WO2021199866A1

WO2021199866A1 - Circuit module

Info

Publication number: WO2021199866A1
Application number: PCT/JP2021/008154
Authority: WO
Inventors: 昌由 ▲高▼木; 秀行森本; 和茂佐藤
Original assignee: 株式会社村田製作所
Priority date: 2020-03-30
Filing date: 2021-03-03
Publication date: 2021-10-07

Abstract

A circuit module (1A) comprises a wiring board (10) having a first main surface (11) and a second main surface (12), and a plurality of electronic components (20). The wiring board (10) includes a first mounting area (A1) and a second mounting area (A2) on which the electronic components (20) are mounted, and a non-mounting area (B) which is located between the first mounting area (A1) and the second mounting area (A2) and on which the electronic component (20) is not mounted. A single first recess (11a) is provided at a first main surface (11a) in a portion corresponding to the non-mounting area (B), and a plurality of second recesses (12b) each being narrower than the first recess (11a) are provided at a second main surface (11b) in a portion corresponding to the non-mounting area (B).

Description

Circuit module

The present invention relates to a circuit module in which a plurality of electronic components are mounted on a wiring board.

Conventionally, various technologies have been proposed as a technique for constructing a circuit module so that it can be bent. For example, in Japanese Patent Application Laid-Open No. 2011-249534 (Patent Document 1), a flexible circuit board portion having an electrically insulating insulating resin layer and a wiring layer is laminated so as to cover one side of a plate-shaped base material, and has a plate shape. A foldable wiring board is disclosed in which a groove for facilitating a part of the plate-shaped base material is formed on one or both surfaces of the plate-shaped base material. This bendable wiring board can be easily bent into a three-dimensional shape by bending at the position where the groove of the plate-shaped base material is formed.

Japanese Unexamined Patent Publication No. 2011-249534

Generally, when a wiring board is bent, a compressive stress acts on one of a pair of main surfaces of the wiring board, and a tensile stress acts on the other. The compressive stress and the tensile stress are applied not only to the bent portion of the wiring board but also to the periphery thereof.

Therefore, the electronic component is usually mounted at a predetermined distance from the bent portion so that the compressive stress and the tensile stress do not adversely affect the joint portion of the electronic component with respect to the wiring board. As a result, when the circuit module is configured to be bendable, the non-mounting area where the electronic components are not mounted inevitably becomes large, which hinders the high integration of the circuit module.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to narrow the non-mounting area in which electronic components are not mounted in a foldable circuit module. The purpose is to realize high integration of circuit modules.

A circuit module based on the first aspect of the present invention includes a wiring board having a first main surface and a second main surface located on the side opposite to the first main surface, and a plurality of electrons mounted on the wiring board. It is equipped with parts. The wiring board includes a first mounting area, a non-mounting area, and a second mounting area arranged side by side in the first direction. At least one of the plurality of electronic components is mounted in the first mounting area and the second mounting area. The non-mounting area is arranged between the first mounting area and the second mounting area, and extends from one end to the other end of the wiring board in the second direction intersecting the first direction. Exists. None of the plurality of electronic components is mounted in the non-mounting region. A single first recess extending along the second direction is provided on the first main surface of the portion corresponding to the non-mounting region. On the second main surface of the portion corresponding to the non-mounting region, a plurality of second recesses extending along the second direction, each having a width narrower than the width of the single first recess, are formed. It is provided.

In the circuit module based on the first aspect of the present invention, by providing the single first recess and the plurality of second recesses, the non-mounting region is provided along the second direction. It is preferable that an easily deformable portion extending in the direction of the above-mentioned second direction and a difficult-to-deformate portion extending along the second direction are provided. In that case, it is preferable that a region in which the easily deformable portion, the difficult deformable portion, and the easily deformable portion are arranged in this order in the first direction is formed in the non-mounting region.

In the circuit module based on the first aspect of the present invention, the center line of the single first recess and the plurality of second recesses when viewed from a direction orthogonal to the first main surface. It is preferable that the center lines do not overlap each other.

In the circuit module based on the first aspect of the present invention, the plurality of second recesses may be two, and in that case, the circuit module is viewed from a direction orthogonal to the first main surface. In some cases, it is preferable that the center line of the single first recess is sandwiched between the center lines of the two second recesses.

In the circuit module based on the first aspect of the present invention, the two second recesses do not protrude from the first recess when viewed from a direction orthogonal to the first main surface. It may be provided so as to overlap.

In the circuit module based on the first aspect of the present invention, when the two second recesses are viewed from a direction orthogonal to the first main surface, the first recess does not overlap with the first recess. It may be provided so as to sandwich one recess.

A circuit module based on the second aspect of the present invention includes a wiring board having a first main surface and a second main surface located on the side opposite to the first main surface, and a plurality of electrons mounted on the wiring board. It is equipped with parts. The wiring board includes a first mounting area, a non-mounting area, and a second mounting area arranged side by side in the first direction. At least one of the plurality of electronic components is mounted in the first mounting area and the second mounting area. The non-mounting area is arranged between the first mounting area and the second mounting area, and extends from one end to the other end of the wiring board in the second direction intersecting the first direction. Exists. None of the plurality of electronic components is mounted in the non-mounting region. A plurality of first recesses extending along the second direction are provided on the first main surface of the portion corresponding to the non-mounting region. On the second main surface of the portion corresponding to the non-mounting region, a plurality of second recesses extending along the second direction, each having a width narrower than the width of each of the plurality of first recesses. Is provided.

In the circuit module based on the second aspect of the present invention, by providing the plurality of first recesses and the plurality of second recesses, the non-mounting region is provided along the second direction. It is preferable that an easily deformable portion extending and a difficult deformable portion extending along the second direction are provided. In that case, it is preferable that a region in which the easily deformable portion, the difficult deformable portion, and the easily deformable portion are arranged in this order in the first direction is formed in the non-mounting region.

In the circuit module based on the second aspect of the present invention, the plurality of first recesses may be two, and the plurality of second recesses may be two. .. In that case, one of the two second recesses overlaps without protruding from one of the two first recesses when viewed from a direction orthogonal to the first main surface. The other of the two second recesses is eaten from the other of the two first recesses when viewed from a direction orthogonal to the first main surface. It is preferable that they are provided so as to overlap without protruding.

The circuit module based on the first and second aspects of the present invention may further include a sealing portion provided on the first main surface. In that case, the electronic components mounted in the first mounting region among the plurality of electronic components include those mounted on the first main surface, and among the plurality of electronic components. When the electronic component mounted in the second mounting region includes the one mounted on the first main surface, the sealing portion is included in the plurality of electronic components together with the wiring board. It is preferable that the electronic component mounted on the first main surface of the above is sealed. Further, in that case, it is preferable that a slit-shaped notch portion leading to the first recess is provided at a position corresponding to the first recess in the sealing portion.

The circuit module based on the first and second aspects of the present invention may further include a film-like electromagnetic shield provided on the first main surface side. In that case, the electromagnetic shield defines the notch as well as on the surface of the sealing portion on the side opposite to the wiring board side so that the sealing portion is not exposed. It may also be provided on the surface of the sealing portion of the portion. Further, in that case, the electromagnetic shield may be provided on the surface of the wiring board at the portion defining the first recess.

In the circuit module based on the first and second aspects of the present invention, the second portion of the electromagnetic shield is located on the surface of the wiring board in the portion defining the first recess. It is preferable that a slit-shaped dividing portion extending along the direction of the above is provided.

According to the present invention, in a circuit module configured to be bendable, the non-mounting area in which electronic components are not mounted can be narrowed, and as a result, highly integrated circuit modules can be realized.

It is a schematic plan view of the circuit module which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view of the circuit module which concerns on Embodiment 1. FIG. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the first embodiment. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the first embodiment in a mountain-folded state. FIG. 5 is an enlarged cross-sectional view of a main part in a state where the circuit module according to the first embodiment is valley-folded. It is a schematic cross-sectional view which shows an example of the manufacturing method of the circuit module which concerns on Embodiment 1. FIG. It is a figure which schematically represented the measurement method and the measurement result of the strength of the non-mounting region of the circuit module which concerns on Embodiment 1. FIG. It is an enlarged cross-sectional view of the main part of the circuit module which concerns on 1st modification. It is an enlarged cross-sectional view of the main part of the circuit module which concerns on the 2nd modification. It is a schematic cross-sectional view of the circuit module which concerns on 3rd modification. It is a schematic plan view of the circuit module which concerns on 4th modification. It is a schematic cross-sectional view of the circuit module which concerns on 5th modification. It is a schematic cross-sectional view of the circuit module which concerns on 6th modification. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the second embodiment. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the second embodiment in a mountain-folded state. FIG. 5 is an enlarged cross-sectional view of a main part in a state where the circuit module according to the second embodiment is valley-folded. It is a figure which schematically represented the measurement method and the measurement result of the strength of the non-mounting region of the circuit module which concerns on Embodiment 2. FIG. It is an enlarged cross-sectional view of the main part of the circuit module which concerns on 7th modification. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the third embodiment. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the fourth embodiment. FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the fourth embodiment in a mountain-folded state. FIG. 5 is an enlarged cross-sectional view of a main part in a state where the circuit module according to the fourth embodiment is valley-folded. It is a figure which schematically represented the measurement method and the measurement result of the strength of the non-mounting region of the circuit module which concerns on Embodiment 4. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments shown below, the same or common parts are designated by the same reference numerals in the drawings, and the description thereof will not be repeated.

(Embodiment 1)
1 and 2 are a schematic plan view and a schematic cross-sectional view showing a schematic structure of a circuit module according to a first embodiment of the present invention, and FIG. 3 is an enlarged cross-sectional view showing a detailed structure of a main part. Is. Here, FIG. 2 is a schematic cross-sectional view taken along the line II-II shown in FIG. 1, and FIG. 3 is an enlarged view of the region III shown in FIG. First, the structure of the circuit module 1A according to the present embodiment will be described with reference to FIGS. 1 to 3.

As shown in FIGS. 1 and 2, the circuit module 1A has a flat thin plate-like outer shape having a rectangular shape in a plan view. The circuit module 1A mainly includes a wiring board 10, a plurality of electronic components 20, a sealing portion 30, and an electromagnetic shield 40. The circuit module 1A according to the present embodiment is a so-called high-frequency circuit module that is supposed to be incorporated in various communication devices and the like. Therefore, the plurality of electronic components 20 described above include RF (Radio Frequency) components, and the electromagnetic shield 40 described above is provided to shield electromagnetic waves.

The wiring board 10 is a base of the circuit module 1A, and has a first main surface 11 and a second main surface 12 located on the opposite side of the first main surface 11. The wiring board 10 is composed of, for example, a flexible wiring board or a rigid wiring board having a flat plate shape in a state where no external force is applied (that is, a no-load state in which no load is applied from the outside).

Here, the flexible wiring board is formed by patterning, for example, wiring made of copper or the like on a base material made of, for example, a polyimide resin or polyethylene terephthalate resin, and can be deformed relatively flexibly. It is a wiring board that can be used. On the other hand, the rigid wiring board is a relatively hard wiring board formed by patterning wiring made of, for example, copper or the like on a base material made of, for example, glass epoxy resin or the like.

The plurality of electronic components 20 are all mounted on the wiring board 10. More specifically, all of the plurality of electronic components 20 are mounted on the first main surface 11 of the wiring board 10 and mounted on the first main surface 11. These plurality of electronic components 20 are electrically connected to each other by wiring provided on the wiring board 10, whereby various circuits are formed in the circuit module 1A.

The sealing portion 30 is provided on the first main surface 11 of the wiring board 10 on which the plurality of electronic components 20 are mounted, and seals the plurality of electronic components 20 together with the wiring board 10. The sealing portion 30 is preferably made of an insulating material having excellent weather resistance, and is made of a resin material such as a polyimide resin, a polyethylene terephthalate resin, or an epoxy resin, for example.

The electromagnetic shield 40 is provided on the first main surface 11 side of the wiring board 10 on which a plurality of electronic components 20 are mounted, and more specifically, the sealing portion 30 covers the surface of the sealing portion 30. It consists of a film-like member provided on the top. The electromagnetic shield 40 needs to be made of a conductive material, for example, a film made of copper, a laminated film of copper and stainless steel, and the like. The electromagnetic shield 40 can shield electromagnetic waves by, for example, being grounded to a ground potential provided on the wiring board 10.

Here, the circuit module 1A according to the present embodiment is configured to be bendable, and more specifically, it is not bent in a bent state due to the action or non-action of an external force. It is configured so that it can be repeatedly transformed into a state (that is, it can be repeatedly bent). Specifically, the circuit module 1A has a portion of the circuit module 1A whose thickness is thinner than that of other portions, and the circuit module 1A is configured to be bendable from the portion. There is.

However, if a part of the circuit module is simply thinned, the thinned portion may lack strength, and the portion may be damaged during bending. On the other hand, in order to prevent damage, if the portion is forcibly bent without making a part of the circuit module sufficiently thin, stress acts even around the portion. Therefore, as described above, it is inevitably necessary to form a large non-mounting region in which electronic components are not mounted, which hinders high integration of circuit modules.

In this regard, in the circuit module 1A according to the present embodiment, as shown in FIGS. 1 to 3, the circuit module 1A is provided with a plurality of notched portions H1 and H2 having a predetermined shape. A thin portion having a specific structure is provided, thereby solving the above-mentioned problems. This point will be described in detail below.

As shown in FIGS. 1 to 3 (particularly as shown in FIG. 3), the wiring board 10 is divided into a first mounting area A1, a second mounting area A2, and a non-mounting area B. The first mounting area A1 and the second mounting area A2 are areas in which at least one of the plurality of electronic components 20 described above is mounted, and the non-mounting area B is any of the plurality of electronic components 20 described above. Is an area where is not implemented.

The non-mounting area B is a second direction (that is, a direction orthogonal to the first direction (that is, the left-right direction in FIGS. 1 to 3) in which the first mounting area A1 and the second mounting area A2 are arranged. , The vertical direction in FIG. 1 and the direction orthogonal to the paper surface in FIGS. 2 and 3). The non-mounting area B has a predetermined width in the direction in which the first mounting area A1 and the second mounting area A2 are arranged, and is located at both ends of the circuit module 1A along the direction in which the non-mounting area B extends. Has reached (see Fig. 2).

As shown in FIGS. 1 to 3, the portion of the circuit module 1A on the first main surface 11 side of the wiring board 10, which is the side on which the plurality of electronic components 20, the sealing portion 30, and the electromagnetic shield 40 are provided. In addition, in the portion corresponding to the non-mounting area B described above, a single groove-shaped first notch H1 as a first recess extending along the extending direction of the non-mounting area B is provided. Has been done.

As shown in FIG. 3, the single groove-shaped first notched portion H1 has a first groove portion 11a provided on the first main surface 11 of the wiring board 10 and a slit-shaped portion provided on the sealing portion 30. It is mainly composed of the notch portion 31 of the above. The first groove portion 11a is formed so as to extend along the extending direction of the non-mounting region B on the first main surface 11 of the portion corresponding to the non-mounting region B, and is relative to the second groove portion 12a described later. It is configured to be wide. The cutout portion 31 is formed at a position corresponding to the first groove portion 11a so that the cutout portion 31 extends along the extending direction of the non-mounting region B with a width equivalent to that of the first groove portion 11a. Is located in.

Here, the electromagnetic shield 40 defines the notch portion 31 described above as well as on the surface of the sealing portion 30 opposite to the wiring board 10 side so that the sealing portion 30 is not exposed. It is also provided on the surface of the sealing portion 30 of the portion. Further, the electromagnetic shield 40 is also provided on the surface of the wiring board 10 at the portion defining the first groove portion 11a. As a result, the portion of the circuit module 1A provided with the single groove-shaped first notched portion H1 described above is completely covered by the electromagnetic shield 40.

On the other hand, as shown in FIGS. 2 and 3, the second main surface 12 of the wiring board 10 on the circuit module 1A is the side on which the plurality of electronic components 20, the sealing portion 30, and the electromagnetic shield 40 are not provided. A plurality of groove-shaped second cutout portions H2 as second recesses extending along the extending direction of the non-mounting region B in the portion on the side and corresponding to the non-mounting region B described above. Is provided.

As shown in FIG. 3, each of the plurality of second cutout portions H2 is composed of a second groove portion 12a provided on the second main surface 12 of the wiring board 10. The second groove portion 12a is formed so as to extend along the extending direction of the non-mounting region B on the second main surface 12 of the portion corresponding to the non-mounting region B, and is relative to the first groove portion 11a described above. The width is narrow.

Here, as shown in FIGS. 1 to 3, in the present embodiment, when viewed from a direction orthogonal to the first main surface 11 of the wiring board 10, the center line of the single first groove portion 11a is used. The center lines of the plurality of second groove portions 12a are arranged so as not to overlap each other. With this configuration, a plurality of easily deformable portions that are more easily deformed than other parts of the non-mounting region B are formed in the non-mounting region B. Each of the plurality of easily deformable portions extends along the extending direction of the non-mounting region B and is positioned so as to be aligned in the width direction of the non-mounting region B.

More specifically, in the present embodiment, two second groove portions 12a are provided on the second main surface 12 of the wiring board 10. These two second groove portions 12a are provided so as to overlap the first groove portion 11a without protruding from the first groove portion 11a when viewed from a direction orthogonal to the first main surface 11 of the wiring board 10. There is. Further, the center line of the single first groove portion 11a is sandwiched between the center lines of these two second groove portions 12a when viewed from a direction orthogonal to the first main surface 11 of the wiring board 10.

With this configuration, in the present embodiment, two easily deformable portions that can be significantly deformed in the non-mounting region B are formed. That is, assuming that a portion of the non-mounting area B that is harder to deform than the easily deformable part is a hard-to-deform part, the non-mounting area B is hard-to-deform from the first mounting area A1 side to the second mounting area A2 side. These are located in the order of the part, the easily deformed part, the easily deformed part, the easily deformed part, and the easily deformed part.

Therefore, when an external force is applied to the circuit module 1A according to the present embodiment so as to bend the circuit module 1A, the following deformation occurs.

FIG. 4 is an enlarged cross-sectional view of a main part of the circuit module according to the present embodiment in a mountain-folded state. The state shown in FIG. 4 is a case where an external force is applied to the circuit module 1A in the direction of the arrow AR1 shown in FIG. 2, and in this case, the circuit module 1A is as shown in FIG. The non-mounting area B has a shape protruding upward from the first mounting area A1 and the second mounting area A2.

In the state where the circuit module 1A is mountain-folded, the circuit module 1A is bent from the two easily deformable portions provided in the non-mounting region B described above, and more specifically, these two easily deformable portions are bent. A large deformation occurs in the wiring substrate 10 of the portion corresponding to the above and the electromagnetic shield 40 covering the portion, and the occurrence of the deformation is suppressed in the remaining portion.

At this time, the surface layer portion of the wiring board 10 of the portion located in the non-mounting region B and defining the bottom surface of the single first groove portion 11a and the electromagnetic shield 40 of the portion covering the surface layer portion are covered with the electromagnetic shield 40. A tensile stress of a predetermined magnitude acts. On the other hand, the sealing portion 30, which is a thicker portion, is provided with a slit-shaped notch 31 in the portion corresponding to the non-mounting region B, so that the portion adjacent to the notch 31 is provided. No noticeable stress is generated in the sealing portion 30 of the above.

On the other hand, a compressive stress of a predetermined magnitude acts on the surface layer portion on the second main surface 12 side of the wiring board 10 located in the non-mounting region B. However, since the second main surface 12 of the wiring board 10 of the portion is provided with the above-mentioned two second groove portions 12a, this compressive stress is a portion located between the two second groove portions 12a. Further, the wiring board 10 is concentrated on the portion of the wiring board 10 that defines the two second groove portions 12a, and the effect of this on the first mounting region A1 side and the second mounting region A2 side is greatly reduced.

FIG. 5 is an enlarged cross-sectional view of a main part of the circuit module according to the present embodiment in a valley-folded state. The state shown in FIG. 5 is a case where an external force is applied to the circuit module 1A in the direction of the arrow AR2 shown in FIG. 2, and in this case, the circuit module 1A is as shown in FIG. The non-mounting area B has a shape protruding downward from the first mounting area A1 and the second mounting area A2.

In the state where the circuit module 1A is valley-folded, the circuit module 1A is bent from the two easily deformable portions provided in the non-mounting region B described above, and more specifically, these two easily deformable portions are bent. A large deformation occurs in the wiring substrate 10 of the portion corresponding to the above and the electromagnetic shield 40 covering the portion, and the occurrence of the deformation is suppressed in the remaining portion.

At this time, the surface layer portion of the wiring board 10 of the portion located in the non-mounting region B and defining the bottom surface of the single first groove portion 11a and the electromagnetic shield 40 of the portion covering the surface layer portion are covered with the electromagnetic shield 40. A compressive stress of a predetermined magnitude acts. On the other hand, the sealing portion 30, which is a thicker portion, is provided with a slit-shaped notch 31 in the portion corresponding to the non-mounting region B, so that the portion adjacent to the notch 31 is provided. No noticeable stress is generated in the sealing portion 30 of the above.

On the other hand, a tensile stress of a predetermined magnitude acts on the surface layer portion on the second main surface 12 side of the wiring board 10 located in the non-mounting region B. However, since the above-mentioned two second groove portions 12a are provided on the second main surface 12 of the wiring board 10 of the portion, this tensile stress is a portion located between these two second groove portions 12a. Further, the wiring board 10 is concentrated on the portion of the wiring board 10 that defines the two second groove portions 12a, and the effect of this on the first mounting region A1 side and the second mounting region A2 side is greatly reduced.

Therefore, by using the circuit module 1A according to the present embodiment, even when the circuit module 1A is bent in the non-mounting region B, the stress acting on the non-mounting region B can be remarkably relaxed. Not only that, it is possible to significantly prevent the stress from reaching the periphery of the non-mounting region B. Therefore, it becomes possible to narrow the non-mounting region B, which is a region in which the plurality of electronic components 20 are not mounted, and as a result, contributes to high integration of the circuit module 1A.

Here, as described above, the two second groove portions 12a provided on the second main surface 12 side of the wiring board 10 are the surface layer portions of the second main surface 12 of the wiring board 10 when the circuit module 1A is bent. It functions as a portion that suppresses the stress that acts on the first mounting region A1 and the second mounting region A2 from propagating. Therefore, referring to FIG. 3, the region sandwiched by these two second groove portions 12a corresponds to the deformation region R1 in which the deformation is intentionally concentrated in the region when the circuit module 1A is bent. Therefore, the regions on both outer sides of the deformation region R1 correspond to the non-deformation region R2 in which deformation does not occur as much as possible when the circuit module 1A is bent.

Therefore, of the deformed region R1 and the non-deformed region R2, a plurality of electronic components 20 mounted on the wiring board 10 by providing the first mounting region A1 and the second mounting region A2 described above in the non-deformable region R2. It is possible to suppress the influence of the above-mentioned stress on all of the above. Although a considerable amount of stress is concentrated in the above-mentioned deformation region R1, if the thickness of the portion is increased to some extent, sufficient strength can be secured as compared with the case where the wiring board 10 is simply thinned. Therefore, it is possible to significantly suppress the occurrence of breakage due to repeated bending.

Here, the circuit module 1A according to the present embodiment has a range of motion (that is, a mountain fold and a valley fold) depending on the positional relationship in which the first cutout portion H1 and the second cutout portion H2 are provided. There is a merit that a large range of allowable bending angles) can be secured. In that case, the movable range varies depending on whether the wiring board 10 is a flexible wiring board or an acute wiring board, and how thick the wiring board 10 is, but especially if it is a flexible wiring board, the bending angle is changed. It is also quite possible to go beyond obtuse and right angles to acute angles.

As described above, the circuit module 1A according to the present embodiment is configured so that it can be repeatedly bent, but the circuit module 1A is not necessarily limited to being used in such a manner, and is intended. It can also be used to bend it and maintain its post-folded state (ie, permanently fold).

Further, in the circuit module 1A according to the present embodiment, a case where the second groove portion 12a, which is the second cutout portion H2 described above, is formed by grooves formed so as to extend continuously is illustrated. As described above, this may be composed of discontinuously divided perforated or dotted grooves. Even in that case, the above-mentioned effects can be obtained to a considerable extent.

FIG. 6 is a schematic cross-sectional view showing an example of a method for manufacturing a circuit module according to the present embodiment. Next, an example of the manufacturing method of the circuit module 1A according to the present embodiment will be described with reference to FIG.

First, as shown in FIG. 6A, a plurality of electronic components 20 are mounted on the first main surface 11 of the wiring board 10. At that time, none of the electronic components are mounted in the non-mounting region B which is the base point of bending. Various methods such as flow soldering, reflow soldering, bonding with a conductive adhesive, or a combination thereof can be applied to the mounting of the electronic component 20 on the wiring board 10.

Next, as shown in FIG. 6B, a sealing portion 30 is formed on the first main surface 11 of the wiring board 10 so as to cover all of the plurality of electronic components 20. At this time, not only the first mounting area A1 and the second mounting area A2 on which the plurality of electronic components 20 are mounted, but also the non-mounting area B on which these are not mounted are covered by the sealing portion 30 so as to cover them. It is formed. Various methods such as a method using a vacuum laminator, a method using a dispenser, a screen printing method, and an inkjet method can be applied to the formation of the sealing portion 30.

Next, as shown in FIG. 6C, a single first missing portion H1 is formed at predetermined positions of the wiring board 10 and the sealing portion 30. Specifically, a slit-shaped notch 31 (see FIG. 3 and the like) is formed in the sealing portion 30 of the portion corresponding to the non-mounting region B, and the wiring board 10 of the portion corresponding to the non-mounting region B is formed. By forming the first groove portion 11a (see FIG. 3 and the like) on the first main surface 11 of the above, the first cutout portion H1 is provided in the non-mounting region B. Here, the cutout portion 31 and the first groove portion 11a are preferably formed by a single machining at the same time, and for example, a cutting machining using a cutting tool, a laser machining using a laser irradiation device, or the like can be used.

Next, as shown in FIG. 6D, a plurality of second cutout portions H2 are formed at predetermined positions on the wiring board 10. Specifically, a plurality of second groove portions 12a (see FIG. 3 and the like) are formed on the second main surface 12 of the wiring board 10 in the portion corresponding to the non-mounting region B, whereby a plurality of second groove portions 12a (see FIG. 3 and the like) are formed in the non-mounting region B. The second cutout portion H2 is provided. Here, for forming the second groove portion 12a, for example, cutting processing using a cutting tool, laser processing using a laser irradiation device, or the like can be used.

After that, the electromagnetic shield 40 is formed by, for example, a sputtering method so as to cover the surface of the sealing portion 30. At that time, the electromagnetic shield is provided not only on the surface of the sealing portion 30 opposite to the wiring board 10 side, but also on the surface of the sealing portion 30 of the portion defining the notch portion 31 described above. Further, it is also provided on the surface of the wiring board 10 at the portion defining the first groove portion 11a.

From the above, the circuit module 1A according to the above-described embodiment can be manufactured very easily. The formation of the second groove portion 12a to be the plurality of second cutout portions H2 described above can also be performed after the electromagnetic shield 40 is formed.

FIG. 7 is a diagram schematically showing a method for measuring the strength of the non-mounting region of the circuit module according to the present embodiment and the measurement result. Hereinafter, with reference to FIG. 7, a method for measuring the strength of the non-mounting region B of the circuit module 1A and the measurement result according to the present embodiment will be described in detail.

The circuit module 1A according to the present embodiment described above has a single first cutout portion H1 having a relatively wide width in a portion corresponding to the non-mounting region B and a plurality of second cutouts having a relatively narrow width. By providing the part H2, a plurality of easily deformable parts that are more easily deformed than other parts of the non-mounting area B are provided in the non-mounting area B, each of which is along the extending direction of the non-mounting area B. It is provided so as to extend and line up in the width direction of the non-mounting area B. Whether or not a plurality of easily deformable portions are provided in the non-mounting region B can be measured by, for example, the following method.

As shown in FIG. 7A, when measuring the strength of the non-mounting region B of the circuit module 1A, a plurality of samples of the circuit module 1A are prepared, and the upper plate-shaped member 101 and the upper plate-shaped member 101 as the measuring jig 100 and the measuring jig 100 are prepared. A pair of metal plate-shaped members composed of the lower plate-shaped member 102 is used. Each of the upper plate-shaped member 101 and the lower plate-shaped member 102 is divided into two by a dividing line DL located on the same plane.

The upper plate-shaped member 101 is addressed to the surface of each sample on the side where the electromagnetic shield 40 is provided, and the lower plate-shaped member 102 is addressed to the surface of each sample on the side where the wiring board 10 is located. As a result, each sample is sandwiched and held by the measuring jig 100. At that time, each of the measuring jigs 100 is provided so that the extending direction of the division line DL described above matches the extending direction of the non-mounting region B (that is, the direction orthogonal to the paper surface in FIG. 7A). Attached to the sample.

Here, the position in the direction orthogonal to the extending direction of the non-mounting area B (that is, the left-right direction in FIG. 7A) where the above-mentioned division line DL is arranged is within the range of the non-mounting area B. Therefore, the interval is set to be sufficiently smaller than the width of the non-mounting area B. The position where the dividing line DL is arranged is the measurement point MP for strength measurement. Note that FIG. 7A exemplifies a sample in which the dividing line DL is arranged at the boundary between the non-mounting area B and the first mounting area A1.

After that, in each sample, a load is applied downward at the pressurizing position PP shown in the figure, and the applied load is gradually increased. Then, the load when the sample breaks is recorded. The graph shown in FIG. 7B is a plot of the results for each position of the non-mounting area B.

Here, the above-mentioned position shown in FIG. 7B is a position where the dividing line DL is arranged. For example, as shown in FIG. 7B, a specific measurement method will be described by exemplifying a case where a graph is created at seven positions (that is, seven plots p1 to p7 are taken in the horizontal axis direction). ..

First, using one of the plurality of samples, the position of the dividing line DL is arranged at the position corresponding to the plot p1 shown in the figure, and a load is applied until the sample breaks, and the breaking load at that time is applied. Obtained, and based on this, the position of the plot p1 in the vertical axis direction is determined.

Next, using the other one of the plurality of samples, the position of the dividing line DL is arranged at the position corresponding to the plot p2 shown in the figure, and a load is applied until the sample breaks. The breaking load is acquired, and based on this, the position of the plot p2 in the vertical axis direction is determined.

By repeating this procedure, the positions of the plots p3 to p7 in the vertical axis direction are sequentially determined. Then, a graph is created based on this. It should be noted that seven plots are not always required to create a graph, for example, only the 3rd to 5th plots from the left (that is, plots p3 to p5) may be used, or the 2nd to 6th plots from the left (that is, plots) may be used. Only p2 to p6) may be used.

As shown in FIG. 7B, in the circuit module 1A according to the present embodiment, since the non-mounting region B includes a plurality of easily deformable portions, the breaking load is relative to the surroundings in the graph. Then, a plurality of remarkably small peaks P will appear. In particular, in the circuit module 1A according to the present embodiment, in the non-mounting area B, from the first mounting area A1 side to the second mounting area A2 side, the hard-to-deform part, the easy-to-deform part, the hard-to-deform part, and the easy-to-deform part. Since these are configured to be located in the order of the deformed portion and the difficult-to-deform portion, two peaks P appear as shown in the graph.

The easily deformed part and the hard-to-deform part are determined by whether or not they are relatively easy to bend as compared with the surrounding parts in the non-mounting area. That is, the easily deformed portion means a portion of the non-mounting region that breaks with a smaller breaking load than the portion located adjacent to the portion, and the difficult-to-deform portion is a non-deformable portion. It means a part of the mounting area that breaks with a larger breaking load than the part located adjacent to the part.

(First modification)
FIG. 8 is an enlarged cross-sectional view of a main part of the circuit module according to the first modification. Hereinafter, the circuit module 1A1 according to this modification will be described with reference to FIG.

As shown in FIG. 8, the circuit module 1A1 according to the present modification has only the positions of the two second groove portions 12a provided on the wiring board 10 when compared with the circuit module 1A according to the first embodiment described above. Are different. Specifically, in the circuit module 1A1 according to the present modification, when the two second groove portions 12a are viewed from the direction orthogonal to the first main surface 11 of the wiring board 10, the first groove portion 11a is used. While it is provided so as to overlap the first groove portion 11a without protruding, one of the two second groove portions 12a is arranged at one end in the width direction of the first groove portion 11a, and the two second grooves are arranged. The other end of the groove portion 12a is arranged at the other end in the width direction of the first groove portion 11a.

Even in this configuration, the non-mounting area B includes a hard-to-deform part, an easy-to-deform part, a hard-to-deform part, an easy-to-deform part, and a hard-to-deform part from the first mounting area A1 side to the second mounting area A2 side. These will be located in the order of. Therefore, even with such a configuration, not only can the stress acting on the non-mounting region B be remarkably relaxed, but also the stress reaches the periphery of the non-mounting region B significantly. Can be suppressed. Therefore, by using the circuit module 1A1 according to the present modification, it is possible to obtain the same effect as that described in the first embodiment described above.

(Second modification)
FIG. 9 is an enlarged cross-sectional view of a main part of the circuit module according to the second modification. Hereinafter, the circuit module 1A2 according to this modification will be described with reference to FIG. 9.

As shown in FIG. 9, the circuit module 1A2 according to the present modification has a configuration of the bottom of a single groove-shaped first notch H1 when compared with the circuit module 1A according to the first embodiment described above. Only different. Specifically, in the circuit module 1A2 according to the present modification, a single groove-shaped third missing portion H3 is provided at the bottom of the first missing portion H1.

More specifically, the single groove-shaped third notch portion H3 includes a third groove portion 11b provided on the first main surface 11 of the wiring board 10 and a slit-shaped dividing portion provided on the electromagnetic shield 40. It is composed of 41 and. The third groove portion 11b is formed so as to extend along the extending direction of the non-mounting region B on the surface of the wiring board 10 of the portion defining the first groove portion 11a. The divided portion 41 is formed at a position corresponding to the third groove portion 11b, whereby the divided portion 41 is positioned so as to extend along the extending direction of the non-mounting region B with a width equivalent to that of the third groove portion 11b. doing.

When configured in this way, a slit shape extending along the extending direction of the non-mounting region B in the portion of the electromagnetic shield 40 located on the surface of the wiring board 10 of the portion defining the first groove portion 11a. The dividing portion 41 of the above is provided, and the electromagnetic shield 40 is divided by the dividing portion 41 to prevent stress from concentrating on the electromagnetic shield 40 of the portion when the circuit module 1A2 is bent. can.

Therefore, by using the circuit module 1A2 according to the present modification, not only the same effect as the effect described in the above-described first embodiment can be obtained, but also the electromagnetic shield 40 of the bent portion can be rolled up or the like. It is also possible to obtain the effect that damage can be prevented from occurring.

The circuit module 1A2 according to this modification is formed by forming the electromagnetic shield 40 and then performing a cutting process using a cutting tool, a laser processing using a laser irradiation device, or the like on the second cutting portion H3. At that time, not only the above-mentioned dividing portion 41 but also the third groove portion 11b was formed at the same time, but it is not always necessary to provide the third groove portion 11b, and only the dividing portion 41 is provided. You may be able to do it.

(Third modification example)
FIG. 10 is a schematic cross-sectional view of the circuit module according to the third modification. Hereinafter, the circuit module 1A3 according to this modification will be described with reference to FIG. 10.

As shown in FIG. 10, the circuit module 1A3 according to the present modification is different only in that a plurality of non-mounting regions are provided as compared with the circuit module 1A according to the first embodiment described above. .. Specifically, in the circuit module 1A3 according to this modification, three mounting areas of the first to third mounting areas are provided, and they are not mounted at two positions which are boundaries between them. The area is located. Here, the configuration of each of the two non-mounting regions is the same as the configuration of the non-mounting region B of the circuit module 1A in the above-described first embodiment.

In this configuration, the circuit module 1A3 can be folded into mountain folds (see arrow AR1 shown in the figure) and valley folds (see arrow AR2 shown in the figure) with one non-mounting area as the base point. The circuit module 1A3 can be folded into a mountain fold (see arrow AR1'shown in the figure) and a valley fold (see arrow AR2'shown in the figure) with the other non-mounting region as a base point.

(Fourth modification)
FIG. 11 is a schematic plan view of the circuit module according to the fourth modification. Hereinafter, the circuit module 1A4 according to this modification will be described with reference to FIG. 11.

As shown in FIG. 11, the circuit module 1A4 according to the present modification has a single groove-shaped first notch H1 and a plurality of grooves when compared with the circuit module 1A according to the first embodiment described above. The difference is that the second notched portion H2 in the shape is not provided so as to traverse the circuit module, whereby the non-mounting region is provided only on one end side of the circuit module.

In this configuration, the circuit module 1A4 can be bent only on one end side of the circuit module 1A4 provided with the above-mentioned non-mounting area. Therefore, if it is not necessary to bend the entire circuit module and it is sufficient to bend it locally, the non-mounting area can be further narrowed by adopting the configuration, and the circuit module can be highly integrated. Will be planned.

(Fifth modification)
FIG. 12 is a schematic cross-sectional view of the circuit module according to the fifth modification. Hereinafter, the circuit module 1A5 according to this modification will be described with reference to FIG. 12.

As shown in FIG. 12, the circuit module 1A5 according to the present modification is not provided with the electromagnetic shield 40 (see FIG. 2 and the like) only in comparison with the circuit module 1A according to the first embodiment described above. It is different. That is, although the plurality of electronic components 20 are all sealed by the sealing portion 30, the sealing portion 30 is not covered by the electromagnetic shield.

Even with such a configuration, the same effect as that described in the above-described first embodiment can be obtained. In particular, by adopting the above configuration, even in a circuit module that does not need to be provided with an electromagnetic shield (that is, a circuit module that is not a high-frequency circuit module), the non-mounting area, which is a region in which a plurality of electronic components are not mounted, is narrowed. As a result, it contributes to high integration of circuit modules.

(6th modification)
FIG. 13 is a schematic cross-sectional view of the circuit module according to the sixth modification. Hereinafter, the circuit module 1A6 according to this modification will be described with reference to FIG. 13.

As shown in FIG. 13, the circuit module 1A6 according to the present modification includes a sealing portion 30 and an electromagnetic shield 40 (see FIG. 2 and the like) when compared with the circuit module 1A according to the first embodiment described above. The only difference is that it is not. That is, none of the plurality of electronic components 20 is sealed by the sealing portion, and none of them is covered by the electromagnetic shield.

Even with such a configuration, the same effect as that described in the above-described first embodiment can be obtained. In particular, by adopting the above configuration, even in a circuit module that does not need to be provided with an electromagnetic shield (that is, a circuit module that is not a high frequency circuit module) and does not require particularly high weather resistance, a plurality of electrons are used. It is possible to narrow the non-mounting area, which is the area where components are not mounted, and as a result, contribute to high integration of circuit modules.

(Embodiment 2)
FIG. 14 is an enlarged cross-sectional view of a main part of the circuit module according to the second embodiment of the present invention. Further, FIG. 15 is an enlarged cross-sectional view of a main part of the circuit module according to the present embodiment in a mountain-folded state, and FIG. 16 is an enlarged cross-sectional view of a main part in a valley-folded state. Hereinafter, the circuit module 1B according to the present embodiment will be described with reference to FIGS. 14 to 16. The circuit module 1B according to the present embodiment differs only in the positions of the two second groove portions 12a provided on the wiring board 10 when compared with the circuit module 1A according to the above-described first embodiment. There is.

As shown in FIG. 14, the circuit module 1B according to the present embodiment is also viewed from a direction orthogonal to the first main surface 11 of the wiring board 10 as in the circuit module 1A according to the above-described first embodiment. In this case, the center line of the single first groove portion 11a and the center line of each of the plurality of second groove portions 12a are arranged so as not to overlap each other, and are arranged on the second main surface 12 of the wiring board 10. Two second groove portions 12a are provided.

However, in the circuit module 1B according to the present embodiment, unlike the circuit module 1A according to the above-described first embodiment, these two second groove portions 12a are orthogonal to the first main surface 11 of the wiring board 10. It is provided so as to sandwich the first groove portion 11a without overlapping the first groove portion 11a when viewed from the direction in which the first groove portion 11a is formed. Therefore, the center line of the single first groove portion 11a is sandwiched between the center lines of these two second groove portions 12a when viewed from a direction orthogonal to the first main surface 11 of the wiring board 10.

With this configuration, in the present embodiment, three easily deformable portions are formed in the non-mounting region B. That is, assuming that a portion of the non-mounting area B that is harder to deform than the easily deformable part is a hard-to-deform part, the non-mounting area B is hard-to-deform from the first mounting area A1 side to the second mounting area A2 side. These are located in the order of the part, the easily deformed part, the easily deformed part, the easily deformed part, the easily deformed part, the easily deformed part, and the easily deformed part.

Therefore, when an external force is applied to the circuit module 1B according to the present embodiment so as to bend the circuit module 1B, the following deformation occurs.

As shown in FIG. 15, in the state where the circuit module 1B is folded in a mountain, the circuit module 1B is bent with the three easily deformable portions provided in the non-mounting area B described above as a base point. At this time, the non-mounting area B of the circuit module 1B protrudes upward from the first mounting area A1 and the second mounting area A2, and the circuit module 1B is provided in the above-mentioned non-mounting area B and has three easy deformations. The circuit module 1B bends from the portion as a base point.

At that time, the surface layer portion of the wiring board 10 of the portion located in the non-mounting region B and defining the bottom surface of the single first groove portion 11a and the electromagnetic shield 40 of the portion covering the surface layer portion are covered with the electromagnetic shield 40. A tensile stress of a predetermined magnitude acts. On the other hand, the sealing portion 30, which is a thicker portion, is provided with a slit-shaped notch 31 in the portion corresponding to the non-mounting region B, so that the portion adjacent to the notch 31 is provided. No noticeable stress is generated in the sealing portion 30 of the above.

As shown in FIG. 16, in the state where the circuit module 1B is valley-folded, the circuit module 1A is bent with respect to the two easily deformable portions provided in the non-mounting region B described above. At this time, the non-mounting area B of the circuit module 1B protrudes downward from the first mounting area A1 and the second mounting area A2, and the circuit module 1B is provided in the above-mentioned non-mounting area B and has three easy deformations. The circuit module 1B bends from the portion as a base point.

At that time, the surface layer portion of the wiring board 10 of the portion located in the non-mounting region B and defining the bottom surface of the single first groove portion 11a and the electromagnetic shield 40 of the portion covering the surface layer portion are covered with the electromagnetic shield 40. A compressive stress of a predetermined magnitude acts. On the other hand, the sealing portion 30, which is a thicker portion, is provided with a slit-shaped notch 31 in the portion corresponding to the non-mounting region B, so that the portion adjacent to the notch 31 is provided. No noticeable stress is generated in the sealing portion 30 of the above.

Therefore, by using the circuit module 1B according to the present embodiment, even when the circuit module 1B is bent in the non-mounting region B, the stress acting on the non-mounting region B can be remarkably relaxed. Not only that, it is possible to significantly prevent the stress from reaching the periphery of the non-mounting region B. Therefore, it becomes possible to narrow the non-mounting region B, which is a region in which the plurality of electronic components 20 are not mounted, and as a result, it contributes to high integration of the circuit module 1B.

Here, as described above, the two second groove portions 12a provided on the second main surface 12 side of the wiring board 10 are the surface layer portions of the second main surface 12 of the wiring board 10 when the circuit module 1B is bent. It functions as a portion that suppresses the stress that acts on the first mounting region A1 and the second mounting region A2 from propagating. Therefore, referring to FIG. 14, the region sandwiched by these two second groove portions 12a corresponds to the deformation region R1 in which the deformation is intentionally concentrated in the region when the circuit module 1B is bent. Therefore, the regions on both outer sides of the deformation region R1 correspond to the non-deformation region R2 in which deformation does not occur as much as possible when the circuit module 1B is bent.

Here, the circuit module 1B according to the present embodiment has a range of motion (that is, an allowable bending angle) particularly in the case of valley folding due to the positional relationship in which the first cutout portion H1 and the second cutout portion H2 are provided. Since the first cutout part H1 and the second cutout part are provided so as not to overlap with each other, a usage state in which mountain folds and valley folds are alternately repeated. Also, there is a merit that high durability can be ensured. In that case, the movable range varies depending on whether the wiring board 10 is a flexible wiring board or an acute wiring board, and how thick the wiring board 10 is, but especially if it is a flexible wiring board, the bending angle is changed. It is also quite possible to go beyond obtuse and right angles to acute angles.

As described above, the circuit module 1B according to the present embodiment is configured so that it can be repeatedly bent, but the circuit module 1B is not necessarily limited to being used in such a manner, and is intended. It can also be used to bend it and maintain its post-folded state (ie, permanently fold).

Further, in the circuit module 1B according to the present embodiment, a case where the second groove portion 12a, which is the second cutout portion H2 described above, is formed by grooves formed so as to extend continuously is illustrated. As described above, this may be composed of discontinuously divided perforated or dotted grooves. Even in that case, the above-mentioned effects can be obtained to a considerable extent.

FIG. 17 is a diagram schematically showing a method for measuring the strength of the non-mounting region of the circuit module according to the present embodiment and the measurement result. Hereinafter, with reference to FIG. 17, a method for measuring the strength of the non-mounting region B of the circuit module 1B and the measurement result according to the present embodiment will be described in detail.

As shown in FIG. 17A, when measuring the strength of the non-mounting region B of the circuit module 1B according to the present embodiment, it is the same as the case of the circuit module 1A according to the above-described first embodiment. Measurement methods are available. That is, when measuring the strength of the non-mounting region B of the circuit module 1B, a plurality of samples of the circuit module 1B are prepared, and the measuring jig 100 composed of the upper plate-shaped member 101 and the lower plate-shaped member 102 is used. Used, the load applied to the sample at the time of breakage in each sample is recorded. The graph shown in FIG. 17B is a plot of the results for each position of the non-mounting area B.

As shown in FIG. 17B, in the circuit module 1B according to the present embodiment, since the non-mounting region B includes a plurality of easily deformable portions, in the graph, the breaking load is compared with the surroundings. Then, a plurality of remarkably small peaks P will appear. In particular, in the circuit module 1B according to the present embodiment, in the non-mounting area B, from the first mounting area A1 side to the second mounting area A2 side, the hard-to-deform part, the easy-to-deform part, the hard-to-deform part, and the easy-to-deform part. Since these are configured to be located in the order of the deformed portion, the easily deformed portion, the easily deformed portion, and the easily deformed portion, three peaks P appear as shown in the graph.

(7th modification)
FIG. 18 is an enlarged cross-sectional view of a main part of the circuit module according to the seventh modification. Hereinafter, the circuit module 1B1 according to this modification will be described with reference to FIG.

As shown in FIG. 18, the circuit module 1B1 according to the present modification has only the positions of the two second groove portions 12a provided on the wiring board 10 when compared with the circuit module 1B according to the second embodiment described above. Are different. Specifically, in the circuit module 1B1 according to the present modification, when the two second groove portions 12a are viewed from the direction orthogonal to the first main surface 11 of the wiring board 10, the first groove portion 11a is formed. While they are provided so as to sandwich the first groove portion 11a without overlapping, one of the two second groove portions 12a is arranged adjacent to one end in the width direction of the first groove portion 11a, and the two second grooves are arranged. The other end of the groove portion 12a is arranged adjacent to the other end in the width direction of the first groove portion 11a.

When configured in this way, in the non-mounting area B, from the first mounting area A1 side to the second mounting area A2 side, a hard-to-deform part, an easy-to-deform part, a hard-to-deform part, an easy-to-deform part, and a hard-to-deform part These will be located in the order of. Therefore, even with such a configuration, not only can the stress acting on the non-mounting region B be remarkably relaxed, but also the stress reaches the periphery of the non-mounting region B significantly. Can be suppressed. Therefore, by using the circuit module 1B1 according to the present modification, it is possible to obtain the same effect as that described in the second embodiment described above.

(Embodiment 3)
FIG. 19 is an enlarged cross-sectional view of a main part of the circuit module according to the third embodiment of the present invention. Hereinafter, the circuit module 1C according to the present embodiment will be described with reference to FIG. 19. The circuit module 1C according to the present embodiment has only the positions of the two second groove portions 12a provided on the wiring board 10 when compared with the

circuit modules

1A and 1B according to the above-described first and second embodiments. Are different.

As shown in FIG. 19, the circuit module 1C according to the present embodiment is also orthogonal to the first main surface 11 of the wiring board 10 as in the

circuit modules

1A and 1B according to the above-described first and second embodiments. When viewed from the direction, the center line of the single first groove portion 11a and the center line of each of the plurality of second groove portions 12a are arranged so as not to overlap each other, and the second wiring board 10 is arranged so as not to overlap each other. Two second groove portions 12a are provided on the main surface 12.

However, in the circuit module 1C according to the present embodiment, unlike the

circuit modules

1A and 1B according to the above-described first and second embodiments, these two second groove portions 12a are the first main main of the wiring board 10. When viewed from a direction orthogonal to the surface 11, the first groove portion 11a is provided so that a part of the portion overlaps the first groove portion 11a and the remaining portion does not overlap the first groove portion 11a. Therefore, the center line of the single first groove portion 11a is sandwiched between the center lines of these two second groove portions 12a when viewed from a direction orthogonal to the first main surface 11 of the wiring board 10.

Even in this configuration, the non-mounting area B includes a hard-to-deform part, an easy-to-deform part, a hard-to-deform part, an easy-to-deform part, and a hard-to-deform part from the first mounting area A1 side to the second mounting area A2 side. These will be located in the order of. Therefore, even with such a configuration, not only can the stress acting on the non-mounting region B be remarkably relaxed, but also the stress reaches the periphery of the non-mounting region B significantly. Can be suppressed. Therefore, by using the circuit module 1C according to the present embodiment, it is possible to obtain the same effect as the effect described in the above-described second embodiment.

(Embodiment 4)
FIG. 20 is an enlarged cross-sectional view of a main part of the circuit module according to the fourth embodiment of the present invention. Further, FIG. 21 is an enlarged cross-sectional view of a main part of the circuit module according to the present embodiment in a mountain-folded state, and FIG. 22 is an enlarged cross-sectional view of a main part in a valley-folded state. Hereinafter, the circuit module 1D according to the present embodiment will be described with reference to FIGS. 20 to 22. The circuit module 1D according to the present embodiment is mainly different in the configuration of the first groove portion 11a provided on the wiring board 10 when compared with the circuit module 1A according to the first embodiment described above.

As shown in FIG. 20, in the circuit module 1D according to the present embodiment, the first main surface 11 of the wiring board 10 on the side where the plurality of electronic components 20, the sealing portion 30, and the electromagnetic shield 40 are provided. A plurality of groove-shaped first cutout portions H1 as first recesses extending along the extending direction of the non-mounting area B are provided on the side portion and corresponding to the non-mounting area B. It is provided.

Each of the plurality of groove-shaped first cutout portions H1 includes a first groove portion 11a provided on the first main surface 11 of the wiring board 10 and a slit-shaped cutout portion 31 provided on the sealing portion 30. It is mainly composed of. The first groove portion 11a is formed so as to extend along the extending direction of the non-mounting region B on the first main surface 11 of the portion corresponding to the non-mounting region B, and is relative to the second groove portion 12a described later. It is configured to be wide. The cutout portion 31 is formed at a position corresponding to the first groove portion 11a so that the cutout portion 31 extends along the extending direction of the non-mounting region B with a width equivalent to that of the first groove portion 11a. Is located in.

Here, the electromagnetic shield 40 defines the notch portion 31 described above as well as on the surface of the sealing portion 30 opposite to the wiring board 10 side so that the sealing portion 30 is not exposed. It is also provided on the surface of the sealing portion 30 of the portion. Further, the electromagnetic shield 40 is also provided on the surface of the wiring board 10 at the portion defining the first groove portion 11a. As a result, the portion of the circuit module 1D provided with the plurality of groove-shaped first notched portions H1 described above is completely covered by the electromagnetic shield 40.

On the other hand, the portion of the circuit module 1D on the second main surface 12 side of the wiring board 10, which is the side on which the plurality of electronic components 20, the sealing portion 30, and the electromagnetic shield 40 are not provided, and is described above. A plurality of groove-shaped second cutout portions H2 as second recesses extending along the extending direction of the non-mounting region B are provided in the portion corresponding to the non-mounting region B.

Each of the plurality of second cutout portions H2 is composed of a second groove portion 12a provided on the second main surface 12 of the wiring board 10. The second groove portion 12a is formed so as to extend along the extending direction of the non-mounting region B on the second main surface 12 of the portion corresponding to the non-mounting region B, and is relative to the first groove portion 11a described above. The width is narrow.

Here, in the present embodiment, the first main surface 11 of the wiring board 10 is provided with two first groove portions 11a, and the second main surface 12 of the wiring board 10 is provided with two second grooves. A groove 12a is provided. One of the two second groove portions 12a is provided so as to overlap without protruding from one of the two first groove portions 11a when viewed from a direction orthogonal to the first main surface 11. The other of the two second groove portions 12a is provided so as to overlap without protruding from the other of the two first groove portions 11a when viewed from a direction orthogonal to the first main surface 11. There is.

Therefore, when an external force is applied to the circuit module 1D according to the present embodiment so as to bend the circuit module 1D, the following deformation occurs.

As shown in FIG. 21, when the circuit module 1D is folded in a mountain, the circuit module 1D is bent with the two easily deformable portions provided in the non-mounting region B described above as a base point. At this time, the non-mounting area B of the circuit module 1D protrudes upward from the first mounting area A1 and the second mounting area A2, and the circuit module 1D is provided in the non-mounting area B described above and has two easily deformed parts. The circuit module 1D will be bent with the part as the base point.

At that time, the electromagnetic shield 40 of the portion of the wiring board 10 that is located in the non-mounting region B and defines the bottom surface of each of the plurality of first groove portions 11a and the portion that covers the surface layer portion. , A tensile stress of a predetermined magnitude acts. On the other hand, since the sealing portion 30, which is a thicker portion, is provided with a plurality of slit-shaped cutout portions 31 in the portion corresponding to the non-mounting region B, the sealing portion 30 is adjacent to the cutout portion 31. No noticeable stress is generated in the sealing portion 30 of the portion to be sealed.

As shown in FIG. 22, in the state where the circuit module 1D is valley-folded, the circuit module 1D is bent with respect to the two easily deformable portions provided in the non-mounting region B described above. At this time, the non-mounting area B of the circuit module 1D protrudes downward from the first mounting area A1 and the second mounting area A2, and the circuit module 1D is provided in the above-mentioned non-mounting area B and has two easily deformed parts. The circuit module 1D will be bent with the part as the base point.

At that time, the electromagnetic shield 40 of the portion of the wiring board 10 that is located in the non-mounting region B and defines the bottom surface of each of the plurality of first groove portions 11a and the portion that covers the surface layer portion. , A compressive stress of a predetermined magnitude acts. On the other hand, since the sealing portion 30, which is a thicker portion, is provided with a plurality of slit-shaped cutout portions 31 in the portion corresponding to the non-mounting region B, the sealing portion 30 is adjacent to the cutout portion 31. No noticeable stress is generated in the sealing portion 30 of the portion to be sealed.

Therefore, by using the circuit module 1D according to the present embodiment, even when the circuit module 1D is bent in the non-mounting region B, the stress acting on the non-mounting region B can be remarkably relaxed. Not only that, it is possible to significantly prevent the stress from reaching the periphery of the non-mounting region B. Therefore, it becomes possible to narrow the non-mounting region B, which is a region in which the plurality of electronic components 20 are not mounted, and as a result, it contributes to high integration of the circuit module 1D.

Here, as described above, the two second groove portions 12a provided on the second main surface 12 side of the wiring board 10 are the surface layer portions of the second main surface 12 of the wiring board 10 when the circuit module 1D is bent. It functions as a portion that suppresses the stress that acts on the first mounting region A1 and the second mounting region A2 from propagating. Therefore, referring to FIG. 20, the region sandwiched by these two second groove portions 12a corresponds to the deformation region R1 in which the deformation is intentionally concentrated in the region when the circuit module 1D is bent. Therefore, the regions on both outer sides of the deformation region R1 correspond to the non-deformation region R2 in which deformation does not occur as much as possible when the circuit module 1D is bent.

Here, the circuit module 1D according to the present embodiment has a range of motion (that is, an allowable bending angle) particularly in the case of mountain folds due to the positional relationship in which the first cutout portion H1 and the second cutout portion H2 are provided. There is a merit that a large range of motion can be secured. In that case, the movable range varies depending on whether the wiring board 10 is a flexible wiring board or an acute wiring board, and how thick the wiring board 10 is, but especially if it is a flexible wiring board, the bending angle is changed. It is also quite possible to go beyond obtuse and right angles to acute angles.

Further, in the circuit module 1D according to the present embodiment, the electromagnetic shield 40 is also formed on a pair of side surfaces of the ridge sealing portion 30 formed between the two first cutout portions H1. Therefore, interference between high-frequency electronic components arranged on the non-mounting region B side of each of the first mounting region A1 and the second mounting region A2 can be reliably suppressed.

As described above, the circuit module 1D according to the present embodiment is configured so that it can be repeatedly bent, but the circuit module 1D is not necessarily limited to being used in such a manner, and is intended. It can also be used to bend it and maintain its post-folded state (ie, permanently fold).

Further, in the circuit module 1D according to the present embodiment, a case where the second groove portion 12a, which is the second cutout portion H2 described above, is formed by grooves formed so as to extend continuously is illustrated. As described above, this may be composed of discontinuously divided perforated or dotted grooves. Even in that case, the above-mentioned effects can be obtained to a considerable extent.

FIG. 23 is a diagram schematically showing a method for measuring the strength of the non-mounting region of the circuit module according to the present embodiment and the measurement result. Hereinafter, with reference to FIG. 23, a method for measuring the strength of the non-mounting region B of the circuit module 1D and the measurement result according to the present embodiment will be described in detail.

As shown in FIG. 23 (A), when measuring the strength of the non-mounting region B of the circuit module 1D according to the present embodiment, it is the same as the case of the circuit module 1A according to the above-described first embodiment. Measurement methods are available. That is, when measuring the strength of the non-mounting region B of the circuit module 1D, a plurality of samples of the circuit module 1D are prepared, and the measuring jig 100 composed of the upper plate-shaped member 101 and the lower plate-shaped member 102 is used. Used, the load applied to the sample at the time of breakage in each sample is recorded. The graph shown in FIG. 23B is a plot of the results for each position of the non-mounting area B.

As shown in FIG. 23 (B), in the circuit module 1D according to the present embodiment, since the non-mounting region B includes a plurality of easily deformable portions, in the graph, the breaking load is compared with the surroundings. Then, a plurality of remarkably small peaks P will appear. In particular, in the circuit module 1D according to the present embodiment, in the non-mounting area B, from the first mounting area A1 side to the second mounting area A2 side, the hard-to-deform part, the easy-to-deform part, the hard-to-deform part, and the easy-to-deform part. Since these are configured to be located in the order of the deformed portion and the difficult-to-deform portion, two peaks P appear as shown in the graph.

(Other forms, etc.)
In the above-described first to fourth embodiments of the present invention and modifications thereof, only the case where the first missing portion and the second missing portion are each at most two is illustrated, but these first missing portions and the first missing portion and the second missing portion are illustrated. Three or more second cutout portions may be provided respectively. However, when only the narrowing of the non-mounting area and the securing of the mechanical strength are taken into consideration, the first missing portion and the second missing portion can be at most as in the above-described embodiment and its modification. It is enough to have two.

Further, in the above-described first to fourth embodiments of the present invention and modified examples thereof, the case where the first missing portion and the second missing portion are formed by a groove having a rectangular cross section has been illustrated and described. However, the cross-sectional shapes of the first cutout portion and the second cutout portion are not particularly limited, and they may be formed by, for example, a groove having a V-shaped cross section.

Further, in the above-described first to fourth embodiments of the present invention and modifications thereof, the first missing portion and the second missing portion are orthogonal to the direction in which the first mounting region, the non-mounting region, and the second mounting region are arranged. Although the case where the first missing portion and the second missing portion are extended is illustrated as an example, the first mounting area, the non-mounting area, and the second mounting area are described in the extending direction of the first missing portion and the second missing portion. It is not always necessary to be orthogonal to the line-up direction, and it is sufficient that the first mounting area, the non-mounting area, and the second mounting area intersect the line-up direction.

Further, in the above-described first to fourth embodiments of the present invention and modifications thereof, the case where the electronic component is mounted only on the first main surface side of the wiring board has been described as an example. Electronic components may be mounted not only on the first main surface side but also on the second main surface side, or electronic components may be mounted only on the second main surface side.

Furthermore, the characteristic configurations shown in the above-described embodiments 1 to 4 of the present invention and variations thereof can be combined with each other as long as the gist of the present invention is not deviated.

As described above, the above-described embodiment disclosed this time is an example in all respects and is not restrictive. The technical scope of the present invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the description of the claims.

1A to 1D, 1A1 to 1A6, 1B1 Circuit module, 10 Wiring board, 11 1st main surface, 11a 1st groove, 11b 3rd groove, 12 2nd main surface, 12a 2nd groove, 20 electronic parts, 30 sealing Part, 31 notch, 40 electromagnetic shield, 41 dividing part, 100 measuring jig, 101 upper plate-shaped member, 102 lower plate-shaped member, A1 first mounting area, A2 second mounting area, B non-mounting area, DL division line, H1 1st missing part, H2 2nd missing part, H3 3rd missing part, MP measurement point, P peak, PP pressurization position, p1 to p7 plot, R1 deformed area, R2 non-deformed area ..

Claims

A wiring board having a first main surface and a second main surface located on the opposite side of the first main surface,
It is provided with a plurality of electronic components mounted on the wiring board.
The wiring board includes a first mounting area, a non-mounting area, and a second mounting area arranged side by side in the first direction.
At least one of the plurality of electronic components is mounted in the first mounting area and the second mounting area.
The non-mounting area is arranged between the first mounting area and the second mounting area, and extends from one end to the other end of the wiring board in a second direction intersecting the first direction. Being there
None of the plurality of electronic components is mounted in the non-mounting region.
A single first recess extending along the second direction is provided on the first main surface of the portion corresponding to the non-mounting region, and the second main surface of the portion corresponding to the non-mounting region is provided. A circuit module provided with a plurality of second recesses extending along the second direction on a surface, each having a width narrower than the width of the single first recess.
By providing the single first recess and the plurality of second recesses, the easily deformable portion extending along the second direction and the difficulty extending along the second direction are provided in the non-mounting region. A deformed part is provided,
The circuit module according to claim 1, wherein a region in which the easily deformable portion, the difficult-to-deformate portion, and the easily deformable portion are arranged in this order in the first direction is formed in the non-mounting region.
The first or second aspect of the present invention, wherein the center lines of the single first recess and the center lines of the plurality of second recesses do not overlap each other when viewed from a direction orthogonal to the first main surface. Circuit module.
The plurality of second recesses are two.
The circuit module according to claim 3, wherein the center line of the single first recess is sandwiched between the center lines of the two second recesses when viewed from a direction orthogonal to the first main surface. ..
The circuit module according to claim 4, wherein the two second recesses are provided so as to overlap each other without protruding from the first recess when viewed from a direction orthogonal to the first main surface.
The fourth aspect of the present invention, wherein the two second recesses are provided so as to sandwich the first recess without overlapping the first recess when viewed from a direction orthogonal to the first main surface. Circuit module.
A wiring board having a first main surface and a second main surface located on the opposite side of the first main surface,
It is provided with a plurality of electronic components mounted on the wiring board.
The wiring board includes a first mounting area, a non-mounting area, and a second mounting area arranged side by side in the first direction.
At least one of the plurality of electronic components is mounted in the first mounting area and the second mounting area.
The non-mounting area is arranged between the first mounting area and the second mounting area, and extends from one end to the other end of the wiring board in a second direction intersecting the first direction. Being there
None of the plurality of electronic components is mounted in the non-mounting region.
A plurality of first recesses extending along the second direction are provided on the first main surface of the portion corresponding to the non-mounting region, and the second main surface of the portion corresponding to the non-mounting region is provided. A circuit module, each of which is provided with a plurality of second recesses extending along the second direction, each having a width narrower than the width of each of the plurality of first recesses.
By providing the plurality of first recesses and the plurality of second recesses, the non-mounting region has an easily deformable portion extending along the second direction and a difficult deformation portion extending along the second direction. A part is provided,
The circuit module according to claim 7, wherein a region in which the easily deformable portion, the difficult-to-deformate portion, and the easily deformable portion are arranged in this order in the first direction is formed in the non-mounting region.
The plurality of first recesses are two.
The plurality of second recesses are two.
One of the two second recesses is provided so as to overlap without protruding from one of the two first recesses when viewed from a direction orthogonal to the first main surface.
The other of the two second recesses is provided so as to overlap without protruding from the other of the two first recesses when viewed from a direction orthogonal to the first main surface. , The circuit module according to claim 8.
Further provided with a sealing portion provided on the first main surface,
Among the plurality of electronic components, the electronic components mounted in the first mounting region include those mounted on the first main surface.
Among the plurality of electronic components, the electronic components mounted in the second mounting region include those mounted on the first main surface.
The sealing portion seals the electronic component mounted on the first main surface of the plurality of electronic components together with the wiring board.
The circuit module according to any one of claims 1 to 9, wherein a slit-shaped notch leading to the first recess is provided at a position corresponding to the first recess in the sealing portion.
Further provided with a film-like electromagnetic shield provided on the first main surface side,
The electromagnetic shield is not only on the surface of the sealing portion opposite to the wiring board side so that the sealing portion is not exposed, but also the sealing of the portion defining the notch portion. The circuit module according to claim 10, which is provided on the surface of the portion and also on the surface of the wiring board of the portion defining the first recess.
11. The electromagnetic shield, wherein a slit-shaped dividing portion extending along the second direction is provided at a portion of the electromagnetic shield that defines the first recess and is located on the surface of the wiring board. The circuit module described in.