molding is optimized, resulting in variations in plate thickness, scraping of product edges, and measles. The metal foil-clad laminate can be molded by a method of heating by energizing the metal foil to generate heat, without the problem of molding defects such as rings and voids.

In the above invention, as the prepreg,
By using an epoxy resin having a reaction rate constant of 0.15 to 0.25 impregnated in a glass cloth substrate,
The flow of resin at the time of molding is further optimized, and the metal foil-clad laminate can be manufactured better. According to the invention of claim 3, when a metal foil laminated on the prepreg is energized to heat the metal foil to produce a laminated plate, an epoxy resin impregnated in a glass cloth base material is used as the prepreg. Reaction rate constant is 0.1
0 to 0.30, and the melt viscosity at 130 ° C. is 15
Since the one with a poise of 0 to 50000 is used, the flow of the resin at the time of molding is optimized, and there is no problem of molding defects such as variations in plate thickness, scrapes at the end of the product, measling, voids, etc. The metal foil-clad laminate can be molded by a method of heating by energizing and generating heat.

In the above invention, an epoxy resin impregnated in a glass cloth base material as a prepreg has a reaction rate constant of 0.10 to 0.30 and a melt viscosity at 130 ° C. of 4000 to 10,000 poises. Or its reaction rate constant is 0.15 to 0.25 and its melt viscosity at 130 ° C. is 1500 to 50,000 poise, or its reaction rate constant is 0.15 to 0.25. And the melt viscosity at 130 ° C. is 4000 to 1000
By using the one having 0 poise, the flow of the resin at the time of molding is further optimized, and the metal foil-clad laminate can be manufactured more favorably.

[Brief description of drawings]

FIG. 1 is a schematic front view showing an example of an embodiment of the present invention.

FIG. 2 is a schematic front view showing another example of the embodiment of the present invention.

FIG. 3 shows a laminated structure of a prepreg, a metal foil, etc., and (a) to (c) are schematic front views.

[Explanation of symbols]

 1 prepreg 2 metal foil

Claims (6)

[Claims] 1. A reaction rate constant of an epoxy resin impregnated in a glass cloth base material in a prepreg used for producing a laminate by energizing a metal foil laminated on a prepreg to generate heat in the metal foil. Is 0.10 to 0.
A prepreg for producing a metal foil-clad laminate, which is 30. 2. The reaction rate constant of the epoxy resin is 0.15.
The prepreg for manufacturing a metal foil-clad laminate according to claim 1, wherein the prepreg is 0.25 to 0.25. 3. A prepreg used for producing a laminated sheet by energizing a metal foil laminated on a prepreg to generate heat in the metal foil, wherein an epoxy resin impregnated in a glass cloth base material reacts with the prepreg. Speed constant is 0.10
Is about 0.30 and the melt viscosity at 130 ° C. is 150.
A prepreg for producing a metal foil-clad laminate, which is 0 to 50,000 poise. 4. The epoxy resin impregnated in a glass cloth substrate has a reaction rate constant of 0.10 to 0.30 and a melt viscosity at 130 ° C. of 4000 to 10,000 poise. The prepreg for producing a metal foil-clad laminate according to claim 3. 5. The epoxy resin with which the glass cloth substrate is impregnated has a reaction rate constant of 0.15 to 0.25 and a melt viscosity at 130 ° C. of 1500 to 50,000 poises. The prepreg for producing a metal foil-clad laminate according to claim 3. 6. An epoxy resin impregnated in a glass cloth substrate has a reaction rate constant of 0.15 to 0.25 and a melt viscosity at 130 ° C. of 4000 to 10000 poise. The prepreg for producing a metal foil-clad laminate according to claim 3.