CN210725458U - Resin multilayer substrate and electronic device - Google Patents
Resin multilayer substrate and electronic device Download PDFInfo
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- CN210725458U CN210725458U CN201890000469.7U CN201890000469U CN210725458U CN 210725458 U CN210725458 U CN 210725458U CN 201890000469 U CN201890000469 U CN 201890000469U CN 210725458 U CN210725458 U CN 210725458U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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Abstract
The utility model provides a multilayer base plate of resin and electronic equipment. A resin multilayer substrate (101) is provided with a 1 st portion, a 2 nd portion arranged adjacent to one side of the 1 st portion, a 3 rd portion formed as an extension of at least one resin layer (2) included in the 2 nd portion and extending from the 2 nd portion, a 4 th portion arranged adjacent to the other side of the 1 st portion, and a 5 th portion formed as an extension of at least one resin layer (2) included in the 4 th portion and extending from the 4 th portion, wherein a member (3) is arranged at any position inside the 1 st portion or the like, the 3 rd portion and the 5 th portion have flexibility, a 1 st electrode (71) is arranged on a surface of the 3 rd portion, and a 2 nd electrode (72) is arranged on a surface of the 5 th portion.
Description
Technical Field
The utility model relates to a resin multilayer substrate and electronic equipment.
Background
Jp 2014-220458 a (patent document 1) describes an example of a resin multilayer substrate including a laminate in which a plurality of resin layers are laminated, the laminate including a rigid portion and a flexible portion.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2014-220458
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
In the resin multilayer substrate described in patent document 1, the flexible portion is bent to attach the resin multilayer substrate to another member. The freedom of posture at the time of mounting is still insufficient, and free design is not possible. In particular, when the resin multilayer substrate must be mounted on a surface that is not a simple plane, there are restrictions on designing the resin multilayer substrate according to the required conditions.
Therefore, an object of the present invention is to provide a resin multilayer substrate and an electronic device that can improve the degree of freedom of posture for mounting to a base material.
Means for solving the problems
In order to achieve the above object, the resin multilayer substrate according to the present invention includes: a 1 st portion including at least one resin layer arranged with a main surface perpendicular to a 1 st direction; a 2 nd portion which is disposed adjacent to one side of the 1 st portion along the 1 st direction and includes at least one resin layer whose main surface is disposed perpendicular to the 1 st direction; a 3 rd portion formed as an extension of at least one of the resin layers included in the 2 nd portion, and extending from the 2 nd portion in a direction perpendicular to the 1 st direction; a 4 th portion which is disposed adjacent to the other side of the 1 st portion along the 1 st direction and includes at least one resin layer disposed perpendicularly to the 1 st direction; and a 5 th part formed as an extension of at least one of the resin layers included in the 4 th part, and extending from the 4 th part in a direction perpendicular to the 1 st direction. A member is disposed at any position inside a portion where the 1 st portion, the 2 nd portion, and the 4 th portion are combined. The 3 rd portion and the 5 th portion have flexibility. The 1 st electrode is disposed on the surface of the 3 rd portion. The 2 nd electrode is disposed on the surface of the 5 th portion.
The utility model discloses an electronic equipment of another mode possesses: the resin multilayer substrate described above; and a base material to which the resin multilayer substrate is attached via the 1 st electrode and the 2 nd electrode, respectively.
The utility model discloses an electronic equipment of another mode possesses: the resin multilayer substrate described above; and a base material, wherein the 3 rd portion and the 5 th portion are bent in directions intersecting with each other, the 3 rd portion is connected to the base material in a state of extending to a position beyond the 4 th portion, and the 5 th portion is connected to the base material in a state of extending to a position beyond the 2 nd portion.
The utility model discloses a resin multilayer substrate of another mode possesses: a 1 st portion including at least one resin layer arranged with a main surface perpendicular to a 1 st direction; a 2 nd portion disposed adjacent to one side of the 1 st portion along the 1 st direction, including at least one resin layer disposed with a main surface perpendicular to the 1 st direction; and a 3 rd portion formed as an extension of at least one resin layer included in the 2 nd portion, extending from the 2 nd portion in a direction perpendicular to the 1 st direction, a member being disposed at any position inside a portion where the 1 st portion and the 2 nd portion are combined, the 3 rd portion having flexibility, and an electrode being disposed on a surface of the 3 rd portion.
The utility model discloses an electronic equipment of another mode possesses: the resin multilayer substrate described above; and a base material, wherein the resin multilayer substrate is attached to the base material via the electrode, and a main surface of the portion 3 is not parallel to a main surface of the portion 1 in a portion where the electrode is connected to the base material.
Effect of the utility model
According to the present invention, a structure that improves the degree of freedom of the posture when the resin multilayer substrate is attached to the base material can be easily obtained.
Drawings
Fig. 1 is a cross-sectional view of a resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 2 is a schematic view showing the range of each part of the resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 3 is an explanatory view showing a state in the middle of manufacturing a resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 4 is a conceptual diagram of example 1 in which a resin multilayer substrate according to embodiment 1 of the present invention is mounted on a base material.
Fig. 5 is a conceptual diagram of example 2 in which a resin multilayer substrate according to embodiment 1 of the present invention is mounted on a base material.
Fig. 6 is a conceptual diagram of example 3 in which a resin multilayer substrate according to embodiment 1 of the present invention is mounted on a base material.
Fig. 7 is a conceptual diagram of example 4 in which a resin multilayer substrate according to embodiment 1 of the present invention is mounted on a base material.
Fig. 8 is a perspective view of a resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 9 is a perspective view of a 1 st modification of the resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 10 is a plan view of a 1 st modification of the resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 11 is a perspective view of a 2 nd modification of the resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 12 is a plan view of a 2 nd modification of the resin multilayer substrate according to embodiment 1 of the present invention.
Fig. 13 is a schematic view of a resin multilayer substrate according to embodiment 2 of the present invention.
Fig. 14 is a cross-sectional view of a resin multilayer substrate according to embodiment 2 of the present invention mounted on a base material.
Fig. 15 is a schematic view showing the range of each part of a resin multilayer substrate according to embodiment 3 of the present invention.
Fig. 16 is a schematic view of a resin multilayer substrate according to embodiment 3 of the present invention.
Fig. 17 is a cross-sectional view of a resin multilayer substrate according to embodiment 3 of the present invention mounted on a base material.
Fig. 18 is a schematic view of a resin multilayer substrate according to embodiment 4 of the present invention.
Fig. 19 is a cross-sectional view of a resin multilayer substrate according to embodiment 4 of the present invention mounted on a base material.
Fig. 20 is a cross-sectional view of a resin multilayer substrate according to embodiment 5 of the present invention.
Fig. 21 is a cross-sectional view of a resin multilayer substrate according to embodiment 6 of the present invention.
Fig. 22 is a cross-sectional view showing a state in which the resin multilayer substrate according to embodiment 7 of the present invention is connected to a base material.
Fig. 23 is a plan view of a resin multilayer substrate according to embodiment 8 of the present invention.
Fig. 24 is a perspective view of a resin multilayer substrate included in an electronic device according to embodiment 9 of the present invention.
Fig. 25 is a partial plan view of an electronic device according to embodiment 9 of the present invention.
Fig. 26 is a partial cross-sectional view of an electronic device according to embodiment 9 of the present invention.
Detailed Description
The dimensional ratios shown in the drawings do not necessarily faithfully represent actual dimensional ratios, and may be exaggerated for convenience of explanation. In the following description, when referring to the concept of up or down, the term does not mean absolute up or down, but may mean relative up or down in the illustrated posture.
(embodiment mode 1)
A resin multilayer substrate according to embodiment 1 of the present invention will be described with reference to fig. 1 to 3.
Fig. 1 shows a cross-sectional view of a resin multilayer substrate 101 according to this embodiment. The resin multilayer substrate 101 is basically formed by laminating a plurality of resin layers 2. The plurality of resin layers 2 are made of, for example, a thermoplastic resin such as a liquid crystal polymer as a main material. The stacking direction of the plurality of resin layers 2 is the 1 st direction 91. The resin multilayer substrate 101 incorporates the component 3. Here, although an example in which only one component 3 is built in is shown, a plurality of built-in components may be provided. Several conductor patterns 7 may be arranged inside the resin multilayer substrate 101. The conductor patterns 7 may be electrically connected to each other by an interlayer connection conductor 6 disposed to penetrate the resin layer 2. Although not shown in fig. 1, there may be also a portion where the interlayer connection conductors 6 are continuously arranged along the 1 st direction 91 without passing through the conductor pattern 7. The component 3 is provided with terminals. The interlayer connection conductor 6 may be electrically connected to the terminal. The arrangement of the interlayer connection conductor 6 and the conductor pattern 7 shown in fig. 1 is only an example, and is not limited to this.
The resin multilayer substrate 101 can be grasped in several parts. Fig. 2 shows a case where each part of the resin multilayer substrate 101 is clearly shown. In fig. 2, the resin multilayer substrate 101 is shown in the same manner as in fig. 1, but for convenience of explanation, the boundary lines between the resin layers 2, the members 3, the interlayer connection conductors 6, the conductor patterns 7, and the like are not shown in fig. 2.
The resin multilayer substrate 101 in the present embodiment includes the 1 st portion 61, the 2 nd portion 62, the 3 rd portion 63, the 4 th portion 64, and the 5 th portion 65. The 1 st part 61 includes at least one resin layer 2 arranged with a main surface perpendicular with respect to the 1 st direction 91. The 2 nd part 62 is disposed adjacent to one side of the 1 st part 61 along the 1 st direction 91, and includes at least one resin layer 2 disposed with its main surface perpendicular to the 1 st direction 91. The 3 rd portion 63 is formed as an extension of at least one resin layer 2 included in the 2 nd portion 62, and protrudes from the 2 nd portion 62 in a direction perpendicular to the 1 st direction 91. The 4 th part 64 is disposed adjacent to the other side of the 1 st part 61 along the 1 st direction 91, and includes at least one resin layer 2 disposed perpendicularly to the 1 st direction 91. The 5 th part 65 is formed as an extension of at least one resin layer 2 included in the 4 th part 64, and extends from the 4 th part 64 in a direction perpendicular to the 1 st direction 91. Portions 3 and 5 are flexible, as are portions 63 and 65. The 1 st electrode 71 is disposed on the surface of the 3 rd portion 63. The 2 nd electrode 72 is disposed on the surface of the 5 th portion 65. The member 3 is disposed inside the 1 st member 61. The 1 st electrode 71 and the 2 nd electrode 72 are electrically connected to the component 3 through the inner conductor pattern 7 and the interlayer connection conductor 6, respectively. The member 3 may be disposed inside the 2 nd portion 62 or the 4 th portion 64. The component 3 may also be built-in across the 1 st and 2 nd portions 61, 62. The component 3 may also be internally positioned across the 1 st portion 61 and the 4 th portion 64.
In the example shown here, the 2 nd part 62 is disposed adjacent to the upper side of the 1 st part 61. The 4 th part 64 is disposed adjacent to the lower side of the 1 st part 61. In the example shown here, the 1 st electrode 71 is disposed on the lower surface of the 3 rd portion 63, but this is only one example. The 1 st electrode 71 may be disposed on the upper surface of the 3 rd portion 63. The 2 nd electrode 72 is disposed on the upper surface of the 5 th portion 65, but this is only an example. The 2 nd electrode 72 may be disposed on the lower surface of the 5 th portion 65.
In order to produce the resin multilayer substrate 101 having such a structure, the spacer 5 may be used as shown in fig. 3. That is, when a plurality of resin layers 2 are stacked, the separator 5 is interposed therebetween. The heating and pressing are performed in a state where the separator 5 is sandwiched in this manner. Thereby, the resin layers 2 are thermally pressed against each other, and the laminate is integrated. Then, by removing the spacer 5, a notched portion can be formed between the 3 rd portion 63 and the 5 th portion 65.
In the present embodiment, a structure can be easily obtained that improves the degree of freedom of posture when the resin multilayer substrate is mounted on the base material. The resin multilayer substrate 101 can be mounted on a curved surface as shown in fig. 4, for example. The substrate 1 has a curved surface, and an electrode (not shown) is provided on the curved surface. In contrast, if the 3 rd and 5 th parts 63 and 65 of the resin multilayer substrate 101 are bent along a curved surface, the electrodes provided in the 3 rd and 5 th parts 63 and 65, that is, the 1 st and 2 nd electrodes 71 and 72 can be connected to the electrodes of the base material 1 provided on the surface of the curved surface without any problem. At this time, the member 3 is positioned to extend in a direction perpendicular to the curved surface as illustrated in fig. 4. The lengths of the 3 rd portion 63 and the 5 th portion 65 may be changed as appropriate. The 3 rd portion 63 and the 5 th portion 65 are not limited to the same length. Fig. 4 shows an example in which the curved surface of the mounting object is convex, but the curved surface of the mounting object may be concave. In this case, it is possible to handle by bending the 3 rd portion 63 and the 5 th portion 65 larger.
As shown in fig. 4, when the resin multilayer substrate 101 is mounted on the base material 1, the members 3 are arranged in different directions with respect to the stacking direction. The member 3 is generally set to have a small thickness in the stacking direction and a large width in the direction orthogonal to the stacking direction in many cases, and the direction in which the member 3 is arranged can be changed according to such a mounting structure. In the example shown in fig. 4, the member 3 is supported in a posture rotated by 90 °. This makes it possible to easily secure an arrangement space in the electronic device. That is, according to such a mounting structure, it is possible to cope with a case where there is no margin in the width direction (the left-right direction in fig. 4) and there is a margin in the height direction (the up-down direction in fig. 4).
As shown in fig. 4, at least a part of the 1 st portion 61 of the resin multilayer substrate 101 is disposed in contact with the base material 1. In this case, the height of the composite (electronic device) of the base material 1 and the resin multilayer substrate 101 can be reduced. Further, the thickness of the member 3 in the stacking direction is generally set to be small and the width in the direction orthogonal to the stacking direction is set to be large, and according to such a mounting structure, the area of the surface of the member 3 facing the substrate 1 is reduced by changing the facing direction of the member 3 with respect to the substrate 1. Therefore, even if the 1 st portion 61 of the resin multilayer substrate 101 is brought into contact with the base material 1, transmission of vibration, impact, or the like from the base material 1 to the component 3 can be mitigated. Further, as in the case of the multilayer resin substrate 101h shown in fig. 5, the void 10 may be provided in any region between the base 1 and the member 3 in the 1 st portion 61. When the resin multilayer substrate 101h having the above-described void 10 is attached to the base material 1, it is possible to further reduce the transmission of vibration, impact, and the like transmitted from the base material 1 side to the member 3, and also reduce the stress applied to the 1 st region 61 and the member 3 when the 3 rd portion 63 and the 5 th portion 65 are bent. In view of this, it is preferable that the member 3 is disposed in the 1 st part 61.
The 1 st portion 61 of the resin multilayer substrates 101 and 101h does not have to be partially in contact with the base 1.
The curved surface is not limited to the curved surface, and may be, for example, as shown in fig. 6. The substrate 1i has a plurality of faces with different orientations, and is not flat as a whole. The resin multilayer substrate 101 can be mounted on the base 1i using the 3 rd portion 63 and the 5 th portion 65 without any problem. Since the 3 rd portion 63 and the 5 th portion 65 are flexible, the electrodes provided in the 3 rd portion 63 and the 5 th portion 65 can be connected to the electrodes provided on the surface of the base material 1i without any problem.
Further, for example, as shown in fig. 7, the substrate can be attached to a thick plate-like substrate 1 j. The substrate 1j is thicker than the 1 st portion 61, but the 3 rd portion 63 and the 5 th portion 65 can be attached to the substrate 1j without any problem by bending them to be along both surfaces of the substrate 1 j.
In the case of the mounting method as shown in fig. 6 to 7, a gap 12 is formed between the base material and the 1 st portion 61. By providing the gap 12 in this manner, transmission of vibration, impact, or the like transmitted from the base material side to the member 3 can be mitigated. In this way, adverse effects on the member 3 can be avoided. If such a case is considered, it is preferable that the component 3 is disposed at the 1 st part 61. In addition, a gap may be provided in any region between the base material and the member 3 in the 1 st part 61. When the gap is provided in such a region, it is possible to further reduce transmission of vibration, impact, or the like transmitted from the base material side to the member 3, and also to reduce stress applied to the 1 st region 61 and the member 3 when the 3 rd portion 63 and the 5 th portion 65 are bent.
The resin multilayer substrate 101 in the description so far is assumed to have a shape as shown in fig. 8 when viewed in a perspective view. That is, the 1 st portion 61, the 3 rd portion 63, and the 5 th portion 65 have the same width. As shown in fig. 9 and 10, the 3 rd portion 63 and the 5 th portion 65 may have a different width from the 1 st portion 61. Fig. 10 is a plan view of the resin multilayer substrate shown in fig. 9.
The positions of the 3 rd portion 63 and the 5 th portion 65 are not limited to overlapping each other at the same position, and may be in a positional relationship as shown in fig. 11 and 12, for example. Fig. 12 is a plan view of the resin multilayer substrate shown in fig. 11. The 3 rd portion 63 and the 5 th portion 65 extend at different positions, not overlapping each other when viewed in plan view as in fig. 12.
As shown in the present embodiment, the member 3 is preferably disposed inside the 1 st part 61. By adopting this configuration, in addition to the above-described effects, the degree of transmission of the influence to the periphery of the member 3 when the 3 rd portion 63 and the 5 th portion 65 are elastically deformed by bending can be further reduced, and the member 3 can be protected more reliably.
As described in the present embodiment, the 1 st electrode 71 and the 2 nd electrode 72 are preferably electrically connected to the component 3, respectively.
In the present embodiment, as shown in fig. 1, the 1 st electrode 71 is preferably disposed on the surface of the 3 rd portion 63 on the side closer to the 1 st portion 61, and the 2 nd electrode 72 is preferably disposed on the surface of the 5 th portion 65 on the side closer to the 1 st portion 61. With this structure, the resin multilayer substrate can be mounted so as to surround the base material as shown in fig. 4 to 7.
(embodiment mode 2)
A resin multilayer substrate according to embodiment 2 of the present invention will be described with reference to fig. 13.
Fig. 13 shows a schematic view of the resin multilayer substrate 102 according to this embodiment. In fig. 13, the boundary lines between the resin layers 2, the members 3, and the like are not illustrated. The resin multilayer substrate 102 includes the 1 st portion 61 to the 5 th portion 65 in the same manner as the resin multilayer substrate 101. The resin multilayer substrate 102 is different from the resin multilayer substrate 101 in the positions where the 1 st electrode 71 and the 2 nd electrode 72 are arranged. The 1 st electrode 71 is disposed on the upper surface of the 3 rd portion 63. The 2 nd electrode 72 is disposed on the lower surface of the 5 th portion 65.
In the present embodiment, the degree of freedom for mounting on the substrate can be improved. The resin multilayer substrate 102 can be mounted on a base 1k having a special shape as shown in fig. 14, for example. The substrate 1k has a recess 8. In the resin multilayer substrate 102, the 1 st electrode 71 and the 2 nd electrode 72 can be electrically connected to the electrodes provided on the upper surface of the base material 1k by bending the 3 rd portion 63 and the 5 th portion 65 outward in a state where the portion including the 1 st portion 61 is inserted into the recess 8. In the example shown in fig. 14, the height of the upper surface of the base material 1k is equal on the left and right sides of the recess 8, but the height of the upper surface may be different on the left and right sides of the recess 8. The lengths of the 3 rd portion 63 and the 5 th portion 65 are not limited to being equal and may be different. By performing the mounting as shown in fig. 14, the portion of the resin multilayer substrate in which the component 3 is built can be housed and protected inside the recess 8 of the base material 1 k. In fig. 14, the bottom surface of the recess 8 is not in contact with the resin multilayer substrate 102. This can alleviate transmission of vibration, impact, and the like transmitted from the base material 1k side to the member 3. On the other hand, the bottom surface of the recess 8 may be in contact with the resin multilayer substrate 102. In this case, the resin multilayer substrate 102 can be reliably held in the recess 8.
(electronic apparatus)
An electronic apparatus will be explained. The electronic device is shown in fig. 4 to 7 and 14, for example. The electronic device includes the resin multilayer substrate and the base material described in any of embodiments 1 and 2. In this electronic device, the resin multilayer substrate is mounted on the base material via the 1 st electrode 71 and the 2 nd electrode 72, respectively. With this configuration, an electronic device can be provided in which the resin multilayer substrate is mounted with a high degree of freedom.
In this electronic device, the base preferably has a non-flat surface on which the 1 st electrode 71 and the 2 nd electrode 72 are mounted. With this configuration, the degree of freedom in designing the electronic device can be improved.
In this electronic device, the main surfaces of the 3 rd portion 63 and the 5 th portion 65 are not parallel to the main surface of the 1 st portion 61 in the portion where the 1 st electrode 71 and the 2 nd electrode 72 are connected to the base material. With this configuration, an electronic device can be provided in which the resin multilayer substrate is mounted with a high degree of freedom.
(embodiment mode 3)
A resin multilayer substrate according to embodiment 3 of the present invention will be described with reference to fig. 15 to 16.
Fig. 15 and 16 show schematic views of the resin multilayer substrate 103 according to this embodiment. The resin multilayer substrate 103 includes a 1 st portion 61, a 2 nd portion 62, and a 3 rd portion 63. The range of each portion is as shown in fig. 15.
The resin multilayer substrate 103 includes: a 1 st portion 61 including at least one resin layer 2 arranged with a main surface perpendicular with respect to a 1 st direction 91; a 2 nd portion 62, disposed adjacent to one side of the 1 st portion 61 along the 1 st direction 91, including at least one resin layer 2 disposed with a main surface perpendicular to the 1 st direction 91; and a 3 rd portion 63 formed as an extension of at least one resin layer 2 included in the 2 nd portion 62, and protruding from the 2 nd portion 62 in a direction perpendicular to the 1 st direction 61. The member 3 is disposed inside the 1 st part 61. The position of the placement member 3 is not limited to the inside of the 1 st segment 61, and may be any position inside a portion where the 1 st segment 61 and the 2 nd segment 62 are combined. The component 3 may also be arranged inside the 2 nd part 62. Portion 3 is flexible. An electrode 70 is disposed on the surface of the 3 rd portion 63. The electrode 70 is electrically connected to the component 3.
In the example shown here, as shown in fig. 16, an electrode 70 is disposed on the upper surface of the 3 rd portion 63. Although not shown, a plurality of electrodes 70 may be provided, and each of the plurality of electrodes 70 may be electrically connected to the substrate 1 n.
In this embodiment, the same effects as those in embodiments 1 and 2 can be obtained. The resin multilayer board 103 can be mounted on the base 1n as shown in fig. 17, for example. In fig. 17, a resin multilayer substrate is mounted on both surfaces of a corner portion of a base material 1 n.
As shown in the present embodiment, the member 3 is preferably disposed inside the 1 st part 61. As shown in the present embodiment, the electrode 70 is preferably electrically connected to the member 3.
As shown in the present embodiment, the electrode 70 is preferably disposed on the surface of the 3 rd portion 63 on the side closer to the 1 st portion 61.
(embodiment mode 4)
A resin multilayer substrate according to embodiment 4 of the present invention will be described with reference to fig. 18 to 19. Fig. 18 shows a schematic view of the resin multilayer substrate 104 according to this embodiment. The resin multilayer substrate 104 includes the 1 st part 61, the 2 nd part 62, and the 3 rd part 63. The range of each portion is as shown in fig. 18. The resin multilayer substrate includes a portion 66 extending from the 1 st portion 61 in a direction perpendicular to the 1 st direction 91. The portion 66 is along the 3 rd portion 63, but there is no engagement between the portion 66 and the 3 rd portion 63. By bending the 3 rd portion 63, the 3 rd portion 63 can be moved away from the portion 66. The structure in which the resin layers on both sides can be separated from each other at the interface of the resin layers in a part of the resin multilayer substrate can be realized, for example, by performing surface treatment for preventing the resin layers from adhering to each other in advance at the interface of the 3 rd part 63 and the part 66 or by not performing surface treatment for adhering the resin layers to each other at the part when a plurality of resin layers are stacked and heated and pressurized. Fig. 19 shows a state where the resin multilayer substrate is mounted on a base 1 n.
In the present embodiment, the same effects as those in embodiment 3 can be obtained.
(embodiment 5)
With reference to fig. 20, a resin multilayer substrate 105 according to embodiment 5 of the present invention will be described. The resin multilayer substrate 105 basically has the same configuration as the resin multilayer substrate 101 described in embodiment 1, but differs from it in the following points.
In the resin multilayer substrate 105, the conductor via 6a is disposed on the side closer to at least one of the 3 rd portion 63 and the 5 th portion 65 than the component 3 in the portion where the 1 st portion 61, the 2 nd portion 62, and the 4 th portion 64 are combined. The conductor via 6a may be one, but preferably a plurality of conductor vias 6a are connected in the thickness direction as shown in fig. 20. The plurality of conductor vias 6a are not limited to forming only one series, and may form a plurality of separate series.
In the present embodiment, the same effects as those described in the embodiments so far can be obtained. Further, in the present embodiment, when the 3 rd portion 63 or the 5 th portion 65 is bent, the conductor via 6a absorbs the bending stress, and therefore, the stress applied to the member 3 can be reduced. Here, for example, it is assumed that the 3 rd portion 63 is bent toward the arrow 93a side and the 5 th portion 65 is bent toward the arrow 93b side. However, the directions of the curves indicated by the arrows 93a and 93b are examples and are not limited to these.
(embodiment mode 6)
With reference to fig. 21, a resin multilayer substrate 106 according to embodiment 6 of the present invention will be described. The resin multilayer substrate 106 basically has a structure common to the resin multilayer substrate 105 described in embodiment 5, but differs from the following point.
In the resin multilayer substrate 106, the dummy via 6b is arranged as a conductor via on the side closer to at least one of the 3 rd portion 63 and the 5 th portion 65 than the component 3 in the portion where the 1 st portion 61, the 2 nd portion 62, and the 4 th portion 64 are combined. One dummy via 6b may be provided, but it is preferable that a plurality of dummy vias 6b are connected in the thickness direction as shown in fig. 21. A "dummy via" as referred to herein is a conductor via that is not electrically isolated as an electrical path such as a wire, electrode, or the like. A plurality of dummy vias 6b may also be provided. The dummy vias 6b may be connected to each other as in the example shown in fig. 21. The series of dummy vias 6b shown in fig. 21 is not electrically connected to other wirings.
(embodiment 7)
With reference to fig. 22, a resin multilayer substrate 107 according to embodiment 7 of the present invention will be described. The resin multilayer substrate 107 basically has the same configuration as the resin multilayer substrate 101 described in embodiment 1, but differs from it in the following points.
The resin multilayer substrate 107 includes an electrode 73 for connecting to the base 1 at a portion other than either of the 3 rd portion 63 and the 5 th portion 65. In the example shown in fig. 22, the electrode 73 is disposed on a surface parallel to the 1 st direction 91 which is the stacking direction of the 1 st portion 61. The electrode 73 is disposed on the surface of the 1 st segment 61 sandwiched between the 3 rd segment 63 and the 5 th segment 65. In the example shown in fig. 22, the electrode 73 is planar and extends parallel to the thickness direction of the resin layer 2.
In the present embodiment, the electrode 73 can be firmly bonded to the base material 1 at a portion other than either of the 3 rd portion 63 and the 5 th portion 65.
(embodiment mode 8)
A resin multilayer substrate 108 according to embodiment 8 of the present invention will be described with reference to fig. 23 and the like. The appearance of the resin multilayer substrate 108 is the same as that of the resin multilayer substrate shown in fig. 11. Fig. 23 shows a resin multilayer substrate 108 viewed from the 1 st direction 91. The built-in component 3 is shown with dashed lines. The component 3 is arranged inside the region 67. That is, the member 3 is disposed at a position not on the extension of the 3 rd part 63 nor on the extension of the 5 th part 65 as viewed from the 1 st direction 91 in the portion where the 1 st part 61, the 2 nd part 62, and the 4 th part 64 are combined.
In the present embodiment, it is preferable that the bending stress is not easily transmitted to the member 3 when the 3 rd portion 63 or the 5 th portion 65 is bent.
(electronic apparatus)
An electronic apparatus will be explained. The electronic device is shown in fig. 17 and 19, for example. The electronic device includes the resin multilayer substrate shown in any one of embodiments 3 and 4, which is attached to the base material 1n via the electrode 70, and the base material 1n, wherein the main surface of the 3 rd portion 63 is not parallel to the main surface of the 1 st portion 61 at a portion where the electrode 70 is connected to the base material 1 n. With this configuration, an electronic device can be provided in which the resin multilayer substrate is mounted with a high degree of freedom.
(embodiment mode 9)
An electronic device according to embodiment 9 of the present invention will be described with reference to fig. 24 to 26. Fig. 24 shows a case where the resin multilayer substrate 109 included in the electronic device is taken out alone. The 1 st portion 61 to the 5 th portion 65 in the resin multilayer substrate 109 are referred to as the same as those described in embodiment 1. Fig. 25 shows a case where the electronic device is viewed from a direction perpendicular to the surface of the substrate 1 r. Fig. 26 shows a schematic cross-sectional view of the electronic device.
The electronic device in the present embodiment includes a resin multilayer substrate 109 and a base material 1 r. In this electronic device, the 3 rd portion 63 and the 5 th portion 65 are bent in directions intersecting each other, and the 3 rd portion 63 is connected to the base material 1r in a state of extending to a position beyond the 4 th portion 64. The 5 th portion 65 is connected to the base material 1r in a state of extending to a position beyond the 2 nd portion 62. The 1 st electrode 71 disposed in the 3 rd portion 63 is electrically connected to any one of the electrodes disposed on the surface of the substrate 1 r. The 2 nd electrode 72 disposed in the 5 th portion 65 is electrically connected to any one of the other electrodes disposed on the surface of the substrate 1 r.
Here, at least a part of the combined 1 st, 2 nd, and 4 th parts 61, 62, and 64 of the resin multilayer substrate 109 is inserted into a recess provided in the base 1 r. The dimension of the recess in the left-right direction in the drawing is equal to the thickness of the portion where the 1 st portion 61, the 2 nd portion 62, and the 4 th portion 64 are combined, but this is only an example, and the present invention is not limited to such a configuration. The dimension of the recess in the left-right direction in the drawing may be larger than the thickness of the combined 1 st, 2 nd, and 4 th parts 61, 62, and 64. In the example shown in fig. 26, the height of the upper surface of the base material 1r is equal on the left and right sides of the resin multilayer board 109, but this is only an example and is not limited to such a configuration.
In the present embodiment, the resin multilayer substrate is accommodated in the recess of the base material, whereby the overall height of the electronic device can be reduced. The 3 rd portion 63 and the 5 th portion 65 are bent in directions intersecting each other, whereby electrical connection with the surface of the base material 1r can be performed while suppressing the height.
In the example shown in fig. 26 in the present embodiment, the 3 rd portion 63 and the 5 th portion 65 are bent in the direction intersecting each other, and thus the breakage at the portions 68 and 69 becomes less likely to occur, as compared with the example shown in fig. 14 in embodiment 2. The portion 68 referred to herein is the boundary between the 1 st portion 61, the 2 nd portion 62 and the 3 rd portion 63. Portion 69 is the boundary of portion 1, portion 4, and portion 5, 61, 64, 65.
In addition, a plurality of the embodiments described above may be combined as appropriate.
The above embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the appended claims, and includes all changes that come within the meaning and range of equivalency of the claims.
Description of the reference numerals
1. 1i, 1j, 1k, 1n, 1r base material, 2 resin layers, 3 parts, 5 spacers, 6a interlayer connection conductors, 7 conductor patterns, 8 recesses, 10, 12 gaps, 61 st part 1, 62 nd part 2, 63 rd part 3, 64 th part 4, 65 th part 5, 66 part, 67 region, 68, 69 part, 70 electrode, 71 st electrode 1, 72 nd electrode 2, 73 electrode, 91 st direction, 93a, 93b, 94a, 94b arrows, 101h, 102, 103, 104, 105, 106, 107 resin multilayer substrate.
Claims (17)
1. A resin multilayer substrate is characterized by comprising:
a 1 st portion including at least one resin layer arranged with a main surface perpendicular to a 1 st direction;
a 2 nd portion disposed adjacent to one side of the 1 st portion along the 1 st direction, including at least one resin layer disposed with a main surface perpendicular to the 1 st direction;
a 3 rd portion formed as an extension of at least one resin layer included in the 2 nd portion, and extending from the 2 nd portion in a direction perpendicular to the 1 st direction;
a 4 th part disposed adjacent to the other side of the 1 st part along the 1 st direction, including at least one resin layer disposed perpendicular to the 1 st direction; and
a 5 th part formed as an extension of at least one resin layer included in the 4 th part, the 5 th part extending from the 4 th part in a direction perpendicular to the 1 st direction,
a member is disposed at any position inside a portion where the 1 st part, the 2 nd part and the 4 th part are combined,
the 3 rd portion and the 5 th portion have flexibility,
a 1 st electrode is arranged on the surface of the 3 rd part,
and a 2 nd electrode is arranged on the surface of the 5 th part.
2. The resin multilayer substrate according to claim 1,
the component is disposed inside the 1 st section.
3. The resin multilayer substrate according to claim 1 or 2,
the 1 st electrode and the 2 nd electrode are electrically connected to the component, respectively.
4. The resin multilayer substrate according to claim 1 or 2,
the 1 st electrode is disposed on a surface of the 3 rd portion on a side closer to the 1 st portion, and the 2 nd electrode is disposed on a surface of the 5 th portion on a side closer to the 1 st portion.
5. The resin multilayer substrate according to claim 1 or 2,
a conductor via is arranged inside a portion where the 1 st portion, the 2 nd portion, and the 4 th portion are combined, on a side closer to at least one of the 3 rd portion and the 5 th portion than the component.
6. The resin multilayer substrate according to claim 5,
the conductor via is a dummy via.
7. The resin multilayer substrate according to claim 1 or 2,
an electrode for connecting to a base material is provided at a portion other than either of the 3 rd portion and the 5 th portion.
8. The resin multilayer substrate according to claim 1 or 2,
the member is disposed at a position not on the extension line of the 3 rd part nor on the extension line of the 5 th part in the inside of a part where the 1 st part, the 2 nd part, and the 4 th part are combined, when viewed from the 1 st direction.
9. An electronic device is characterized by comprising:
the resin multilayer substrate according to any one of claims 1 to 8; and
a base material, a first metal layer and a second metal layer,
the resin multilayer substrate is mounted on the base via the 1 st electrode and the 2 nd electrode, respectively.
10. The electronic device of claim 9,
the substrate has a non-flat surface, and the 1 st electrode and the 2 nd electrode are mounted on the non-flat surface.
11. The electronic device of claim 9 or 10,
the main surfaces of the 3 rd portion and the 5 th portion are not parallel to the main surface of the 1 st portion at a portion where the 1 st electrode and the 2 nd electrode are connected to the base material.
12. An electronic device is characterized by comprising:
the resin multilayer substrate according to any one of claims 1 to 8; and
a base material, a first metal layer and a second metal layer,
the 3 rd portion and the 5 th portion are bent in directions intersecting each other, the 3 rd portion is connected to the base material in a state of extending to a position beyond the 4 th portion, and the 5 th portion is connected to the base material in a state of extending to a position beyond the 2 nd portion.
13. A resin multilayer substrate is characterized by comprising:
a 1 st portion including at least one resin layer arranged with a main surface perpendicular to a 1 st direction;
a 2 nd portion disposed adjacent to one side of the 1 st portion along the 1 st direction, including at least one resin layer disposed with a main surface perpendicular to the 1 st direction; and
a 3 rd portion formed as an extension of at least one resin layer included in the 2 nd portion, and extending from the 2 nd portion in a direction perpendicular to the 1 st direction,
a member is disposed at any position inside a portion where the 1 st part and the 2 nd part are combined,
the portion 3 is flexible and the portion is flexible,
an electrode is disposed on the surface of the 3 rd portion.
14. The resin multilayer substrate according to claim 13,
the component is disposed inside the 1 st section.
15. The resin multilayer substrate according to claim 13 or 14,
the electrode is electrically connected to the component.
16. The resin multilayer substrate according to claim 13 or 14,
the electrode is disposed on a surface of the 3 rd portion on a side close to the 1 st portion.
17. An electronic device is characterized by comprising:
the resin multilayer substrate according to any one of claims 13 to 16; and
a base material, a first metal layer and a second metal layer,
the resin multilayer substrate is attached to the base material via the electrode, and the main surface of the portion 3 is not parallel to the main surface of the portion 1 in a portion where the electrode is connected to the base material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-039718 | 2017-03-02 | ||
| JP2017039718 | 2017-03-02 | ||
| PCT/JP2018/008147 WO2018159839A1 (en) | 2017-03-02 | 2018-03-02 | Resin multilayer substrate and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725458U true CN210725458U (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201890000469.7U Active CN210725458U (en) | 2017-03-02 | 2018-03-02 | Resin multilayer substrate and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN210725458U (en) |
| WO (1) | WO2018159839A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020121984A1 (en) * | 2018-12-11 | 2020-06-18 | 株式会社村田製作所 | Electronic device and flat cable |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08116147A (en) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | Connection structure of rigid substrate |
| JP3744383B2 (en) * | 2000-06-09 | 2006-02-08 | 松下電器産業株式会社 | Composite wiring board and manufacturing method thereof |
| JP4839713B2 (en) * | 2005-07-25 | 2011-12-21 | 株式会社村田製作所 | Circuit board and circuit board manufacturing method |
| JP4857024B2 (en) * | 2006-05-15 | 2012-01-18 | 株式会社フジクラ | Printed wiring board and manufacturing method thereof |
| JP6233524B2 (en) * | 2014-09-04 | 2017-11-22 | 株式会社村田製作所 | Component built-in board |
-
2018
- 2018-03-02 WO PCT/JP2018/008147 patent/WO2018159839A1/en active Application Filing
- 2018-03-02 CN CN201890000469.7U patent/CN210725458U/en active Active
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| WO2018159839A1 (en) | 2018-09-07 |
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