JPS5910251A - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS5910251A JPS5910251A JP58089103A JP8910383A JPS5910251A JP S5910251 A JPS5910251 A JP S5910251A JP 58089103 A JP58089103 A JP 58089103A JP 8910383 A JP8910383 A JP 8910383A JP S5910251 A JPS5910251 A JP S5910251A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- lead frame
- lead
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/421—
-
- H10W74/016—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58089103A JPS5910251A (ja) | 1983-05-23 | 1983-05-23 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58089103A JPS5910251A (ja) | 1983-05-23 | 1983-05-23 | リ−ドフレ−ム |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9028675A Division JPS59969B2 (ja) | 1975-07-25 | 1975-07-25 | 半導体装置の封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910251A true JPS5910251A (ja) | 1984-01-19 |
| JPS6233748B2 JPS6233748B2 (enExample) | 1987-07-22 |
Family
ID=13961547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58089103A Granted JPS5910251A (ja) | 1983-05-23 | 1983-05-23 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910251A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135765A (ja) * | 1988-11-16 | 1990-05-24 | Matsushita Electron Corp | 半導体装置用リードフレーム |
| FR2685813A1 (fr) * | 1991-12-30 | 1993-07-02 | Fierkens Richard | Dispositif d'encapsulage en matiere plastique d'un cadre de conducteurs de circuit integre et procede d'encapsulage. |
| JP2015133363A (ja) * | 2014-01-09 | 2015-07-23 | 株式会社カネカ | 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029672A (enExample) * | 1973-07-17 | 1975-03-25 |
-
1983
- 1983-05-23 JP JP58089103A patent/JPS5910251A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5029672A (enExample) * | 1973-07-17 | 1975-03-25 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02135765A (ja) * | 1988-11-16 | 1990-05-24 | Matsushita Electron Corp | 半導体装置用リードフレーム |
| FR2685813A1 (fr) * | 1991-12-30 | 1993-07-02 | Fierkens Richard | Dispositif d'encapsulage en matiere plastique d'un cadre de conducteurs de circuit integre et procede d'encapsulage. |
| JP2015133363A (ja) * | 2014-01-09 | 2015-07-23 | 株式会社カネカ | 光半導体用リードフレーム、光半導体用樹脂成形体及びその製造方法、光半導体パッケージ並びに光半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6233748B2 (enExample) | 1987-07-22 |
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