JPS5899855U - enamel board - Google Patents
enamel boardInfo
- Publication number
- JPS5899855U JPS5899855U JP19356181U JP19356181U JPS5899855U JP S5899855 U JPS5899855 U JP S5899855U JP 19356181 U JP19356181 U JP 19356181U JP 19356181 U JP19356181 U JP 19356181U JP S5899855 U JPS5899855 U JP S5899855U
- Authority
- JP
- Japan
- Prior art keywords
- enamel
- enamel board
- metal core
- board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のほうろう基板を示す断面図、第２図は従
来のほうろう基板上に電気回路網を瘤成した厚膜回路基
板の平面図、第３図はこの考案のほうろう基板上に電気
回路網を形成した厚膜回路基板の平面図、第４図は第３
図の厚膜回路基板の断面図、第５図はこの考案のほうろ
う基板に電気回路網を形成した厚膜回路基板の他の例を
示す平面図、第６図は第５図の厚膜回路基板を折り曲げ
た折り曲げ回路基板の断面図である。
１１・・・・・・はうろう基板、１２・・・・・・金属
コア、１３・・・・・・部分はうろう層。Figure 1 is a cross-sectional view of a conventional enamel substrate, Figure 2 is a plan view of a thick film circuit board with an electric circuit network formed on the conventional enamel substrate, and Figure 3 is a cross-sectional view of a conventional enamel substrate with electrical circuits formed on it. A plan view of the thick film circuit board on which the circuit network is formed, Figure 4 is the same as Figure 3.
5 is a plan view showing another example of the thick film circuit board in which an electric circuit network is formed on the enamel substrate of this invention, and FIG. 6 is the thick film circuit shown in FIG. 5. FIG. 3 is a cross-sectional view of a folded circuit board obtained by folding the board. 11... is a floating substrate, 12... is a metal core, and 13... is a floating layer.
Claims (1)
るほうろう基板において、導体および抵抗体等の電気回
路網を設ける部分にのみほうろう層を設けたことを特徴
とするほうろう基板。An enamel substrate comprising a metal core and an enamel layer covering the metal core, characterized in that the enamel layer is provided only in areas where electrical circuit networks such as conductors and resistors are to be provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19356181U JPS5899855U (en) | 1981-12-26 | 1981-12-26 | enamel board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19356181U JPS5899855U (en) | 1981-12-26 | 1981-12-26 | enamel board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5899855U true JPS5899855U (en) | 1983-07-07 |
Family
ID=30106912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19356181U Pending JPS5899855U (en) | 1981-12-26 | 1981-12-26 | enamel board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899855U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH027596A (en) * | 1988-06-27 | 1990-01-11 | Fujitsu Ltd | Wiring board with interlayered film element |
| WO2010064364A1 (en) * | 2008-12-01 | 2010-06-10 | 日本発條株式会社 | Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5122472A (en) * | 1974-08-17 | 1976-02-23 | Ricoh Watch | DENSHIUDEDOKEI |
| JPS536876A (en) * | 1976-07-08 | 1978-01-21 | Matsushita Electric Ind Co Ltd | Hybrid integrated circuit and method of producing same |
-
1981
- 1981-12-26 JP JP19356181U patent/JPS5899855U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5122472A (en) * | 1974-08-17 | 1976-02-23 | Ricoh Watch | DENSHIUDEDOKEI |
| JPS536876A (en) * | 1976-07-08 | 1978-01-21 | Matsushita Electric Ind Co Ltd | Hybrid integrated circuit and method of producing same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH027596A (en) * | 1988-06-27 | 1990-01-11 | Fujitsu Ltd | Wiring board with interlayered film element |
| WO2010064364A1 (en) * | 2008-12-01 | 2010-06-10 | 日本発條株式会社 | Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object |
| JP2010129984A (en) * | 2008-12-01 | 2010-06-10 | Nhk Spring Co Ltd | Printed circuit board and method of manufacturing the same, and printed circuit board semi-fabricated item chain |
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