JP2019083240A - Circuit element and electronic equipment - Google Patents

Circuit element and electronic equipment Download PDF

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JP2019083240A
JP2019083240A JP2017209087A JP2017209087A JP2019083240A JP 2019083240 A JP2019083240 A JP 2019083240A JP 2017209087 A JP2017209087 A JP 2017209087A JP 2017209087 A JP2017209087 A JP 2017209087A JP 2019083240 A JP2019083240 A JP 2019083240A
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substrate
bent
circuit element
main surface
substrate portion
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JP6863230B2 (en
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直樹 郷地
Naoki Gochi
直樹 郷地
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

To provide a circuit element hardly generating deformation and breakage of a connection section although having a bent section, and electronic equipment including the circuit element.SOLUTION: A circuit element 3 is constituted of a first substrate section 31 in which a circuit is formed, a second substrate section 32 in which a second substrate section wiring conductor and an external connection electrode are formed, and a bent section 33 which is connected to the first substrate section 31 and the second substrate section 32, and includes a first main surface MS1 and a second main surface MS2 facing each other. The bent section 33 is bent so that the second main surface MS2 side becomes inside. The second substrate section 32 has a second substrate section conductor pattern. The external connection electrode is formed in a support section SP corresponding to an extension section to the second substrate section 32 side in the bent section 33 in plan view. The second substrate section conductor pattern is located closer to the bent section 33 side than the external connection electrode and is arranged closer to the second main surface MS2 side than the second substrate section wiring conductor in the support section SP.SELECTED DRAWING: Figure 1

Description

本発明は、屈曲部を有する基板構造の回路素子と、この回路素子を備える電子機器に関する。   The present invention relates to a circuit element of a substrate structure having a bent portion, and an electronic device provided with the circuit element.

例えば携帯電子機器において、局所的に屈曲部を有し、外部出力端子が形成されたフレキシブルな回路基板が特許文献1に示されている。   For example, in a portable electronic device, Patent Document 1 discloses a flexible circuit board having a bending portion locally and an external output terminal formed.

国際公開第2014/103509号International Publication No. 2014/103509

特許文献1に記載のフレキシブル回路基板は、このフレキシブル回路基板を他の回路基板の所定位置に電気的に接続するために、局所的な屈曲部が設けられている。   The flexible circuit board described in Patent Document 1 is provided with a local bending portion in order to electrically connect the flexible circuit board to a predetermined position of another circuit board.

ところが、このように、局所的な屈曲部を有すると、実装先の回路基板に対するフレキシブル回路基板の接続部(フレキシブル回路の支持部)に応力が集中しやすく、接続部で変形や破損が生じやすい。   However, as described above, when a local bending portion is provided, stress is likely to be concentrated on the connection portion (support portion of the flexible circuit) of the flexible circuit board to the mounting target circuit board, and deformation or breakage is likely to occur in the connection portion. .

そこで、本発明の目的は、屈曲部を有しながらも、接続部の変形や破損が生じ難い回路素子、およびこの回路素子を備える電子機器を提供することにある。   Then, the objective of this invention is providing the electronic device provided with the circuit element which is hard to produce a deformation | transformation and damage of a connection part, although it has a bending part, and this circuit element.

(1)本発明の回路素子は、
回路が形成された第1基板部と、
第2基板部配線導体および外部接続電極が形成された第2基板部と、
前記第2基板部配線導体と前記回路との間を接続する屈曲部配線導体が形成され、前記第1基板部と前記第2基板部とに連続する屈曲部と、
で構成され、互いに対向する第1主面および第2主面を有する回路素子であって、
前記屈曲部は、前記第2主面側が内側になるよう屈曲されており、
前記第2基板部は、当該第2基板部に形成され、前記第1基板部および前記屈曲部には形成されない、第2基板部導体パターンを有し、
前記外部接続電極は、平面視で、前記屈曲部の、前記第2基板部側への延伸部に相当する支持部に形成されていて、
前記第2基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記配線導体よりも前記第2主面側に配置されている、
ことを特徴としている。
(1) The circuit element of the present invention is
A first substrate unit on which a circuit is formed;
A second substrate portion on which a second substrate portion wiring conductor and an external connection electrode are formed;
A bent portion wiring conductor for connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion;
A circuit element having a first main surface and a second main surface facing each other,
The bent portion is bent so that the second main surface side is inside,
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion,
The external connection electrode is formed on a support portion corresponding to an extension portion of the bent portion toward the second substrate portion in plan view,
The second substrate conductor pattern is disposed at a position closer to the bent portion than the external connection electrode in the support portion, and is disposed closer to the second main surface than the wiring conductor.
It is characterized by

上記構成によれば、外部接続電極は、平面視で、屈曲部の、第2基板部側への延伸部に相当する支持部に形成されていて、この支持部において第2基板部導体パターンは外部接続電極よりも屈曲部側の位置にあるので、そして、更に、第2基板部導体パターンは配線導体よりも第2主面側に配置されているので、屈曲部の可撓性が損なわれることなく、外部接続電極付近の変形が抑制されて、接続不良が生じ難い構造となる。また、第2基板部配線導体が第2基板部導体パターンで補強されるので、第2基板部配線導体と屈曲部配線導体との境界部における断線等も抑制される。   According to the above configuration, the external connection electrode is formed in the support portion corresponding to the extension portion of the bent portion toward the second substrate portion in plan view, and the second substrate portion conductor pattern is formed in the support portion Since the second substrate conductor pattern is disposed closer to the second main surface than the wiring conductor because it is at a position closer to the bend than the external connection electrode, the flexibility of the bend is impaired. Therefore, deformation in the vicinity of the external connection electrode is suppressed, and a structure in which connection failure hardly occurs is obtained. Further, since the second substrate wiring conductor is reinforced with the second substrate conductor pattern, disconnection or the like at the boundary between the second substrate wiring conductor and the bent wiring conductor is also suppressed.

(2)前記第1基板部、前記第2基板部および前記屈曲部は、多層基板で構成されていて、前記第2基板部配線導体は前記第2主面よりも前記第1主面に近い層に形成されていることが好ましい。この構造によれば、第2基板部配線導体と外部接続電極との層間距離が短縮化されるので、曲げ応力に対する、第2基板部配線導体と外部接続電極との層間接続部の破損が生じ難くなる。 (2) The first substrate portion, the second substrate portion, and the bent portion are formed of a multilayer substrate, and the second substrate portion wiring conductor is closer to the first main surface than the second main surface. Preferably, it is formed in a layer. According to this structure, the interlayer distance between the second substrate wiring conductor and the external connection electrode is shortened, so that the interlayer connection between the second substrate wiring conductor and the external connection electrode is damaged due to bending stress. It becomes difficult.

(3)前記屈曲部は、前記第2基板部に比べて前記屈曲部配線導体の延伸方向に直交する方向の幅が細いことが好ましい。この構造によれば、屈曲部での屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。 (3) It is preferable that the width of the bent portion in the direction orthogonal to the extending direction of the bent portion wiring conductor is smaller than that of the second substrate portion. According to this structure, the stress generated by the bending at the bent portion becomes small, and the deformation and breakage of the connection portion are unlikely to occur.

(4)前記屈曲部は、前記第1基板部または前記第2基板部の少なくとも一方よりも薄いことが好ましい。この構造によれば、屈曲部の屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。 (4) The bent portion is preferably thinner than at least one of the first substrate portion or the second substrate portion. According to this structure, the stress generated by the bending of the bent portion becomes small, and the deformation and breakage of the connection portion are unlikely to occur.

(5)前記第2基板部は前記屈曲部より厚いことが好ましい。この構造によれば、支持部の剛性が高まり、接続部の変形や破損が生じ難い。 (5) It is preferable that the said 2nd board | substrate part is thicker than the said bending part. According to this structure, the rigidity of the support portion is increased, and the connection portion is less likely to be deformed or damaged.

(6)前記第2基板部の基材は樹脂材料で構成されていて、前記第2基板部に、当該第2基板部の前記基材よりもヤング率の高い補強部材が配置されていることが好ましい。この構造により、支持部の剛性が高まり、接続部の変形や破損が生じ難くなる。 (6) The base material of the second substrate unit is made of a resin material, and a reinforcing member having a higher Young's modulus than the base material of the second substrate unit is disposed in the second substrate unit. Is preferred. By this structure, the rigidity of the support portion is increased, and the deformation and breakage of the connection portion are less likely to occur.

(7)本発明の電子機器は、
実装電極が形成された回路基板と、当該回路基板に接続される回路素子とを備え、
前記回路素子は、
回路が形成された第1基板部と、
第2基板部配線導体および外部接続電極が形成された第2基板部と、
前記第2基板部配線導体と前記外部接続電極との間を接続する屈曲部配線導体が形成され、前記第1基板部と前記第2基板部とに連続する屈曲部と、
で構成され、互いに対向する第1主面および第2主面を有する回路素子であって、
前記屈曲部は、前記第1主面側が内側になるよう屈曲されており、
前記第2基板部は第2基板部導体パターンを有し、
前記外部接続電極は、平面視で、前記屈曲部の、前記第2基板部側への延伸部に相当する支持部に形成されていて、
前記第2基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記配線導体よりも前記第2主面側に配置されている、
ことを特徴としている。
(7) The electronic device of the present invention is
A circuit board on which mounting electrodes are formed, and a circuit element connected to the circuit board;
The circuit element is
A first substrate unit on which a circuit is formed;
A second substrate portion on which a second substrate portion wiring conductor and an external connection electrode are formed;
A bent portion wiring conductor for connecting between the second substrate portion wiring conductor and the external connection electrode is formed, and a bent portion connected to the first substrate portion and the second substrate portion,
A circuit element having a first main surface and a second main surface facing each other,
The bent portion is bent so that the first main surface side is inside,
The second substrate portion has a second substrate portion conductor pattern,
The external connection electrode is formed on a support portion corresponding to an extension portion of the bent portion toward the second substrate portion in plan view,
The second substrate conductor pattern is disposed at a position closer to the bent portion than the external connection electrode in the support portion, and is disposed closer to the second main surface than the wiring conductor.
It is characterized by

上記構成によれば、屈曲部の可撓性が損なわれることなく、支持部における外部接続電極付近の変形が抑制されて、接続不良が生じ難い電子機器が得られる。また、第2基板部配線導体と屈曲部配線導体との境界部における断線等が生じ難い電子機器が得られる。   According to the above configuration, deformation of the support portion near the external connection electrode is suppressed without loss of flexibility of the bent portion, and an electronic device in which connection failure is less likely to occur can be obtained. In addition, an electronic device in which disconnection or the like at the boundary between the second substrate wiring conductor and the bent portion wiring conductor is less likely to occur can be obtained.

本発明によれば、屈曲部の可撓性が損なわれることなく、支持部における外部接続電極付近の変形が抑制されて、接続不良が生じ難く、また、第2基板部配線導体と屈曲部配線導体との境界部における断線等も抑制された回路素子およびそれを備えた電子機器が得られる。   According to the present invention, deformation of the support portion in the vicinity of the external connection electrode is suppressed without loss of flexibility of the bent portion, so that connection failure is unlikely to occur, and the second substrate portion wiring conductor and the bent portion wiring A circuit element and an electronic device provided with the same can be obtained in which a break or the like at a boundary with a conductor is also suppressed.

図1は第1の実施形態に係る回路素子3の斜視図である。FIG. 1 is a perspective view of a circuit element 3 according to the first embodiment. 図2は第1の実施形態の回路素子3を備える電子機器101の縦断面図である。FIG. 2 is a longitudinal sectional view of the electronic device 101 provided with the circuit element 3 of the first embodiment. 図3は第1の実施形態の回路素子3の屈曲前の縦断面図である。FIG. 3 is a longitudinal sectional view of the circuit element 3 of the first embodiment before bending. 図4は第1の実施形態の回路素子3の各基材の積層前の平面図である。FIG. 4: is a top view before lamination | stacking of each base material of the circuit element 3 of 1st Embodiment. 図5は第2の実施形態に係る電子機器102の縦断面図である。FIG. 5 is a longitudinal sectional view of the electronic device 102 according to the second embodiment. 図6は第2の実施形態の回路素子3の屈曲前の縦断面図である。FIG. 6 is a longitudinal cross-sectional view of the circuit element 3 of the second embodiment before bending. 図7は第2の実施形態の回路素子3の各基材の積層前の平面図である。FIG. 7: is a top view before lamination | stacking of each base material of the circuit element 3 of 2nd Embodiment. 図8は第3の実施形態に係る電子機器103の縦断面図である。FIG. 8 is a longitudinal sectional view of the electronic device 103 according to the third embodiment.

以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。要点の説明または理解の容易性を考慮して、便宜上実施形態を分けて示すが、異なる実施形態で示した構成の部分的な置換または組み合わせは可能である。第2の実施形態以降では第1の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。   Hereinafter, some specific examples will be described with reference to the drawings to show a plurality of modes for carrying out the present invention. The same reference numerals are given to the same parts in each drawing. Although the embodiments are shown separately for convenience in consideration of the description of the main points or the ease of understanding, partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, descriptions of matters in common with the first embodiment will be omitted, and only different points will be described. In particular, the same operation and effect by the same configuration will not be sequentially referred to in each embodiment.

《第1の実施形態》
図1は第1の実施形態に係る回路素子3の斜視図である。図2は回路素子3を備える電子機器の縦断面図である。この電子機器101は、第1部材1と、第2部材2と、第2部材2に接続されて第1部材1に対して所定の位置関係に配置された回路素子3と、を備える。
First Embodiment
FIG. 1 is a perspective view of a circuit element 3 according to the first embodiment. FIG. 2 is a longitudinal sectional view of an electronic device provided with the circuit element 3. The electronic device 101 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1.

回路素子3は、第1基板部31と、第2基板部32と、屈曲部33と、で構成される。   The circuit element 3 is configured of a first substrate unit 31, a second substrate unit 32, and a bending portion 33.

第1基板部31には回路導体31Cによる回路が形成されている。第2基板部32には、第2基板部導体パターン32C、第2基板部配線導体32Wおよび外部接続電極32Eが形成されている。屈曲部33は第1基板部31と第2基板部32とに連続する。この屈曲部33には、第2基板部配線導体32Wと回路導体31Cとの間を接続する屈曲部配線導体33Wが形成されている。   The first substrate portion 31 is formed with a circuit of the circuit conductor 31C. On the second substrate portion 32, a second substrate portion conductor pattern 32C, a second substrate portion wiring conductor 32W, and an external connection electrode 32E are formed. The bent portion 33 is continuous with the first substrate portion 31 and the second substrate portion 32. In the bent portion 33, a bent portion wiring conductor 33W for connecting the second substrate portion wiring conductor 32W and the circuit conductor 31C is formed.

回路素子3は、互いに対向する第1主面MS1および第2主面MS2を有する。屈曲部33は、第1主面MS1側が内側になるよう屈曲されている。   The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The bending portion 33 is bent so that the first main surface MS1 side is inside.

第1基板部31には、回路導体31C等による回路が形成されている。屈曲部33には、第1基板部31と第2基板部32との間を接続する屈曲部配線導体33Wが形成されている。   The first substrate portion 31 is formed with a circuit including the circuit conductor 31C and the like. In the bent portion 33, a bent portion wiring conductor 33W for connecting the first substrate portion 31 and the second substrate portion 32 is formed.

図1に示すように、第2基板部32には、屈曲部33を支持する支持部SPを備える。この支持部SPは、平面視で(Z軸方向に視て)、屈曲部33の、第2基板部32側への延伸部に相当する部分である。外部接続電極32Eは支持部SPに形成されている。   As shown in FIG. 1, the second substrate unit 32 includes a support portion SP that supports the bending portion 33. The support portion SP is a portion corresponding to an extension portion of the bending portion 33 toward the second substrate portion 32 in plan view (viewed in the Z-axis direction). The external connection electrode 32E is formed on the support portion SP.

第2基板部導体パターン32Cは、支持部SPにおいて、外部接続電極32Eよりも屈曲部33側の位置にあって、且つ第2基板部配線導体32Wよりも第2主面MS2側に配置されている。この構造により、第2基板部32の第2基板部導体パターン32C周囲の領域は補強領域RAとして作用する。つまり、補強領域RAは剛性が高いので、補強領域RAから外部接続電極32Eまでの間は変形しにくくなる。そのため、屈曲部33の屈曲による応力が外部接続電極32Eに掛かりにくくなる。   The second substrate conductor pattern 32C is located closer to the bent portion 33 than the external connection electrode 32E in the support portion SP, and is disposed closer to the second main surface MS2 than the second substrate wiring conductor 32W. There is. By this structure, a region around the second substrate portion conductor pattern 32C of the second substrate portion 32 acts as a reinforcing region RA. That is, since the reinforcement area RA has high rigidity, it is difficult to deform from the reinforcement area RA to the external connection electrode 32E. Therefore, stress due to bending of the bending portion 33 is less likely to be applied to the external connection electrode 32E.

本実施形態では、第1部材1は永久磁石であり、第2部材2は回路基板である。第1基板部31の回路導体31Cは電磁石として作用する。この回路導体31Cによる電磁石と第1部材(永久磁石)1との相互作用により、両者間に電磁力が働く。この例では、第1基板部31は固定されているので、上記電磁力により第1部材(永久磁石)1が図中の矢印方向(X軸方向)に移動する。   In the present embodiment, the first member 1 is a permanent magnet, and the second member 2 is a circuit board. The circuit conductor 31C of the first substrate unit 31 acts as an electromagnet. The interaction between the electromagnet by the circuit conductor 31C and the first member (permanent magnet) 1 causes an electromagnetic force to act between the two. In this example, since the first substrate portion 31 is fixed, the first member (permanent magnet) 1 is moved in the arrow direction (X-axis direction) in the figure by the electromagnetic force.

回路素子3の第2基板部32の第1主面MS1には外部接続電極32Eが形成されている。第2部材2は、回路素子3の外部接続電極32Eが接続される実装電極2Eを備えている。回路素子3の第2基板部32の外部接続電極32Eは、はんだ等の接合材を介して、第2部材2の実装電極2Eに接合されている。   An external connection electrode 32 </ b> E is formed on the first main surface MS <b> 1 of the second substrate unit 32 of the circuit element 3. The second member 2 includes a mounting electrode 2E to which the external connection electrode 32E of the circuit element 3 is connected. The external connection electrode 32E of the second substrate portion 32 of the circuit element 3 is bonded to the mounting electrode 2E of the second member 2 via a bonding material such as solder.

屈曲部配線導体33Wは、第2主面MS2よりも第1主面MS1寄りの層に形成されている。   The bent portion wiring conductor 33W is formed in a layer closer to the first main surface MS1 than the second main surface MS2.

回路素子3の屈曲部33は屈曲部32BSを有する。この屈曲部32BSは、第2主面MS2側が曲げの内側になり、且つ第1主面MS1が第2主面MS2より第1部材1から遠ざかるように曲げられた部分である。   The bent portion 33 of the circuit element 3 has a bent portion 32BS. The bent portion 32BS is a portion in which the second main surface MS2 side is bent inward and the first main surface MS1 is bent away from the first member 1 from the second main surface MS2.

図3は上記回路素子3の、屈曲前の縦断面図である。この回路素子3は、例えば液晶ポリマー(LCP)やポリエーテルエーテルケトン(PEEK)を主材料とする熱可塑性樹脂基材を積層形成した多層基板である。回路導体31C、屈曲部配線導体33W、第2基板部配線導体32W、外部接続電極32Eのうち、基材の層方向に延びる導体パターンは銅箔をパターン化したものである。異なる層に形成された導体パターン同士は、層間接続導体で接続されている。この層間接続導体は、例えば、上記基材にレーザー等で孔を形成した後、Cu,Snまたはこれらの合金等の導電性粒子を含む導電性ペーストを配設し、後の加熱プレス処理で硬化させることによって設けられる。   FIG. 3 is a longitudinal sectional view of the circuit element 3 before bending. The circuit element 3 is, for example, a multilayer substrate formed by laminating a thermoplastic resin base material having a liquid crystal polymer (LCP) or a polyetheretherketone (PEEK) as a main material. Of the circuit conductor 31C, the bent portion wiring conductor 33W, the second substrate portion wiring conductor 32W, and the external connection electrode 32E, the conductor pattern extending in the layer direction of the base material is formed by patterning a copper foil. Conductor patterns formed in different layers are connected by interlayer connection conductors. For example, after forming a hole in the above-mentioned base material with a laser or the like, this interlayer connection conductor is provided with a conductive paste containing conductive particles such as Cu, Sn, or an alloy thereof, and cured by a later heat pressing process It is provided by

図4は、回路素子3の各基材の積層前の平面図である。なお、図4では、説明の都合上一つの個片に切り出した状態での平面図である。実際の多層基板の製造工程は集合基板状態で行われる。   FIG. 4 is a plan view of the substrates of the circuit element 3 before lamination. In addition, in FIG. 4, it is a top view in the state cut out to one piece for convenience of explanation. The actual manufacturing process of the multilayer substrate is performed in the collective substrate state.

図4において、基材S2,S3に回路導体31Cが形成されていて、基材S3に屈曲部配線導体33Wおよび第2基板部配線導体32Wが形成されている。また、基材S2に第2基板部導体パターン32Cが形成されている。さらに、基材S4に外部接続電極32Eが形成されている。図4中の破線の丸は層間接続導体を表している。基材S1には導体パターンは形成されていない。回路導体31Cは約2ターンのコイルを形成している。   In FIG. 4, the circuit conductor 31C is formed on the substrates S2 and S3, and the bent portion wiring conductor 33W and the second substrate portion wiring conductor 32W are formed on the substrate S3. Further, the second substrate portion conductor pattern 32C is formed on the base material S2. Furthermore, the external connection electrode 32E is formed on the base material S4. The dashed circle in FIG. 4 represents an interlayer connection conductor. The conductor pattern is not formed on the substrate S1. The circuit conductor 31C forms a coil of about 2 turns.

屈曲部33は、屈曲部配線導体33Wの延伸方向(X軸方向)に直交する方向(Y軸方向)の幅(図4中の“W”)が第1基板部31および第2基板部32の幅より細い。   The bent portion 33 has a width ("W" in FIG. 4) in a direction (Y-axis direction) orthogonal to the extending direction (X-axis direction) of the bent portion wiring conductor 33W. The first substrate portion 31 and the second substrate portion 32 It is thinner than the width of.

このように、支持部SPは、平面視で(Z軸方向に視て)、屈曲部33の、第2基板部32側への延伸部に相当する部分であり、この支持部SP内に外部接続電極32Eが形成されている。   As described above, the support portion SP is a portion corresponding to an extension portion of the bending portion 33 toward the second substrate portion 32 in a plan view (viewed in the Z-axis direction), and is externally provided in the support portion SP. The connection electrode 32E is formed.

この回路素子3を第2部材2に実装する際、図2に示したように、第2基板部32の外部接続電極32Eを第2部材2の実装電極2Eに接続し、回路素子3の屈曲部33の所定箇所をY軸に平行な軸の回りに沿って、断面L字状に屈曲させ、第1基板部31を第1部材1に対面するように起立させる。   When the circuit element 3 is mounted on the second member 2, as shown in FIG. 2, the external connection electrode 32E of the second substrate portion 32 is connected to the mounting electrode 2E of the second member 2, and the circuit element 3 is bent. A predetermined portion of the portion 33 is bent in an L-shaped cross section along an axis parallel to the Y-axis, and the first substrate portion 31 is erected so as to face the first member 1.

本実施形態によれば、次のような作用効果を奏する。   According to the present embodiment, the following effects can be obtained.

(a)屈曲部33の可撓性が損なわれることなく、外部接続電極32E付近の変形が抑制されて、接続不良が生じ難い構造となる。また、第2基板部配線導体32Wが第2基板部導体パターン32Cで補強されるので、第2基板部配線導体32Wと屈曲部配線導体33Wとの境界部における断線等も抑制される。 (A) The deformation of the vicinity of the external connection electrode 32E is suppressed without losing the flexibility of the bent portion 33, and a structure in which a connection failure does not easily occur is obtained. Further, since the second substrate portion wiring conductor 32W is reinforced by the second substrate portion conductor pattern 32C, disconnection or the like at the boundary between the second substrate portion wiring conductor 32W and the bending portion wiring conductor 33W is also suppressed.

(b)第2基板部32の変形に伴う第2基板部32と第1部材1との不要な結合に伴う特性変化を抑制できる。 (B) It is possible to suppress a change in characteristics due to unnecessary coupling between the second substrate portion 32 and the first member 1 due to the deformation of the second substrate portion 32.

(c)第2基板部配線導体32Wは第2主面MS2よりも第1主面MS1に近い層に形成されているので、第2基板部配線導体32Wと外部接続電極32Eとの層間距離が短縮化され、曲げ応力に対する、第2基板部配線導体32Wと外部接続電極32Eとの層間接続部の破損が生じ難くなる。 (C) Since the second substrate wiring conductor 32W is formed in a layer closer to the first main surface MS1 than the second main surface MS2, the interlayer distance between the second substrate wiring conductor 32W and the external connection electrode 32E is As a result, the interlayer connection between the second substrate wiring conductor 32W and the external connection electrode 32E is less likely to be damaged due to bending stress.

(d)屈曲部33は、屈曲部配線導体33Wの延伸方向に直交する方向の幅Wが第2基板部32より細いので、屈曲部33での屈曲により発生する応力が小さくなって、接続部の変形や破損が生じ難い。 (D) Since the width W of the bent portion 33 in the direction orthogonal to the extending direction of the bent portion wiring conductor 33W is smaller than that of the second substrate portion 32, the stress generated by bending in the bent portion 33 becomes smaller, and the connection portion It is difficult to cause deformation or breakage of

(e)第1基板部31、第2基板部32、および屈曲部33は、複数の基材層が積層されてなる単一の多層基板で構成されたものであるので、第1基板部31、第2基板部32、および屈曲部33は一体物として容易に製造できる。 (E) The first substrate portion 31, the second substrate portion 32, and the bending portion 33 are formed of a single multilayer substrate formed by laminating a plurality of base material layers. The second substrate portion 32 and the bending portion 33 can be easily manufactured as one body.

(f)第1基板部31と屈曲部33との境界、第2基板部32と屈曲部33との境界がいずれも連続した構造体となるので、曲げ応力による破損が抑制される。 (F) Since the boundary between the first substrate portion 31 and the bending portion 33 and the boundary between the second substrate portion 32 and the bending portion 33 form a continuous structure, damage due to bending stress is suppressed.

《第2の実施形態》
第2の実施形態では、第1の実施形態とは形状が異なる回路素子3および、それを備えた電子機器の例を示す。
Second Embodiment
In the second embodiment, an example of a circuit element 3 having a shape different from that of the first embodiment and an electronic device provided with the circuit element 3 is shown.

図5は第2の実施形態に係る電子機器102の縦断面図である。図6は、上記回路素子3の、屈曲前の縦断面図である。この電子機器102は、第1部材1と、第2部材2と、第2部材2に接続されて第1部材1に対して所定の位置関係に配置された回路素子3と、を備える。   FIG. 5 is a longitudinal sectional view of the electronic device 102 according to the second embodiment. FIG. 6 is a longitudinal cross-sectional view of the circuit element 3 before bending. The electronic device 102 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1.

回路素子3は、互いに対向する第1主面MS1および第2主面MS2を有する。回路素子3は、第1基板部31と、第2部材2に電気的に接続される第2基板部32と、第1基板部31と第2基板部32とに連続する屈曲部33と、で構成されている。   The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The circuit element 3 includes a first substrate portion 31, a second substrate portion 32 electrically connected to the second member 2, a bent portion 33 continuous to the first substrate portion 31 and the second substrate portion 32, and It consists of

図7は、回路素子3の各基材の積層前の平面図である。図7において、基材S1,S2,S3に回路導体31Cが形成されていて、基材S3に屈曲部配線導体33Wおよび第2基板部配線導体32Wが形成されている。また、基材S2に第2基板部導体パターン32Cが形成されている。さらに、基材S4に外部接続電極32Eが形成されている。図7中の破線の丸は層間接続導体を表している。回路導体31Cは約3ターンのコイルを形成している。   FIG. 7 is a plan view of the substrates of the circuit element 3 before lamination. In FIG. 7, the circuit conductor 31C is formed on the base materials S1, S2 and S3, and the bent portion wiring conductor 33W and the second substrate portion wiring conductor 32W are formed on the base material S3. Further, the second substrate portion conductor pattern 32C is formed on the base material S2. Furthermore, the external connection electrode 32E is formed on the base material S4. The broken-line circles in FIG. 7 represent interlayer connection conductors. The circuit conductor 31C forms a coil of about 3 turns.

回路素子3の基本的な構成は第1の実施形態で示したものと同じであるが、本実施形態では、屈曲部33は、第1基板部31および第2基板部32よりも薄い。この構造によれば、屈曲部33での屈曲により発生する応力が小さくなって、第2基板部32の変形や破損が生じ難い。   The basic configuration of the circuit element 3 is the same as that shown in the first embodiment, but in the present embodiment, the bending portion 33 is thinner than the first substrate portion 31 and the second substrate portion 32. According to this structure, the stress generated by the bending in the bending portion 33 is reduced, and the deformation or breakage of the second substrate portion 32 does not easily occur.

また、第2基板部32は屈曲部33より厚い。この構造によれば、支持部(図1中の支持部SP参照)の剛性が高まり、接続部の変形や破損が生じ難い。   In addition, the second substrate portion 32 is thicker than the bent portion 33. According to this structure, the rigidity of the support portion (see the support portion SP in FIG. 1) is enhanced, and deformation and breakage of the connection portion are less likely to occur.

《第3の実施形態》
第3の実施形態では、回路素子の第2基板部の構造が第2の実施形態とは異なる例を示す。
Third Embodiment
The third embodiment shows an example in which the structure of the second substrate portion of the circuit element is different from that of the second embodiment.

図8は第3の実施形態に係る電子機器103の縦断面図である。この電子機器103は、第1部材1と、第2部材2と、第2部材2に接続されて第1部材1に対して所定の位置関係に配置された回路素子3と、を備える。第1部材1、第2部材2の構成は第1・第2の実施形態で示したものと同じである。   FIG. 8 is a longitudinal sectional view of the electronic device 103 according to the third embodiment. The electronic device 103 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1. The configurations of the first member 1 and the second member 2 are the same as those shown in the first and second embodiments.

図8に表れているように、回路素子3の第2基板部32の外部接続電極32Eの形成面に、はんだレジスト膜等のレジスト膜32Lが形成されている。   As shown in FIG. 8, a resist film 32L such as a solder resist film is formed on the surface of the second substrate portion 32 of the circuit element 3 on which the external connection electrode 32E is formed.

本実施形態によれば、第2基板部32の基材が樹脂材料で構成されていて、第2基板部32に、当該第2基板部32の基材よりもヤング率の高い補強部材が配置された構造となる。この構造により、第2基板部32および支持部(図1に示す支持部SP)の剛性が高まり、接続部の変形や破損が生じ難くなる。   According to the present embodiment, the base material of the second substrate unit 32 is made of a resin material, and the reinforcing member having a higher Young's modulus than the base material of the second substrate unit 32 is disposed on the second substrate unit 32. Structure. By this structure, the rigidity of the second substrate portion 32 and the support portion (the support portion SP shown in FIG. 1) is enhanced, and the deformation and breakage of the connection portion are less likely to occur.

レジスト膜32Lは例えばエポキシ樹脂である。エポキシ樹脂のヤング率は2.4GPaであり、液晶ポリマー(LCP)のヤング率1GPaより高い。   The resist film 32L is, for example, an epoxy resin. The Young's modulus of the epoxy resin is 2.4 GPa, which is higher than the Young's modulus 1 GPa of the liquid crystal polymer (LCP).

上記レジスト膜32Lの代わりに、例えばポリイミド(PI)製のカバーフィルムを貼付してもよい。ポリイミドのヤング率は5GPaであり、液晶ポリマー(LCP)のヤング率1GPaより高い。   Instead of the resist film 32L, for example, a cover film made of polyimide (PI) may be attached. The Young's modulus of the polyimide is 5 GPa, which is higher than the Young's modulus 1 GPa of the liquid crystal polymer (LCP).

また、上記レジスト膜32Lや上記カバーフィルムは、第2基板部32の外部接続電極32Eの形成面とは反対面に形成してもよい。   Further, the resist film 32L and the cover film may be formed on the surface of the second substrate portion 32 opposite to the surface on which the external connection electrode 32E is formed.

《他の実施形態》
図2、図5、図8等では、回路素子3の屈曲部33の略全体が屈曲部である例を示したが、屈曲部33の一部に比較的小さな曲率半径の屈曲部を形成してもよい。
Other Embodiments
Although FIG. 2, FIG. 5, FIG. 8, etc. show an example in which substantially the entire bent portion 33 of the circuit element 3 is a bent portion, a bent portion with a relatively small radius of curvature is formed in a part of the bent portion 33. May be

また、図1、図2等に示した例では、回路素子3は、屈曲前の状態でX−Y面にあって、それをY軸に平行な軸の回りにのみ屈曲させる例を示したが、複数の屈曲部があってもよい。それらの屈曲部のうち、一つは上記Y軸に平行な軸の回りとは別の軸回りに屈曲させる屈曲部であってもよい。   Moreover, in the example shown in FIG. 1, FIG. 2, etc., the circuit element 3 is in the XY plane before bending, and shows an example of bending it only around an axis parallel to the Y axis. However, there may be a plurality of bends. Among the bent portions, one may be a bent portion which is bent around an axis different from the axis parallel to the Y axis.

最後に、上述の実施形態の説明は、すべての点で例示であって、制限的なものではない。当業者にとって変形および変更が適宜可能である。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変更が含まれる。   Finally, the description of the above embodiments is illustrative in all respects and not restrictive. Modifications and variations are possible as appropriate to those skilled in the art. The scope of the present invention is indicated not by the embodiments described above but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope of the claims and equivalents.

MS1…第1主面
MS2…第2主面
S1〜S4…基材
SP…支持部
1…第1部材
2…第2部材
2E…実装電極
3…回路素子
31…第1基板部
31C…回路導体
32…第2基板部
32BS…屈曲部
32C…第2基板部導体パターン
32E…外部接続電極
32L…レジスト膜
32W…第2基板部配線導体
33…屈曲部
33W…屈曲部配線導体
101〜103…電子機器
MS1 First main surface MS2 Second main surface S1 to S4 Base material SP Support portion 1 First member 2 Second member 2E Mounting electrode 3 Circuit element 31 First substrate portion 31C Circuit conductor 32: second substrate portion 32BS: bent portion 32C: second substrate portion conductor pattern 32E: external connection electrode 32L: resist film 32W: second substrate portion wiring conductor 33: bent portion 33W: bent portion wiring conductor 101 to 103: electron machine

Claims (7)

回路が形成された第1基板部と、
第2基板部配線導体および外部接続電極が形成された第2基板部と、
前記第2基板部配線導体と前記回路との間を接続する屈曲部配線導体が形成され、前記第1基板部と前記第2基板部とに連続する屈曲部と、
で構成され、互いに対向する第1主面および第2主面を有する回路素子であって、
前記屈曲部は、前記第2主面側が内側になるよう屈曲されており、
前記第2基板部は、当該第2基板部に形成され、前記第1基板部および前記屈曲部には形成されない、第2基板部導体パターンを有し、
前記外部接続電極は、平面視で、前記屈曲部の、前記第2基板部側への延伸部に相当する支持部に形成されていて、
前記第2基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記第2基板部配線導体よりも前記第2主面側に配置されている、
回路素子。
A first substrate unit on which a circuit is formed;
A second substrate portion on which a second substrate portion wiring conductor and an external connection electrode are formed;
A bent portion wiring conductor for connecting the second substrate portion wiring conductor and the circuit is formed, and a bent portion continuous with the first substrate portion and the second substrate portion;
A circuit element having a first main surface and a second main surface facing each other,
The bent portion is bent so that the second main surface side is inside,
The second substrate portion has a second substrate portion conductor pattern formed on the second substrate portion and not formed on the first substrate portion and the bent portion,
The external connection electrode is formed on a support portion corresponding to an extension portion of the bent portion toward the second substrate portion in plan view,
The second substrate conductor pattern is disposed at a position closer to the bent portion than the external connection electrode in the support portion and is disposed closer to the second main surface than the second substrate wiring conductor. Yes,
Circuit element.
前記第1基板部、前記第2基板部および前記屈曲部は、多層基板で構成されていて、
前記第2基板部配線導体は前記第2主面よりも前記第1主面に近い層に形成されている、
請求項1に記載の回路素子。
The first substrate portion, the second substrate portion, and the bent portion are formed of a multilayer substrate, and
The second substrate wiring conductor is formed in a layer closer to the first main surface than the second main surface.
The circuit element according to claim 1.
前記屈曲部は、前記第2基板部に比べて前記屈曲部配線導体の延伸方向に直交する方向の幅が細い、
請求項1または2に記載の回路素子。
The bent portion has a narrower width in a direction orthogonal to the extending direction of the bent portion wiring conductor than the second substrate portion.
The circuit element according to claim 1 or 2.
前記屈曲部は、前記第1基板部または前記第2基板部の少なくとも一方よりも薄い、
請求項1から3のいずれかに記載の回路素子。
The bent portion is thinner than at least one of the first substrate portion or the second substrate portion.
The circuit element according to any one of claims 1 to 3.
前記第2基板部は前記屈曲部より厚い、
請求項4に記載の回路素子。
The second substrate portion is thicker than the bending portion.
The circuit element according to claim 4.
前記第2基板部の基材は樹脂材料で構成されていて、前記第2基板部に、当該第2基板部の前記基材よりもヤング率の高い補強部材が配置されている、
請求項1から5のいずれかに記載の回路素子。
The base material of the second substrate unit is made of a resin material, and a reinforcing member having a higher Young's modulus than the base material of the second substrate unit is disposed in the second substrate unit.
The circuit element according to any one of claims 1 to 5.
実装電極が形成された回路基板と、当該回路基板に接続される回路素子とを備える電子機器であって、
前記回路素子は、
回路が形成された第1基板部と、
第2基板部配線導体および外部接続電極が形成された第2基板部と、
前記第2基板部配線導体と前記外部接続電極との間を接続する屈曲部配線導体が形成され、前記第1基板部と前記第2基板部とに連続する屈曲部と、
で構成され、互いに対向する第1主面および第2主面を有する回路素子であって、
前記屈曲部は、前記第1主面側が内側になるよう屈曲されており、
前記第2基板部は第2基板部導体パターンを有し、
前記外部接続電極は、平面視で、前記屈曲部の、前記第2基板部側への延伸部に相当する支持部に形成されていて、
前記第2基板部導体パターンは、前記支持部において、前記外部接続電極よりも前記屈曲部側の位置にあって、且つ前記第2基板部配線導体よりも前記第2主面側に配置されている、
電子機器。
An electronic apparatus comprising: a circuit board on which a mounting electrode is formed; and a circuit element connected to the circuit board,
The circuit element is
A first substrate unit on which a circuit is formed;
A second substrate portion on which a second substrate portion wiring conductor and an external connection electrode are formed;
A bent portion wiring conductor for connecting between the second substrate portion wiring conductor and the external connection electrode is formed, and a bent portion connected to the first substrate portion and the second substrate portion,
A circuit element having a first main surface and a second main surface facing each other,
The bent portion is bent so that the first main surface side is inside,
The second substrate portion has a second substrate portion conductor pattern,
The external connection electrode is formed on a support portion corresponding to an extension portion of the bent portion toward the second substrate portion in plan view,
The second substrate conductor pattern is disposed at a position closer to the bent portion than the external connection electrode in the support portion and is disposed closer to the second main surface than the second substrate wiring conductor. Yes,
Electronics.
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JPH0249157U (en) * 1988-09-30 1990-04-05
JP2006019336A (en) * 2004-06-30 2006-01-19 Alps Electric Co Ltd Flexible wiring board
JP2013016654A (en) * 2011-07-04 2013-01-24 Sumitomo Electric Ind Ltd Flexible printed wiring board
WO2014103772A1 (en) * 2012-12-29 2014-07-03 株式会社村田製作所 Circuit board
WO2014129278A1 (en) * 2013-02-19 2014-08-28 株式会社村田製作所 Inductor bridge and electronic device

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Publication number Priority date Publication date Assignee Title
JPH0249157U (en) * 1988-09-30 1990-04-05
JP2006019336A (en) * 2004-06-30 2006-01-19 Alps Electric Co Ltd Flexible wiring board
JP2013016654A (en) * 2011-07-04 2013-01-24 Sumitomo Electric Ind Ltd Flexible printed wiring board
WO2014103772A1 (en) * 2012-12-29 2014-07-03 株式会社村田製作所 Circuit board
WO2014129278A1 (en) * 2013-02-19 2014-08-28 株式会社村田製作所 Inductor bridge and electronic device

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