JPS59104567U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS59104567U JPS59104567U JP19986482U JP19986482U JPS59104567U JP S59104567 U JPS59104567 U JP S59104567U JP 19986482 U JP19986482 U JP 19986482U JP 19986482 U JP19986482 U JP 19986482U JP S59104567 U JPS59104567 U JP S59104567U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- based resin
- electrode terminal
- conductor pattern
- synthetic rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ、 Ｂは従来のヒートシールの平面図と断面図
。第２図Ａ、 Ｂは本考案の回路基板の平面図とその端
子部分の断面図である。
、 １・・・・・・絶縁性フィルム、２・・・・・・
熱硬化型ホットメルト用導電性塗料、３・・・・・・熱
硬化型ホットメルト用絶縁性塗料、４・・・・・・金属
性導体。Figures 1A and 1B are a plan view and a sectional view of a conventional heat seal. 2A and 2B are a plan view of the circuit board of the present invention and a sectional view of its terminal portion. , 1... Insulating film, 2...
Conductive paint for thermosetting hot melt, 3... Insulating paint for thermosetting hot melt, 4... Metallic conductor.
Claims (1)
撓性を有する回路基板において、前記回路基板は可撓性
を有する絶縁性の基板上に、サブトラクティブ法または
アディティブ法により金属性導体パターンを形成した後
、外部基板の電極端子との接続部分に一当たる金属性導
体パターン上に合成ゴ、ム系樹脂に黒鉛を分散させた熱
硬化型ホットメルト用導電性塗料を、前記接続部分を除
くその周囲に合成ゴム系樹脂に顔料を分散させた熱硬化
型ホットメルト用絶縁性塗料を印刷したことを特徴とす
る回路基板。 ゛（２）電子部品搭載可能であり、その
一部に外部基板との接続用電極端子を有する特許請求の
範囲第１項記載の回路基板。(1) In a flexible circuit board used for electrically connecting substrates, the circuit board is made of metal by subtractive or additive method on a flexible insulating substrate. After forming the conductor pattern, a thermosetting hot-melt conductive paint containing graphite dispersed in a synthetic rubber or rubber-based resin is applied onto the metal conductor pattern that corresponds to the connection part with the electrode terminal of the external board. A circuit board characterized in that a thermosetting hot-melt insulating paint made of a synthetic rubber-based resin with pigments dispersed is printed around it except for the parts. (2) The circuit board according to claim 1, which is capable of mounting electronic components and has an electrode terminal for connection to an external board on a part thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19986482U JPS59104567U (en) | 1982-12-29 | 1982-12-29 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19986482U JPS59104567U (en) | 1982-12-29 | 1982-12-29 | circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59104567U true JPS59104567U (en) | 1984-07-13 |
Family
ID=30425390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19986482U Pending JPS59104567U (en) | 1982-12-29 | 1982-12-29 | circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59104567U (en) |
-
1982
- 1982-12-29 JP JP19986482U patent/JPS59104567U/en active Pending
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