JPS59107549A - 金属リ−ドへの金属突起物形成方法 - Google Patents

金属リ−ドへの金属突起物形成方法

Info

Publication number
JPS59107549A
JPS59107549A JP21077082A JP21077082A JPS59107549A JP S59107549 A JPS59107549 A JP S59107549A JP 21077082 A JP21077082 A JP 21077082A JP 21077082 A JP21077082 A JP 21077082A JP S59107549 A JPS59107549 A JP S59107549A
Authority
JP
Japan
Prior art keywords
metal
substrate
film
leads
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21077082A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0142501B2 (enrdf_load_stackoverflow
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21077082A priority Critical patent/JPS59107549A/ja
Publication of JPS59107549A publication Critical patent/JPS59107549A/ja
Publication of JPH0142501B2 publication Critical patent/JPH0142501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP21077082A 1982-12-01 1982-12-01 金属リ−ドへの金属突起物形成方法 Granted JPS59107549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21077082A JPS59107549A (ja) 1982-12-01 1982-12-01 金属リ−ドへの金属突起物形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21077082A JPS59107549A (ja) 1982-12-01 1982-12-01 金属リ−ドへの金属突起物形成方法

Publications (2)

Publication Number Publication Date
JPS59107549A true JPS59107549A (ja) 1984-06-21
JPH0142501B2 JPH0142501B2 (enrdf_load_stackoverflow) 1989-09-13

Family

ID=16594842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21077082A Granted JPS59107549A (ja) 1982-12-01 1982-12-01 金属リ−ドへの金属突起物形成方法

Country Status (1)

Country Link
JP (1) JPS59107549A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0142501B2 (enrdf_load_stackoverflow) 1989-09-13

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