JP2010129984A - Printed circuit board and method of manufacturing the same, and printed circuit board semi-fabricated item chain - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To permit the suppression of peeling and falling of an insulating layer with time. <P>SOLUTION: Before bending a metal substrate 13 with an insulating layer 19, bending grooves 45, 47 with V-shape sections for parting the insulating layer 19 are provided on the corresponding parts 41, 43 of bending parts 15, 16, and abutting grooves 49, 51 with V-shape sections are provided on the corresponding parts 41, 43 of the bending parts 15, 16 of the rear side 17 of the metal substrate 13 without the insulating layer 19 to bend the metal substrate 13 with the bending grooves 45, 47 and the abutting grooves 49, 51 as starting points and to allow the surfaces 35a, 37a in the abutting grooves 49, 51 to abut so as to close the abutting grooves 49, 51 for determining the bending angles of the bending parts 15, 16. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printed wiring board to which electronic components such as LEDs (light emitting diodes) are attached, a manufacturing method thereof, and a printed wiring board semi-finished product chain used in the manufacturing method.

  In recent years, electronic components represented by LEDs (light emitting diodes) and the like have been used in a wider field than their convenience. In this case, for example, a printed wiring board to which an LED is attached may be bent and used or attached.

  In this printed wiring board, for example, an elongated rectangular metal substrate having an insulating layer on the surface is bent at a bent portion, and leg portions for attachment or the like are formed on both sides of the tip portion. A printed wiring portion for attaching the LED is provided on the surface of the insulating layer.

  Such a printed wiring board has no problem even if it is bent as long as the insulating layer is polyimide, as in Patent Document 1.

  On the other hand, a polyimide insulating layer is suitable for bending, but has a difficulty in heat transfer.

  On the other hand, electronic components such as LEDs need to release heat generated in order to maintain performance and durability, and the insulating layer contains an inorganic filler with good heat conductivity such as alumina or silica in an epoxy compound material. It is better to use something.

  However, an insulating layer containing an inorganic filler such as alumina or silica in an epoxy compound material is brittle and is not suitable for the bending process. If the bending process is performed, the insulating layer peels off at the bent part over time, causing damage. There is a risk of becoming.

JP-A-8-125295

  The problem to be solved is that the insulating layer containing the inorganic filler is brittle, and when bent, the insulating layer peels off over time at the bent portion, which may cause a failure.

  In the present invention, in order to prevent the insulating layer from peeling off with time, a metal substrate having a brittle insulating layer on the surface is bent at a bent portion, and a tip portion and a leg portion intersecting the tip portion are formed. A printed wiring board provided integrally and provided with a printed wiring part for attaching an electronic component to at least the surface of the insulating layer at the tip, wherein the insulating layer is divided along the entire length of the bent part The main feature of the printed wiring board is that the insulating layer dividing portion is provided.

  A method of manufacturing a printed wiring board for manufacturing the printed wiring board, wherein the insulating layer is divided into a corresponding portion of the bent portion before the metal substrate having the insulating layer is bent. The main feature of the printed wiring board manufacturing method is that the metal substrate is bent with the bent groove as a starting point.

  A printed wiring board semi-finished product chain used in the method for manufacturing a printed wiring board, wherein the metal substrate having the insulating layer and the wiring portion is bent through a dividing groove having a V-shaped cross section between adjacent parts. A printed wiring board semi-finished product chain is formed by connecting a plurality of metal substrates before being bent and continuously forming the bent grooves or the bent grooves and the abutting grooves across the plurality of metal substrates so as to intersect the divided grooves. It is the most important feature of the body.

  According to the present invention, a metal substrate having a brittle insulating layer on a surface is bent at a bent portion, and a tip portion and a leg portion intersecting the tip portion are integrally provided, and at least an insulating layer surface of the tip portion is provided with an electron A printed wiring board provided with a printed wiring portion for attaching a component, wherein an insulating layer dividing portion is provided that divides the insulating layer along the entire length of the bent portion.

  For this reason, the insulating layer weakened by bending of the bent portion does not exist, and the peeling off of the insulating layer can be restricted, and the failure due to the peeling off of the insulating layer can be suppressed.

  A method of manufacturing a printed wiring board for manufacturing the printed wiring board, wherein the insulating layer is divided into a corresponding portion of the bent portion before the metal substrate including the insulating layer and the wiring portion is bent. A V-shaped bent groove was provided, and the metal substrate was bent starting from the bent groove.

  For this reason, even if the metal substrate is bent starting from the bent groove, there is no insulating layer weakened by bending of the bent portion, and the peeling of the insulating layer is regulated, and the failure due to the peeling of the insulating layer is prevented. Can be suppressed.

  A printed wiring board semi-finished product chain used in the method for manufacturing a printed wiring board, wherein the metal substrate having the insulating layer and the wiring portion is bent through a dividing groove having a V-shaped cross section between adjacent parts. A plurality of metal substrates before being bent are provided in series, and the bent grooves or the bent grooves and the abutting grooves are formed continuously across the plurality of metal substrates so as to intersect the divided grooves.

  For this reason, the metal substrate provided with the insulating layer and the wiring portion can be separated by the dividing groove before being bent, and the bending can be performed in a single state.

  Therefore, handling of a plurality of printed wiring boards becomes easy.

  Moreover, even if the metal substrate is bent starting from the bent groove, there is no insulating layer weakened by bending of the bent portion, and the peeling of the insulating layer is regulated and the failure due to the peeling of the insulating layer is suppressed. can do.

  The purpose of suppressing the insulating layer from peeling off with time is realized by a bent groove having a V-shaped cross section that divides the insulating layer.

[Printed wiring board]
FIG. 1 is a cross-sectional view according to Embodiment 1 of the present invention in which an LED is supported on a printed wiring board.

  As shown in FIG. 1, the printed wiring board 1 includes a tip portion 7 and a pair of leg portions 9 and 11 that intersect with the tip portion 7. The intersection of the tip 7 and the pair of legs 9, 11 is orthogonal in the present embodiment, but can also be intersected at other angles.

  The front end portion 7 and the leg portions 9 and 11 are formed, for example, by bending an aluminum metal substrate 13 to the back surface 17 side by bending portions 15 and 16. An insulating layer 19 is provided on the surface 18 of the metal substrate 13. The metal substrate 13 uses aluminum having good heat conductivity for heat dissipation, but may be formed of any aluminum alloy or copper having good heat conductivity in addition to aluminum.

  For the insulating layer 19, for example, a material mainly including a thermosetting resin such as an epoxy compound material and an inorganic filler having good heat transfer properties such as alumina or silica is used. Therefore, the insulating layer 19 is brittle but has good heat conductivity.

  The distal end portion 7 is formed in a rectangular shape, and the distal end portion 7 is provided with a wiring portion 21 by printing of copper foil, and an LED (light emitting diode) 23 which is an electronic component is mounted thereon.

  The leg portions 9 and 11 are formed to oppose the two side edge portions 25 and 27 of the rectangular tip portion 7, extend along the elongated case, and are fixedly attached to the base portion on the case side. The leg portions 9 and 11 are used for attachment and constitute heat radiating fins.

  The bent portions 15 and 16 are provided with insulating layer dividing portions 31 and 33 that divide the insulating layer 19 along the entire outer length thereof. The insulating layer dividing portions 31 and 33 are constituted by grooves 31a and 33a having a V-shaped cross section in the present embodiment.

  On the back surface 17 of the metal substrate 13 without an insulating layer, abutting portions 35 and 37 for determining the bending angle of the bent portions 15 and 16 are provided within the plate thickness of the metal substrate 13. The abutting portions 35 and 37 have their surfaces 35a and 37a abutted against each other, and the bending angle of the bent portions 15 and 16 is determined to be a right angle as described above. However, the bending angle can be selected from various types such as 60 ° other than a right angle.

In the printed wiring board 1 as described above, the heat generated by the LED 23 is transferred through the insulating layer 19 with good heat transfer to the tip portion 7 of aluminum with good heat transfer. The heat transferred is further transferred through the leg portions 9 and 11, and is radiated to the outside through the case and the like.
[Method of manufacturing printed wiring board]
2 is a plan view of the metal substrate before bending, FIG. 3 is a cross-sectional view thereof, and FIG. 4 is a cross-sectional view of the printed wiring board after the metal substrate is bent.

  The metal substrate 13 before bending shown in FIGS. 2 and 3 is manufactured as follows, for example.

  A metal substrate 13 is disposed on one surface of the semi-cured insulating material, a copper foil is disposed on the other surface, and integrated by a laminating press to form a copper-clad laminate structure.

  Next, a circuit is formed on the copper foil disposed on the other surface to form the wiring portion 21 shown in FIG.

  Next, it punches out to the magnitude | size set with the press, and forms the metal substrate 13 provided with the insulating layer 19 before bending.

  Next, before the metal substrate 13 having the insulating layer 19 and the wiring portion 21 is bent, the bent portion having a V-shaped cross section that divides the insulating layer 19 into the corresponding portions 41 and 43 of the bent portions 15 and 16. Two grooves 45 and 47 are provided. The bent grooves 45 and 47 are formed across the width direction of the metal substrate 13.

  Further, two abutting grooves 49, 51 each having a V-shaped cross section are provided on the corresponding portions 41, 43 of the 15, 16 on the back surface 17 of the metal substrate 13 without an insulating layer. The abutting grooves 49 and 51 are arranged at positions corresponding to the front and back surfaces of the bent grooves 45 and 47.

  The bent grooves 45 and 47 and the abutting grooves 49 and 51 are formed with the same depth, and the bent grooves 45 and 47 are formed deeper than the thickness of the insulating layer 19. In the present embodiment, the thickness of the metal substrate 13 is 1 mm, and the depths of the bent grooves 45 and 47 and the abutting grooves 49 and 51 are about 0.35 mm, respectively. The remaining thickness between 49 and 51 is set to about 0.3 mm, which enables manual bending.

  The thickness of the metal substrate 13 is 1 mm to 3 mm, and the remaining thickness of the metal substrate 13 of any thickness is about 0.3 mm.

  When the bent grooves 45 and 47 are close to the wiring portion 21, the bent grooves 45 and 47 are formed small, but the remaining thickness between the bent grooves 45 and 47 and the abutting grooves 49 and 51 is as follows. , About 0.3 mm.

  The bent grooves 45 and 47 and the abutment grooves 49 and 51 are cut by a rotary blade that provides a chip embedded with diamond, for example, considering that the metal substrate 13 is aluminum.

  Next, the metal substrate 13 is bent starting from the bent grooves 45, 47 and the abutting grooves 49, 51, and the surfaces 35a, 37a in the abutting grooves 49, 51 are closed so as to close the abutting grooves 49, 51. 4 to determine the bending angle of the bent portions 15 and 16 as described above, and the printed wiring board 1 of FIG. 4 can be obtained.

  The insulating layer dividing portions 31 and 33 of the printed wiring board 1 are configured by expanding the bending grooves 45 and 47 of the metal substrate 13 before bending.

The bent grooves 45 and 47 and the abutting grooves 49 and 51 can be formed either before or after the metal substrate 13 is punched into a size set by pressing.
[Printed wiring board semi-finished product chain]
FIG. 5 is a plan view of the printed wiring board semi-finished product chain.

  As described above, the printed wiring board 1 shown in FIG. 4 can be formed by bending individual metal substrates 13 punched out by pressing as shown in FIGS. 2 and 3, but the printed wiring board half-product chain shown in FIG. It can also be formed from the body 53.

  An aluminum substrate material 55 capable of forming a plurality of unfolded metal substrates 13 in parallel in FIG. 5 is punched out with a press, and the insulating layer 19 is formed on the entire substrate material 55 by the same procedure as described above. The wiring part 21 is formed.

  Next, the dividing grooves 57, 59, 61, 63 having a V-shaped cross section are cut and formed on the front and back of the substrate material 55 with the same rotary blade as described above. The remaining thickness between the front and back dividing grooves 57, 59, 61, 63 is set to about 0.3 mm in consideration of division by manual work.

  The division grooves 57 and 63 divide the discard plate portions 65 and 67, and the division grooves 61 and 63 are for dividing the discard plate portions 69 and 71. The dividing groove 59 is for dividing each metal substrate 13.

  Thus, before the metal substrate 13 provided with the insulating layer 19 and the wiring portion 21 is bent, a plurality of the metal substrates 13 before the bending are connected via the dividing groove 59 having a V-shaped cross section between adjacent ones.

  Next, the bent grooves 45 and 47 and the abutting grooves 49 and 51 (not shown in FIG. 5) are continuously formed across the plurality of metal substrates 13 so as to intersect the dividing grooves 59.

  In the printed wiring board semi-finished product chain 53 formed in this way, the discarded board portions 65, 67, 69, 71 provided in the periphery are divided and removed by the dividing grooves 57, 61, 63, and the metal substrate 13 is removed from the adjacent metal substrate 13. The printed wiring board 1 shown in FIG. 4 can be obtained sequentially by dividing the groove 59 into the same form as in FIG.

In addition, the printed wiring board semi-finished product chain 53 of FIG. 5 can be formed as a chained body, and punched out with a press to form individual printed wiring board semi-finished product chains 53.
[Effect of Example 1]
In the first embodiment of the present invention, the metal substrate 13 having the brittle insulating layer 19 on the surface is bent to the back surface 17 side by the bent portions 15 and 16, and the tip portion 7 and the leg portions 9 and 11 intersecting the tip portion 7 are intersected. And a printed wiring board 1 provided with a printed wiring portion 21 for attaching the LED 23 on at least the surface of the insulating layer 19 of the tip portion 7, on the entire outer length of the bent portions 15 and 16. Along with this, insulating layer dividing portions 31 and 33 were formed by dividing the insulating layer 19.

  For this reason, the insulating layer 19 weakened by bending does not exist outside the bent portions 15, 16, and the peeling off of the insulating layer 19 can be regulated and the failure due to the peeling off of the insulating layer 19 can be suppressed. .

  The insulating layer dividing portions 31 and 33 are grooves 31a and 33a having a V-shaped cross section.

  For this reason, the insulating layer 19 can be reliably divided at the bent portions 15 and 16.

  The distal end portion 7 is formed in a rectangular shape, and the leg portions 9 and 11 are provided at two edge portions of the distal end portion 7.

  For this reason, the reliable support and heat dissipation by the leg parts 9 and 11 can be performed.

  Abutting portions 35 and 37 for determining the bending angle of the bent portions 15 and 16 are provided in the thickness of the metal substrate 13 on the back surface 17 of the metal substrate 13 without the insulating layer 19.

  For this reason, the bending angle of the bent portions 15 and 16 can be determined without increasing the plate thickness, which is advantageous for downsizing.

  The leg portions 9 and 11 are radiating fins.

  Therefore, the heat generation of the LED 23 at the distal end portion 7 can be accurately performed through the leg portions 9 and 11.

  The metal substrate 13 was formed of any one of aluminum, aluminum alloy, and copper.

  For this reason, heat conductivity can be improved and heat radiation can be performed reliably.

  A method of manufacturing a printed wiring board 1 for manufacturing the printed wiring board 1, wherein the corresponding portions 41 and 43 of the bent portions 15 and 16 are bent before the metal substrate 13 having the insulating layer 19 is bent. Folded grooves 45 and 47 having a V-shaped cross section for dividing the insulating layer 19 were provided, and the metal substrate 13 was bent starting from the bent grooves 45 and 47.

  For this reason, even if the metal substrate 13 is bent starting from the bent grooves 45 and 47, the insulating layer 19 weakened by bending does not exist outside the bent portions 45 and 47, and the insulating layer 19 is peeled off. It is possible to restrict the obstacles caused by peeling off the insulating layer 19.

  Before the metal substrate 13 provided with the insulating layer 19 is bent, the corresponding portions 41 and 43 of the bent portions 15 and 16 are provided with bent grooves 45 and 47 having a V-shaped cross section for dividing the insulating layer 19. Abutting grooves 49, 51 having a V-shaped cross section are provided on the corresponding portions 41, 43 of the bent portions 15, 16 on the back surface 17 of the metal substrate 13 without the insulating layer 19, and the bent grooves 45, 47, and The metal substrate 13 is bent starting from the abutting grooves 49, 51 and the surfaces 35a, 37a in the abutting grooves 49, 51 are abutted so as to close the abutting grooves 49, 51 so that the bent portions 15, 16 bending angles are determined.

  For this reason, the bending angle of the bending parts 15 and 16 can be determined reliably.

  The printed wiring board semi-finished product chain 53 used in the method for manufacturing the printed wiring board 1 is divided into a V-shaped cross section between adjacent parts before the metal substrate 13 including the insulating layer 19 and the wiring part 21 is bent. A plurality of unfolded metal substrates 13 are continuously provided through the grooves 59, and a plurality of the bent grooves 45, 47 or the bent grooves 45, 47 and the abutting grooves 49, 51 intersect with the divided grooves 59. The metal substrate 13 was continuously formed.

  For this reason, the metal substrate 13 provided with the insulating layer 19 and the wiring portion 21 can be detached manually by the dividing groove 59 before being bent, and the bending can be performed in a single state.

  Therefore, handling of the plurality of printed wiring boards 13 becomes easy.

  In addition, even if the metal substrate 13 is bent starting from the bent grooves 45 and 47, the insulating layer 19 weakened by the bending does not exist outside the bent portions 15 and 16, and the peeling off of the insulating layer 19 is restricted. In addition, it is possible to suppress a failure due to the peeling off of the insulating layer 19.

  The printed wiring board semi-finished product chain 53 was provided with discard board portions 65, 67, 69, 71 through 57, 61, 63 with V-shaped dividing grooves in the periphery.

  For this reason, careless handling in the dividing groove 59 between the metal substrates 13 can be restricted until the metal substrate 13 is separated as a single unit, and the handling can be facilitated.

  6 to 9 relate to a second embodiment of the present invention, FIG. 6 is a plan view of a metal substrate before bending, FIG. 7 is a sectional view thereof, and FIG. 8 is a printed wiring board after bending of the metal substrate. FIG. 9 is a plan view of a printed wiring board semi-finished product chain. The basic configuration is the same as that of the first embodiment, and the same or corresponding components will be described with the same reference numerals or the same reference numerals marked with A.

  As shown in FIG. 8, the printed wiring board 1 </ b> A of the present embodiment includes a wiring portion 21 </ b> Aa at the distal end portion 7, and a print for attaching an electronic component such as an LED to the surface of the insulating layer 19 of the legs 9 and 11. Wiring part 21Ab was provided.

In addition, the manufacturing method of the printed wiring board 1A shown in FIGS. 6 to 8 is the same as the manufacturing method of the printed wiring board 1 of Example 1 shown in FIGS. 2 to 4, and the printed wiring board shown in FIG. The board half-product chain 53A is the same as the printed wiring board half-product chain 53 shown in FIG.
Therefore, also in the present embodiment, the same operational effects as those of the first embodiment can be obtained.

  10 to 12 relate to a third embodiment of the present invention, FIG. 10 is a plan view of a metal substrate before bending, FIG. 11 is a sectional view of the same, and FIG. 12 is a printed wiring board after bending of the metal substrate. It is sectional drawing. The basic configuration is the same as that of the second embodiment, and the same or corresponding components will be described with the same reference numerals or the same reference signs A replaced with B.

  10 to 12, in the printed wiring board 1B of the present embodiment, the tip portion 7B is formed in a rectangular shape, and each of the two leg portions 9B and 11B has four edges of the tip portion 7B. It is divided into parts.

  The manufacturing method of the printed wiring board 1B shown in FIGS. 10 to 12 is the same as the manufacturing method of the printed wiring board 1 of Example 1 shown in FIGS.

  However, the two bent grooves 45B and 47B corresponding to the two leg portions 9B and 11B of this embodiment (the portions corresponding to the leg portions 9B and 11B are shown in parentheses in FIG. 10). Each of the abutting grooves 49B and 51B is composed of a single piece, and two bent grooves 45B and 47B are formed in two flat insulating layer dividing portions 31B and 33B (provided in FIG. 12) by bending the metal substrate 13B. In the cross section of FIG. 12, only a pair is shown.) Each of the surfaces 35a, 37a of the two abutment grooves 49B, 51B abuts to each other and the two bent portions 15B, 16B (however, in the cross section of FIG. 12). , Only one pair is shown), and the two abutting portions 35B and 37B are provided within the thickness of the metal substrate 13B.

  Therefore, the present embodiment can achieve the same effects as the above-described embodiments.

  Further, in this embodiment, the leg portions 9B and 11B are four in total, and even if an electronic component such as an LED is attached to each leg portion 9B and 11B via the wiring portion 21Bb, sufficient heat dissipation is ensured. Can do.

  In the present embodiment, the wiring portions 21Bb of the leg portions 9B and 11B can be omitted.

  FIGS. 13 and 14 relate to Embodiment 4 of the present invention, FIG. 13 is a cross-sectional view of a metal substrate before bending, and FIG. 14 is a cross-sectional view of a printed wiring board after bending of the metal substrate. The basic configuration is the same as that of the second embodiment, and the same or corresponding components will be described by substituting C for C or C for the same or corresponding components.

  As shown in FIG. 14, the printed wiring board 1C of the present embodiment includes a wiring portion 21Ca on the back surface of the tip portion 7C, and also attaches electronic components, for example, LEDs, to the surface of the insulating layer 19C on the back surface of the legs 9C and 11C. A printed wiring portion 21Cb is provided. Further, the extension portions 9Ca and 11Ca are formed on the leg portions 9C and 11C, and the wiring portion 21Cc is also provided on the surface of the insulating layer 19C on the back surface of the extension portions 9Ca and 11Ca.

  The manufacturing method of the printed wiring board 1C shown in FIGS. 13 and 14 is the same as the manufacturing method of the printed wiring board 1 of Example 1 shown in FIGS.

  However, in the printed wiring board 1C of this embodiment, the insulating layer 19C and the wiring portions 21Ca, 21Cb, and 21Cc are provided on the back side of the metal substrate 13C, and the abutting portions 35C and 37C constitute the insulating layer dividing portion.

  Therefore, this embodiment can achieve the same effects as those of the second embodiment.

  FIGS. 15 and 16 relate to Embodiment 5 of the present invention, FIG. 15 is a cross-sectional view of a metal substrate before bending, and FIG. 16 is a cross-sectional view of a printed wiring board after bending of the metal substrate. The basic configuration is the same as that of the fourth embodiment, and the same or corresponding components will be described by substituting D for C or C for the same or corresponding components.

As shown in FIGS. 15 and 16, the printed wiring board 1 </ b> D of the present embodiment has a single abutting portion 35 </ b> D and 37 </ b> D formed at each location, and is similar to the third embodiment.
[Others]
In each of the above embodiments, the abutting portions 35, 37, 35B, 37B, 35C, 37C, 35D, and 37D may be omitted. When the abutting portions 35, 37, 35B, 37B, 35C, 37C, 35D, and 37D are omitted, in the manufacturing method of the printed wiring boards 1, 1A, 1B, 1C, and 1D, the abutting grooves 49, 51, 49B, 51B, 49C, 51C, 49D, and 51D are not formed. At this time, the remaining thickness for bending the metal substrates 13, 13A, 13B, 13C, and 13D is formed to be about 0.3 mm as described above.

  The abutting portions 35C, 37C, 35D, and 37D formed on the insulating layers 19C and 19D are not omitted because they constitute an insulating layer dividing portion.

  The legs 9, 11, 9B, 11B, 9C, 11C, 9D, and 11D can be used for mere support, ignoring heat dissipation.

It is sectional drawing which supported LED on the printed wiring board. (Example 1) It is a top view of the metal substrate before bending. (Example 1) It is sectional drawing of the metal substrate before bending. (Example 1) It is sectional drawing of the printed wiring board after metal substrate bending. (Example 1) It is a top view of a printed wiring board semi-finished product chain. (Example 1) It is a top view of the metal substrate before bending. (Example 2) It is sectional drawing of the metal substrate before bending. (Example 2) It is sectional drawing of the printed wiring board after metal substrate bending. (Example 2) It is a top view of a printed wiring board semi-finished product chain. (Example 2) It is a top view of the metal substrate before bending. (Example 3) It is sectional drawing of the metal substrate before bending. (Example 3) It is sectional drawing of the printed wiring board after metal substrate bending. (Example 3) It is sectional drawing of the metal substrate before bending. Example 4 It is sectional drawing of the printed wiring board after metal substrate bending. Example 4 It is sectional drawing of the metal substrate before bending. (Example 5) It is sectional drawing of the printed wiring board after metal substrate bending. (Example 5)

Explanation of symbols

1, 1A, 1B, 1C, 1D Printed wiring board 7, 7B, 7C, 7D Tip portion 9, 11, 9B, 11B Leg portion
13, 13A, 13B Metal substrate 15, 16 Dividing part 17 Back surface 18 Front surface 19 Insulating layer 23 LED (electronic component)
25, 27 Two edge portions 31, 33, 31B, 33B Insulating layer dividing portion 35, 37, 35B, 37B Abutting portion 35C, 37C, 35D, 37D Abutting portion (insulating layer dividing portion)
35a, 37a Surface 41, 43 Corresponding portion 45, 47, 45B, 47B Bending groove 49, 51, 49B, 51B, 49C, 51C Abutting groove 57, 59, 61, 63 Dividing groove 65, 67, 69, 71 Discarding plate

Claims (11)

Folding a metal substrate with a brittle insulating layer on the surface at the bent portion and integrally providing a tip portion and a leg portion crossing the tip portion,
A printed wiring board provided with a printed wiring part for attaching an electronic component to at least the insulating layer surface of the tip part,
Along the entire length of the bent portion, provided an insulating layer dividing portion that divided the insulating layer,
A printed wiring board characterized by that. The printed wiring board according to claim 1,
The insulating layer dividing portion is a groove having a V-shaped cross section.
A printed wiring board characterized by that. The printed wiring board according to claim 1 or 2,
The tip is formed in a rectangular shape,
The leg portion is provided on the two or four side edges of the tip.
A printed wiring board characterized by that. The printed wiring board according to any one of claims 1 to 3,
Provided with a printed wiring part for attaching an electronic component on the surface of the insulating layer of the leg part,
A printed wiring board characterized by that. The printed wiring board according to any one of claims 1 to 4,
The abutting portion for determining the bending angle of the bent portion is provided within the plate thickness of the metal substrate.
A printed wiring board characterized by that. A printed wiring board according to any one of claims 1 to 5,
The leg is a radiating fin,
A printed wiring board characterized by that. The printed wiring board according to any one of claims 1 to 6,
The metal substrate is formed of any one of aluminum, aluminum alloy, and copper.
A printed wiring board characterized by that. A printed wiring board manufacturing method for manufacturing the printed wiring board according to claim 1,
Before bending the metal substrate provided with the insulating layer and the wiring portion, a bent groove having a V-shaped cross section for dividing the insulating layer is provided in a corresponding portion of the bent portion,
The metal substrate is bent starting from the bent groove,
A printed wiring board manufacturing method characterized by the above. A method for producing a printed wiring board for producing the printed wiring board according to claim 5,
Before bending the metal substrate provided with the insulating layer and the wiring portion, at least one of a bent groove or abutment groove having a V-shaped cross section for dividing the insulating layer is provided in a corresponding portion of the bent portion, and A bump groove having a V-shaped cross section is provided in the corresponding portion of the bent portion on the back surface of the metal substrate without the insulating layer,
The abutting portion that bends the metal substrate with the bent groove and the abutting groove as a starting point, and abuts a surface in the abutting groove so as to close the abutting groove, and determines a bending angle of the bent portion. did,
A printed wiring board manufacturing method characterized by the above. A printed wiring board semi-finished product chain used in the method for producing a printed wiring board according to claim 8 or 9,
Before bending the metal substrate provided with the insulating layer and the wiring portion, a plurality of the metal substrates before the bending are continuously provided through adjacently divided grooves having a V-shaped cross section between the adjacent ones.
The bent groove or the bent groove and the abutting groove are continuously formed across a plurality of metal substrates crossing the divided grooves.
Printed wiring board semi-finished product chain characterized by that. The printed wiring board semi-finished product chain according to claim 10, comprising a discard plate part around a dividing groove having a V-shaped cross section in the periphery.
Printed wiring board semi-finished product chain characterized by that.

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