JP6863230B2

JP6863230B2 - Circuit elements and electronic devices

Info

Publication number: JP6863230B2
Application number: JP2017209087A
Authority: JP
Inventors: 直樹郷地
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 2017-10-30
Filing date: 2017-10-30
Publication date: 2021-04-21
Anticipated expiration: 2037-10-30
Also published as: JP2019083240A; CN209250933U

Description

本発明は、屈曲部を有する基板構造の回路素子と、この回路素子を備える電子機器に関する。 The present invention relates to a circuit element having a substrate structure having a bent portion and an electronic device including the circuit element.

例えば携帯電子機器において、局所的に屈曲部を有し、外部出力端子が形成されたフレキシブルな回路基板が特許文献１に示されている。 For example, in a portable electronic device, Patent Document 1 shows a flexible circuit board having a locally bent portion and an external output terminal formed therein.

国際公開第２０１４／１０３５０９号International Publication No. 2014/10309

特許文献１に記載のフレキシブル回路基板は、このフレキシブル回路基板を他の回路基板の所定位置に電気的に接続するために、局所的な屈曲部が設けられている。 The flexible circuit board described in Patent Document 1 is provided with a locally bent portion in order to electrically connect the flexible circuit board to a predetermined position of another circuit board.

ところが、このように、局所的な屈曲部を有すると、実装先の回路基板に対するフレキシブル回路基板の接続部（フレキシブル回路の支持部）に応力が集中しやすく、接続部で変形や破損が生じやすい。 However, when a local bent portion is provided in this way, stress is likely to be concentrated on the connection portion (support portion of the flexible circuit) of the flexible circuit board with respect to the mounting destination circuit board, and the connection portion is likely to be deformed or damaged. ..

そこで、本発明の目的は、屈曲部を有しながらも、接続部の変形や破損が生じ難い回路素子、およびこの回路素子を備える電子機器を提供することにある。 Therefore, an object of the present invention is to provide a circuit element having a bent portion but less likely to be deformed or damaged at the connecting portion, and an electronic device including the circuit element.

（１）本発明の回路素子は、
回路が形成された第１基板部と、
第２基板部配線導体および外部接続電極が形成された第２基板部と、
前記第２基板部配線導体と前記回路との間を接続する屈曲部配線導体が形成され、前記第１基板部と前記第２基板部とに連続する屈曲部と、
で構成され、互いに対向する第１主面および第２主面を有する回路素子であって、
前記屈曲部は、前記第２主面側が内側になるよう屈曲されており、
前記屈曲部は、前記第２基板部に比べて前記屈曲部配線導体の延伸方向に直交する方向の幅が細く、
前記外部接続電極は、前記第２基板部の前記屈曲部からの延伸部に相当する支持部に形成されていて、
前記第２基板部は、前記延伸部を両側から挟む２つの領域である両側部を有し、
前記第２基板部は、当該第２基板部に形成され、前記第１基板部および前記屈曲部には形成されない、第２基板部導体パターンを有し、
前記第２基板部導体パターンは、前記延伸部から前記両側部に亘って形成されていて、
前記第２基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記第２基板部配線導体よりも前記第２主面側に配置されている、
ことを特徴としている。 (1) The circuit element of the present invention is
The first board part where the circuit was formed and
2nd board part The 2nd board part on which the wiring conductor and the external connection electrode are formed,
A bent portion wiring conductor connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion and a bent portion.
A circuit element composed of, and having a first main surface and a second main surface facing each other.
The bent portion is bent so that the second main surface side is on the inside.
The bent portion has a narrower width in the direction orthogonal to the extending direction of the bent portion wiring conductor than the second substrate portion.
The external connection electrode is formed on a support portion corresponding to a extending portion of the second substrate portion from the bent portion.
The second substrate portion has both side portions which are two regions sandwiching the stretched portion from both sides.
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion.
The second substrate portion conductor pattern is formed from the stretched portion to both side portions.
The second substrate portion conductor pattern is arranged at the position on the bent portion side of the external connection electrode and on the second main surface side of the second substrate portion wiring conductor in the support portion. Yes,
It is characterized by that.

上記構成によれば、外部接続電極は、平面視で、屈曲部の、第２基板部側への延伸部に相当する支持部に形成されていて、この支持部において第２基板部導体パターンは外部接続電極よりも屈曲部側の位置にあるので、そして、更に、第２基板部導体パターンは配線導体よりも第２主面側に配置されているので、屈曲部の可撓性が損なわれることなく、外部接続電極付近の変形が抑制されて、接続不良が生じ難い構造となる。また、第２基板部配線導体が第２基板部導体パターンで補強されるので、第２基板部配線導体と屈曲部配線導体との境界部における断線等も抑制される。また、屈曲部での屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。
According to the above configuration, the external connection electrode is formed in the support portion corresponding to the extension portion of the bent portion toward the second substrate portion in a plan view, and the conductor pattern of the second substrate portion is formed in this support portion. Since it is located on the bent portion side of the external connection electrode, and further, since the second substrate portion conductor pattern is arranged on the second main surface side of the wiring conductor, the flexibility of the bent portion is impaired. Without this, deformation in the vicinity of the external connection electrode is suppressed, and the structure is such that connection failure is unlikely to occur. Further, since the second substrate portion wiring conductor is reinforced by the second substrate portion conductor pattern, disconnection or the like at the boundary portion between the second substrate portion wiring conductor and the bent portion wiring conductor is suppressed. In addition, the stress generated by bending at the bent portion is reduced, and the connection portion is less likely to be deformed or damaged.

（２）前記第１基板部、前記第２基板部および前記屈曲部は、多層基板で構成されていて、前記第２基板部配線導体は前記第２主面よりも前記第１主面に近い層に形成されていることが好ましい。この構造によれば、第２基板部配線導体と外部接続電極との層間距離が短縮化されるので、曲げ応力に対する、第２基板部配線導体と外部接続電極との層間接続部の破損が生じ難くなる。 (2) The first substrate portion, the second substrate portion, and the bent portion are composed of a multilayer substrate, and the wiring conductor of the second substrate portion is closer to the first main surface than the second main surface. It is preferably formed in layers. According to this structure, the interlayer distance between the second substrate wiring conductor and the external connection electrode is shortened, so that the interlayer connection between the second substrate wiring conductor and the external connection electrode is damaged due to bending stress. It becomes difficult.

（３）前記屈曲部は、前記第１基板部または前記第２基板部の少なくとも一方よりも薄いことが好ましい。この構造によれば、屈曲部の屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。 ( 3 ) The bent portion is preferably thinner than at least one of the first substrate portion and the second substrate portion. According to this structure, the stress generated by the bending of the bent portion is reduced, and the connection portion is less likely to be deformed or broken.

（４）前記第２基板部は前記屈曲部より厚いことが好ましい。この構造によれば、支持部の剛性が高まり、接続部の変形や破損が生じ難い。 ( 4 ) The second substrate portion is preferably thicker than the bent portion. According to this structure, the rigidity of the support portion is increased, and the connection portion is less likely to be deformed or damaged.

（５）前記第２基板部の基材は樹脂材料で構成されていて、前記第２基板部に、当該第２基板部の前記基材よりもヤング率の高い補強部材が配置されていることが好ましい。この構造により、支持部の剛性が高まり、接続部の変形や破損が生じ難くなる。 ( 5 ) The base material of the second substrate portion is made of a resin material, and a reinforcing member having a higher Young's modulus than the base material of the second substrate portion is arranged on the second substrate portion. Is preferable. With this structure, the rigidity of the support portion is increased, and the connection portion is less likely to be deformed or damaged.

（６）本発明の電子機器は、
実装電極が形成された回路基板と、当該回路基板に接続される回路素子とを備え、
前記回路素子は、
回路が形成された第１基板部と、
第２基板部配線導体および外部接続電極が形成された第２基板部と、
前記第２基板部配線導体と前記回路との間を接続する屈曲部配線導体が形成され、前記第１基板部と前記第２基板部とに連続する屈曲部と、
で構成され、互いに対向する第１主面および第２主面を有する回路素子であって、
前記屈曲部は、前記第２主面側が内側になるよう屈曲されており、
前記屈曲部は、前記第２基板部に比べて前記屈曲部配線導体の延伸方向に直交する方向の幅が細く、
前記外部接続電極は、前記第２基板部の前記屈曲部からの延伸部に相当する支持部に形成されていて、
前記第２基板部は、前記延伸部を両側から挟む２つの領域である両側部を有し、
前記第２基板部は、当該第２基板部に形成され、前記第１基板部および前記屈曲部には形成されない、第２基板部導体パターンを有し、
前記第２基板部導体パターンは、前記延伸部から前記両側部に亘って形成されていて、
前記第２基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記第２基板部配線導体よりも前記第２主面側に配置されている、
ことを特徴としている。 ( 6 ) The electronic device of the present invention is
A circuit board on which mounting electrodes are formed and a circuit element connected to the circuit board are provided.
The circuit element is
The first board part where the circuit was formed and
2nd board part The 2nd board part on which the wiring conductor and the external connection electrode are formed,
A bent portion wiring conductor connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion and a bent portion.
A circuit element composed of, and having a first main surface and a second main surface facing each other.
The bent portion is bent so that the second main surface side is on the inside.
The bent portion has a narrower width in the direction orthogonal to the extending direction of the bent portion wiring conductor than the second substrate portion.
The external connection electrode is formed on a support portion corresponding to a extending portion of the second substrate portion from the bent portion.
The second substrate portion has both side portions which are two regions sandwiching the stretched portion from both sides.
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion.
The second substrate portion conductor pattern is formed from the stretched portion to both side portions.
The second substrate portion conductor pattern is arranged at the position on the bent portion side of the external connection electrode and on the second main surface side of the second substrate portion wiring conductor in the support portion. Yes,
It is characterized by that.

上記構成によれば、屈曲部の可撓性が損なわれることなく、支持部における外部接続電極付近の変形が抑制されて、接続不良が生じ難い電子機器が得られる。また、第２基板部配線導体と屈曲部配線導体との境界部における断線等が生じ難い電子機器が得られる。
According to the above configuration, it is possible to obtain an electronic device in which deformation of the support portion in the vicinity of the external connection electrode is suppressed without impairing the flexibility of the bent portion, and connection failure is unlikely to occur. Further, it is possible to obtain an electronic device in which disconnection or the like is unlikely to occur at the boundary between the wiring conductor of the second substrate portion and the wiring conductor of the bent portion.

本発明によれば、屈曲部の可撓性が損なわれることなく、支持部における外部接続電極付近の変形が抑制されて、接続不良が生じ難く、また、第２基板部配線導体と屈曲部配線導体との境界部における断線等も抑制された回路素子およびそれを備えた電子機器が得られる。 According to the present invention, deformation of the support portion in the vicinity of the external connection electrode is suppressed without impairing the flexibility of the bent portion, connection failure is unlikely to occur, and the second substrate portion wiring conductor and the bent portion wiring are not impaired. A circuit element in which disconnection at the boundary with the conductor is suppressed and an electronic device provided with the circuit element can be obtained.

図１は第１の実施形態に係る回路素子３の斜視図である。FIG. 1 is a perspective view of the circuit element 3 according to the first embodiment. 図２は第１の実施形態の回路素子３を備える電子機器１０１の縦断面図である。FIG. 2 is a vertical sectional view of an electronic device 101 including the circuit element 3 of the first embodiment. 図３は第１の実施形態の回路素子３の屈曲前の縦断面図である。FIG. 3 is a vertical cross-sectional view of the circuit element 3 of the first embodiment before bending. 図４は第１の実施形態の回路素子３の各基材の積層前の平面図である。FIG. 4 is a plan view of the circuit elements 3 of the first embodiment before laminating each base material. 図５は第２の実施形態に係る電子機器１０２の縦断面図である。FIG. 5 is a vertical sectional view of the electronic device 102 according to the second embodiment. 図６は第２の実施形態の回路素子３の屈曲前の縦断面図である。FIG. 6 is a vertical cross-sectional view of the circuit element 3 of the second embodiment before bending. 図７は第２の実施形態の回路素子３の各基材の積層前の平面図である。FIG. 7 is a plan view of the circuit elements 3 of the second embodiment before laminating each base material. 図８は第３の実施形態に係る電子機器１０３の縦断面図である。FIG. 8 is a vertical cross-sectional view of the electronic device 103 according to the third embodiment.

以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。要点の説明または理解の容易性を考慮して、便宜上実施形態を分けて示すが、異なる実施形態で示した構成の部分的な置換または組み合わせは可能である。第２の実施形態以降では第１の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。 Hereinafter, a plurality of embodiments for carrying out the present invention will be shown with reference to the drawings with reference to some specific examples. The same reference numerals are given to the same parts in each figure. Although the embodiments are shown separately for convenience in consideration of the explanation of the main points or the ease of understanding, partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

《第１の実施形態》
図１は第１の実施形態に係る回路素子３の斜視図である。図２は回路素子３を備える電子機器の縦断面図である。この電子機器１０１は、第１部材１と、第２部材２と、第２部材２に接続されて第１部材１に対して所定の位置関係に配置された回路素子３と、を備える。 << First Embodiment >>
FIG. 1 is a perspective view of the circuit element 3 according to the first embodiment. FIG. 2 is a vertical cross-sectional view of an electronic device including the circuit element 3. The electronic device 101 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and arranged in a predetermined positional relationship with respect to the first member 1.

回路素子３は、第１基板部３１と、第２基板部３２と、屈曲部３３と、で構成される。 The circuit element 3 is composed of a first substrate portion 31, a second substrate portion 32, and a bent portion 33.

第１基板部３１には回路導体３１Ｃによる回路が形成されている。第２基板部３２には、第２基板部導体パターン３２Ｃ、第２基板部配線導体３２Ｗおよび外部接続電極３２Ｅが形成されている。屈曲部３３は第１基板部３１と第２基板部３２とに連続する。この屈曲部３３には、第２基板部配線導体３２Ｗと回路導体３１Ｃとの間を接続する屈曲部配線導体３３Ｗが形成されている。 A circuit formed by the circuit conductor 31C is formed on the first substrate portion 31. The second substrate portion 32 is formed with the second substrate portion conductor pattern 32C, the second substrate portion wiring conductor 32W, and the external connection electrode 32E. The bent portion 33 is continuous with the first substrate portion 31 and the second substrate portion 32. The bent portion 33 is formed with a bent portion wiring conductor 33W that connects between the second substrate portion wiring conductor 32W and the circuit conductor 31C.

回路素子３は、互いに対向する第１主面ＭＳ１および第２主面ＭＳ２を有する。屈曲部３３は、第１主面ＭＳ１側が内側になるよう屈曲されている。 The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The bent portion 33 is bent so that the first main surface MS1 side is on the inside.

第１基板部３１には、回路導体３１Ｃ等による回路が形成されている。屈曲部３３には、第１基板部３１と第２基板部３２との間を接続する屈曲部配線導体３３Ｗが形成されている。 A circuit made of a circuit conductor 31C or the like is formed on the first substrate portion 31. The bent portion 33 is formed with a bent portion wiring conductor 33W that connects between the first substrate portion 31 and the second substrate portion 32.

図１に示すように、第２基板部３２には、屈曲部３３を支持する支持部ＳＰを備える。この支持部ＳＰは、平面視で（Ｚ軸方向に視て）、屈曲部３３の、第２基板部３２側への延伸部に相当する部分である。外部接続電極３２Ｅは支持部ＳＰに形成されている。 As shown in FIG. 1, the second substrate portion 32 is provided with a support portion SP that supports the bent portion 33. This support portion SP is a portion corresponding to a portion of the bent portion 33 extending toward the second substrate portion 32 in a plan view (viewed in the Z-axis direction). The external connection electrode 32E is formed on the support portion SP.

第２基板部導体パターン３２Ｃは、支持部ＳＰにおいて、外部接続電極３２Ｅよりも屈曲部３３側の位置にあって、且つ第２基板部配線導体３２Ｗよりも第２主面ＭＳ２側に配置されている。この構造により、第２基板部３２の第２基板部導体パターン３２Ｃ周囲の領域は補強領域ＲＡとして作用する。つまり、補強領域ＲＡは剛性が高いので、補強領域ＲＡから外部接続電極３２Ｅまでの間は変形しにくくなる。そのため、屈曲部３３の屈曲による応力が外部接続電極３２Ｅに掛かりにくくなる。 The second substrate portion conductor pattern 32C is located at the position on the bending portion 33 side of the external connection electrode 32E and on the second main surface MS2 side of the second substrate portion wiring conductor 32W in the support portion SP. There is. Due to this structure, the region around the second substrate portion conductor pattern 32C of the second substrate portion 32 acts as a reinforcing region RA. That is, since the reinforcing region RA has high rigidity, it is difficult to deform between the reinforcing region RA and the external connection electrode 32E. Therefore, the stress due to the bending of the bent portion 33 is less likely to be applied to the external connection electrode 32E.

本実施形態では、第１部材１は永久磁石であり、第２部材２は回路基板である。第１基板部３１の回路導体３１Ｃは電磁石として作用する。この回路導体３１Ｃによる電磁石と第１部材（永久磁石）１との相互作用により、両者間に電磁力が働く。この例では、第１基板部３１は固定されているので、上記電磁力により第１部材（永久磁石）１が図中の矢印方向（Ｘ軸方向）に移動する。 In the present embodiment, the first member 1 is a permanent magnet and the second member 2 is a circuit board. The circuit conductor 31C of the first substrate portion 31 acts as an electromagnet. An electromagnetic force acts between the electromagnet and the first member (permanent magnet) 1 by the circuit conductor 31C. In this example, since the first substrate portion 31 is fixed, the first member (permanent magnet) 1 moves in the arrow direction (X-axis direction) in the drawing due to the electromagnetic force.

回路素子３の第２基板部３２の第１主面ＭＳ１には外部接続電極３２Ｅが形成されている。第２部材２は、回路素子３の外部接続電極３２Ｅが接続される実装電極２Ｅを備えている。回路素子３の第２基板部３２の外部接続電極３２Ｅは、はんだ等の接合材を介して、第２部材２の実装電極２Ｅに接合されている。 An external connection electrode 32E is formed on the first main surface MS1 of the second substrate portion 32 of the circuit element 3. The second member 2 includes a mounting electrode 2E to which the external connection electrode 32E of the circuit element 3 is connected. The external connection electrode 32E of the second substrate portion 32 of the circuit element 3 is joined to the mounting electrode 2E of the second member 2 via a bonding material such as solder.

屈曲部配線導体３３Ｗは、第２主面ＭＳ２よりも第１主面ＭＳ１寄りの層に形成されている。 The bent portion wiring conductor 33W is formed in a layer closer to the first main surface MS1 than the second main surface MS2.

回路素子３の屈曲部３３は屈曲部３２ＢＳを有する。この屈曲部３２ＢＳは、第２主面ＭＳ２側が曲げの内側になり、且つ第１主面ＭＳ１が第２主面ＭＳ２より第１部材１から遠ざかるように曲げられた部分である。 The bent portion 33 of the circuit element 3 has a bent portion 32BS. The bent portion 32BS is a portion in which the second main surface MS2 side is inside the bending and the first main surface MS1 is bent away from the second main surface MS2 from the first member 1.

図３は上記回路素子３の、屈曲前の縦断面図である。この回路素子３は、例えば液晶ポリマー（ＬＣＰ）やポリエーテルエーテルケトン（ＰＥＥＫ）を主材料とする熱可塑性樹脂基材を積層形成した多層基板である。回路導体３１Ｃ、屈曲部配線導体３３Ｗ、第２基板部配線導体３２Ｗ、外部接続電極３２Ｅのうち、基材の層方向に延びる導体パターンは銅箔をパターン化したものである。異なる層に形成された導体パターン同士は、層間接続導体で接続されている。この層間接続導体は、例えば、上記基材にレーザー等で孔を形成した後、Ｃｕ，Ｓｎまたはこれらの合金等の導電性粒子を含む導電性ペーストを配設し、後の加熱プレス処理で硬化させることによって設けられる。 FIG. 3 is a vertical cross-sectional view of the circuit element 3 before bending. The circuit element 3 is a multilayer substrate formed by laminating a thermoplastic resin base material containing, for example, a liquid crystal polymer (LCP) or a polyetheretherketone (PEEK) as a main material. Of the circuit conductor 31C, the bent portion wiring conductor 33W, the second substrate portion wiring conductor 32W, and the external connection electrode 32E, the conductor pattern extending in the layer direction of the base material is a pattern of copper foil. Conductor patterns formed in different layers are connected by an interlayer connecting conductor. For this interlayer connection conductor, for example, after forming holes in the base material with a laser or the like, a conductive paste containing conductive particles such as Cu, Sn or an alloy thereof is arranged and cured by a subsequent heat press treatment. It is provided by letting it.

図４は、回路素子３の各基材の積層前の平面図である。なお、図４では、説明の都合上一つの個片に切り出した状態での平面図である。実際の多層基板の製造工程は集合基板状態で行われる。 FIG. 4 is a plan view of each base material of the circuit element 3 before laminating. Note that FIG. 4 is a plan view in a state of being cut out into one piece for convenience of explanation. The actual manufacturing process of the multilayer board is performed in the state of a collective board.

図４において、基材Ｓ２，Ｓ３に回路導体３１Ｃが形成されていて、基材Ｓ３に屈曲部配線導体３３Ｗおよび第２基板部配線導体３２Ｗが形成されている。また、基材Ｓ２に第２基板部導体パターン３２Ｃが形成されている。さらに、基材Ｓ４に外部接続電極３２Ｅが形成されている。図４中の破線の丸は層間接続導体を表している。基材Ｓ１には導体パターンは形成されていない。回路導体３１Ｃは約２ターンのコイルを形成している。 In FIG. 4, the circuit conductor 31C is formed on the base materials S2 and S3, and the bent portion wiring conductor 33W and the second substrate portion wiring conductor 32W are formed on the base material S3. Further, the second substrate portion conductor pattern 32C is formed on the base material S2. Further, the external connection electrode 32E is formed on the base material S4. The broken line circles in FIG. 4 represent the interlayer connecting conductors. No conductor pattern is formed on the base material S1. The circuit conductor 31C forms a coil of about 2 turns.

屈曲部３３は、屈曲部配線導体３３Ｗの延伸方向（Ｘ軸方向）に直交する方向（Ｙ軸方向）の幅（図４中の“Ｗ”）が第１基板部３１および第２基板部３２の幅より細い。 The width (“W” in FIG. 4) of the bent portion 33 in the direction (Y-axis direction) orthogonal to the extending direction (X-axis direction) of the bent portion wiring conductor 33W is the first substrate portion 31 and the second substrate portion 32. It is thinner than the width of.

このように、支持部ＳＰは、平面視で（Ｚ軸方向に視て）、屈曲部３３の、第２基板部３２側への延伸部に相当する部分であり、この支持部ＳＰ内に外部接続電極３２Ｅが形成されている。 As described above, the support portion SP is a portion corresponding to the extension portion of the bent portion 33 toward the second substrate portion 32 side in a plan view (viewed in the Z-axis direction), and is external inside the support portion SP. The connection electrode 32E is formed.

この回路素子３を第２部材２に実装する際、図２に示したように、第２基板部３２の外部接続電極３２Ｅを第２部材２の実装電極２Ｅに接続し、回路素子３の屈曲部３３の所定箇所をＹ軸に平行な軸の回りに沿って、断面Ｌ字状に屈曲させ、第１基板部３１を第１部材１に対面するように起立させる。 When the circuit element 3 is mounted on the second member 2, as shown in FIG. 2, the external connection electrode 32E of the second substrate portion 32 is connected to the mounting electrode 2E of the second member 2, and the circuit element 3 is bent. A predetermined portion of the portion 33 is bent in an L-shaped cross section along an axis parallel to the Y axis, and the first substrate portion 31 is erected so as to face the first member 1.

本実施形態によれば、次のような作用効果を奏する。 According to this embodiment, the following effects are exhibited.

（ａ）屈曲部３３の可撓性が損なわれることなく、外部接続電極３２Ｅ付近の変形が抑制されて、接続不良が生じ難い構造となる。また、第２基板部配線導体３２Ｗが第２基板部導体パターン３２Ｃで補強されるので、第２基板部配線導体３２Ｗと屈曲部配線導体３３Ｗとの境界部における断線等も抑制される。 (A) The structure is such that the flexibility of the bent portion 33 is not impaired, the deformation in the vicinity of the external connection electrode 32E is suppressed, and connection failure is unlikely to occur. Further, since the second substrate portion wiring conductor 32W is reinforced by the second substrate portion conductor pattern 32C, disconnection or the like at the boundary between the second substrate portion wiring conductor 32W and the bent portion wiring conductor 33W is suppressed.

（ｂ）第２基板部３２の変形に伴う第２基板部３２と第１部材１との不要な結合に伴う特性変化を抑制できる。 (B) It is possible to suppress a change in characteristics due to unnecessary coupling between the second substrate portion 32 and the first member 1 due to deformation of the second substrate portion 32.

（ｃ）第２基板部配線導体３２Ｗは第２主面ＭＳ２よりも第１主面ＭＳ１に近い層に形成されているので、第２基板部配線導体３２Ｗと外部接続電極３２Ｅとの層間距離が短縮化され、曲げ応力に対する、第２基板部配線導体３２Ｗと外部接続電極３２Ｅとの層間接続部の破損が生じ難くなる。 (C) Since the second substrate portion wiring conductor 32W is formed in a layer closer to the first main surface MS1 than the second main surface MS2, the interlayer distance between the second substrate portion wiring conductor 32W and the external connection electrode 32E is large. It is shortened, and the interlayer connection portion between the second substrate portion wiring conductor 32W and the external connection electrode 32E is less likely to be damaged due to bending stress.

（ｄ）屈曲部３３は、屈曲部配線導体３３Ｗの延伸方向に直交する方向の幅Ｗが第２基板部３２より細いので、屈曲部３３での屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。 (D) Since the width W of the bent portion 33 in the direction orthogonal to the stretching direction of the bent portion wiring conductor 33W is narrower than that of the second substrate portion 32, the stress generated by the bending at the bent portion 33 is reduced, and the connecting portion Is unlikely to be deformed or damaged.

（ｅ）第１基板部３１、第２基板部３２、および屈曲部３３は、複数の基材層が積層されてなる単一の多層基板で構成されたものであるので、第１基板部３１、第２基板部３２、および屈曲部３３は一体物として容易に製造できる。 (E) Since the first substrate portion 31, the second substrate portion 32, and the bent portion 33 are composed of a single multilayer substrate in which a plurality of substrate layers are laminated, the first substrate portion 31 , The second substrate portion 32, and the bent portion 33 can be easily manufactured as an integral body.

（ｆ）第１基板部３１と屈曲部３３との境界、第２基板部３２と屈曲部３３との境界がいずれも連続した構造体となるので、曲げ応力による破損が抑制される。 (F) Since the boundary between the first substrate portion 31 and the bent portion 33 and the boundary between the second substrate portion 32 and the bent portion 33 are both continuous structures, damage due to bending stress is suppressed.

《第２の実施形態》
第２の実施形態では、第１の実施形態とは形状が異なる回路素子３および、それを備えた電子機器の例を示す。 << Second Embodiment >>
The second embodiment shows an example of a circuit element 3 having a shape different from that of the first embodiment and an electronic device including the circuit element 3.

図５は第２の実施形態に係る電子機器１０２の縦断面図である。図６は、上記回路素子３の、屈曲前の縦断面図である。この電子機器１０２は、第１部材１と、第２部材２と、第２部材２に接続されて第１部材１に対して所定の位置関係に配置された回路素子３と、を備える。 FIG. 5 is a vertical sectional view of the electronic device 102 according to the second embodiment. FIG. 6 is a vertical cross-sectional view of the circuit element 3 before bending. The electronic device 102 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and arranged in a predetermined positional relationship with respect to the first member 1.

回路素子３は、互いに対向する第１主面ＭＳ１および第２主面ＭＳ２を有する。回路素子３は、第１基板部３１と、第２部材２に電気的に接続される第２基板部３２と、第１基板部３１と第２基板部３２とに連続する屈曲部３３と、で構成されている。 The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The circuit element 3 includes a first substrate portion 31, a second substrate portion 32 that is electrically connected to the second member 2, and a bent portion 33 that is continuous with the first substrate portion 31 and the second substrate portion 32. It is composed of.

図７は、回路素子３の各基材の積層前の平面図である。図７において、基材Ｓ１，Ｓ２，Ｓ３に回路導体３１Ｃが形成されていて、基材Ｓ３に屈曲部配線導体３３Ｗおよび第２基板部配線導体３２Ｗが形成されている。また、基材Ｓ２に第２基板部導体パターン３２Ｃが形成されている。さらに、基材Ｓ４に外部接続電極３２Ｅが形成されている。図７中の破線の丸は層間接続導体を表している。回路導体３１Ｃは約３ターンのコイルを形成している。 FIG. 7 is a plan view of the circuit elements 3 before laminating each base material. In FIG. 7, the circuit conductor 31C is formed on the base materials S1, S2, and S3, and the bent portion wiring conductor 33W and the second substrate portion wiring conductor 32W are formed on the base material S3. Further, the second substrate portion conductor pattern 32C is formed on the base material S2. Further, the external connection electrode 32E is formed on the base material S4. The broken line circles in FIG. 7 represent the interlayer connecting conductors. The circuit conductor 31C forms a coil of about 3 turns.

回路素子３の基本的な構成は第１の実施形態で示したものと同じであるが、本実施形態では、屈曲部３３は、第１基板部３１および第２基板部３２よりも薄い。この構造によれば、屈曲部３３での屈曲により発生する応力が小さくなって、第２基板部３２の変形や破損が生じ難い。 The basic configuration of the circuit element 3 is the same as that shown in the first embodiment, but in the present embodiment, the bent portion 33 is thinner than the first substrate portion 31 and the second substrate portion 32. According to this structure, the stress generated by the bending at the bent portion 33 is reduced, and the second substrate portion 32 is less likely to be deformed or damaged.

また、第２基板部３２は屈曲部３３より厚い。この構造によれば、支持部（図１中の支持部ＳＰ参照）の剛性が高まり、接続部の変形や破損が生じ難い。 Further, the second substrate portion 32 is thicker than the bent portion 33. According to this structure, the rigidity of the support portion (see the support portion SP in FIG. 1) is increased, and the connection portion is less likely to be deformed or damaged.

《第３の実施形態》
第３の実施形態では、回路素子の第２基板部の構造が第２の実施形態とは異なる例を示す。 << Third Embodiment >>
In the third embodiment, an example in which the structure of the second substrate portion of the circuit element is different from that of the second embodiment is shown.

図８は第３の実施形態に係る電子機器１０３の縦断面図である。この電子機器１０３は、第１部材１と、第２部材２と、第２部材２に接続されて第１部材１に対して所定の位置関係に配置された回路素子３と、を備える。第１部材１、第２部材２の構成は第１・第２の実施形態で示したものと同じである。 FIG. 8 is a vertical cross-sectional view of the electronic device 103 according to the third embodiment. The electronic device 103 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and arranged in a predetermined positional relationship with respect to the first member 1. The configurations of the first member 1 and the second member 2 are the same as those shown in the first and second embodiments.

図８に表れているように、回路素子３の第２基板部３２の外部接続電極３２Ｅの形成面に、はんだレジスト膜等のレジスト膜３２Ｌが形成されている。 As shown in FIG. 8, a resist film 32L such as a solder resist film is formed on the forming surface of the external connection electrode 32E of the second substrate portion 32 of the circuit element 3.

本実施形態によれば、第２基板部３２の基材が樹脂材料で構成されていて、第２基板部３２に、当該第２基板部３２の基材よりもヤング率の高い補強部材が配置された構造となる。この構造により、第２基板部３２および支持部（図１に示す支持部ＳＰ）の剛性が高まり、接続部の変形や破損が生じ難くなる。 According to the present embodiment, the base material of the second substrate portion 32 is made of a resin material, and a reinforcing member having a higher Young's modulus than the base material of the second substrate portion 32 is arranged on the second substrate portion 32. It becomes the structure that was made. With this structure, the rigidity of the second substrate portion 32 and the support portion (support portion SP shown in FIG. 1) is increased, and the connection portion is less likely to be deformed or damaged.

レジスト膜３２Ｌは例えばエポキシ樹脂である。エポキシ樹脂のヤング率は2.4GPaであり、液晶ポリマー（ＬＣＰ）のヤング率1GPaより高い。 The resist film 32L is, for example, an epoxy resin. The Young's modulus of epoxy resin is 2.4 GPa, which is higher than the Young's modulus of liquid crystal polymer (LCP) of 1 GPa.

上記レジスト膜３２Ｌの代わりに、例えばポリイミド（ＰＩ）製のカバーフィルムを貼付してもよい。ポリイミドのヤング率は5GPaであり、液晶ポリマー（ＬＣＰ）のヤング率１GPaより高い。 Instead of the resist film 32L, for example, a cover film made of polyimide (PI) may be attached. The Young's modulus of polyimide is 5 GPa, which is higher than the Young's modulus of liquid crystal polymer (LCP) of 1 GPa.

また、上記レジスト膜３２Ｌや上記カバーフィルムは、第２基板部３２の外部接続電極３２Ｅの形成面とは反対面に形成してもよい。 Further, the resist film 32L and the cover film may be formed on a surface opposite to the surface on which the external connection electrode 32E of the second substrate portion 32 is formed.

《他の実施形態》
図２、図５、図８等では、回路素子３の屈曲部３３の略全体が屈曲部である例を示したが、屈曲部３３の一部に比較的小さな曲率半径の屈曲部を形成してもよい。 << Other Embodiments >>
In FIGS. 2, 5, 8, 8 and the like, an example is shown in which substantially the entire bent portion 33 of the circuit element 3 is a bent portion, but a bent portion having a relatively small radius of curvature is formed in a part of the bent portion 33. You may.

また、図１、図２等に示した例では、回路素子３は、屈曲前の状態でＸ−Ｙ面にあって、それをＹ軸に平行な軸の回りにのみ屈曲させる例を示したが、複数の屈曲部があってもよい。それらの屈曲部のうち、一つは上記Ｙ軸に平行な軸の回りとは別の軸回りに屈曲させる屈曲部であってもよい。 Further, in the examples shown in FIGS. 1 and 2, the circuit element 3 is on the XY plane in the state before bending, and the circuit element 3 is bent only around an axis parallel to the Y axis. However, there may be a plurality of bends. One of the bent portions may be a bent portion that is bent around an axis parallel to the Y axis and around an axis different from that around the axis.

最後に、上述の実施形態の説明は、すべての点で例示であって、制限的なものではない。当業者にとって変形および変更が適宜可能である。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変更が含まれる。 Finally, the description of the embodiments described above is exemplary in all respects and is not restrictive. Modifications and changes can be made as appropriate for those skilled in the art. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims. Further, the scope of the present invention includes modifications from the embodiment within the scope of the claims and within the scope of the claims.

ＭＳ１…第１主面
ＭＳ２…第２主面
Ｓ１〜Ｓ４…基材
ＳＰ…支持部
１…第１部材
２…第２部材
２Ｅ…実装電極
３…回路素子
３１…第１基板部
３１Ｃ…回路導体
３２…第２基板部
３２ＢＳ…屈曲部
３２Ｃ…第２基板部導体パターン
３２Ｅ…外部接続電極
３２Ｌ…レジスト膜
３２Ｗ…第２基板部配線導体
３３…屈曲部
３３Ｗ…屈曲部配線導体
１０１〜１０３…電子機器 MS1 ... First main surface MS2 ... Second main surface S1 to S4 ... Base material SP ... Support part 1 ... First member 2 ... Second member 2E ... Mounting electrode 3 ... Circuit element 31 ... First substrate part 31C ... Circuit conductor 32 ... Second substrate portion 32BS ... Bending portion 32C ... Second substrate portion conductor pattern 32E ... External connection electrode 32L ... Resist film 32W ... Second substrate portion wiring conductor 33 ... Bending portion 33W ... Bending portion wiring conductor 101-103 ... Electron machine

Claims

The first board part where the circuit was formed and
2nd board part The 2nd board part on which the wiring conductor and the external connection electrode are formed,
A bent portion wiring conductor connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion and a bent portion.
A circuit element composed of, and having a first main surface and a second main surface facing each other.
The bent portion is bent so that the second main surface side is on the inside.
The bent portion has a narrower width in the direction orthogonal to the extending direction of the bent portion wiring conductor than the second substrate portion.
The external connection electrode is formed on a support portion corresponding to a extending portion of the second substrate portion from the bent portion.
The second substrate portion has both side portions which are two regions sandwiching the stretched portion from both sides.
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion.
The second substrate portion conductor pattern is formed from the stretched portion to both side portions.
The second substrate portion conductor pattern is arranged at the position on the bent portion side of the external connection electrode and on the second main surface side of the second substrate portion wiring conductor in the support portion. Ori,
The second substrate conductor pattern is not exposed on the second main surface side.
Circuit element.

The first substrate portion, the second substrate portion, and the bent portion are composed of a multilayer substrate.
The wiring conductor of the second substrate portion is formed in a layer closer to the first main surface than the second main surface.
The circuit element according to claim 1.

The bent portion is thinner than at least one of the first substrate portion and the second substrate portion.
The circuit element according to claim 1 or 2.

The second substrate portion is thicker than the bent portion.
The circuit element according to claim 3.

The base material of the second substrate portion is made of a resin material, and a reinforcing member having a Young's modulus higher than that of the base material of the second substrate portion is arranged on the second substrate portion.
The circuit element according to any one of claims 1 to 4.

An electronic device including a circuit board on which mounting electrodes are formed and a circuit element connected to the circuit board.
The circuit element is
The first board part where the circuit was formed and
2nd board part The 2nd board part on which the wiring conductor and the external connection electrode are formed,
A bent portion wiring conductor connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion and a bent portion.
A circuit element composed of, and having a first main surface and a second main surface facing each other.
The bent portion is bent so that the second main surface side is on the inside.
The bent portion has a narrower width in the direction orthogonal to the extending direction of the bent portion wiring conductor than the second substrate portion.
The external connection electrode is formed on a support portion corresponding to a extending portion of the second substrate portion from the bent portion.
The second substrate portion has both side portions which are two regions sandwiching the stretched portion from both sides.
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion.
The second substrate portion conductor pattern is formed from the stretched portion to both side portions.
The second substrate portion conductor pattern is arranged at the position on the bent portion side of the external connection electrode and on the second main surface side of the second substrate portion wiring conductor in the support portion. Ori,
The second substrate conductor pattern is not exposed on the second main surface side.
Electronics.