JP2006019336A - Flexible wiring board - Google Patents

Flexible wiring board Download PDF

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JP2006019336A
JP2006019336A JP2004192995A JP2004192995A JP2006019336A JP 2006019336 A JP2006019336 A JP 2006019336A JP 2004192995 A JP2004192995 A JP 2004192995A JP 2004192995 A JP2004192995 A JP 2004192995A JP 2006019336 A JP2006019336 A JP 2006019336A
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pattern
flexible
connection
wiring
connection pattern
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JP4336628B2 (en
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Satoru Takemori
悟 竹森
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible wiring board which can be increased in mounting density by fine patterning of a wiring pattern and has a connection pattern having an excellent bending property. <P>SOLUTION: The flexible wiring board 1 contains a plurality of wiring patterns 3a formed on one insulation film 2 having a flexibility, and the connection pattern 7a connected to the wiring patterns 3a. Part of the insulation film 2 where the wiring patterns 3a are formed is reinforced by a reinforcing plate to become a ridge 3, while part of the insulation film 2 where the connection pattern 7a is formed becomes a flexible portion 7 having a flexibility. The connection pattern 7a formed in the flexible portion 7 is formed by using a conductive paste having a flexibility and is connected to the wiring patterns 3a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はフレキシブル配線基板に係わり、特にチップ部品等の電気部品を面実装している部分の配線パターンに接続される接続パターンを柔軟性のある材料で形成したフレキシブル配線基板に関する。   The present invention relates to a flexible wiring board, and more particularly to a flexible wiring board in which a connection pattern to be connected to a wiring pattern of a surface-mounted part such as a chip part is formed of a flexible material.

従来のフレキシブル配線基板を、特許文献１に基づいて説明すると、従来のフレキシブル配線基板は、図４に示すように、絶縁フィルム２１上に、第１配線パターン２２がスクリーン印刷等で形成され、この第１配線パターン２２上に選択的に第１カバーコート絶縁層２３が形成されている。
また、第１配線パターン２２上でチップ部品（図示せず）を搭載した部分には、バルクメタル層２４が形成され、このバルクメタル層２４を除く部分に第２カバーコート絶縁層２５が形成され、第１配線パターン２２およびバルクメタル層２４上には、第２配線パターン２６が形成されている。 The conventional flexible wiring board will be described based on Patent Document 1. As shown in FIG. 4, the conventional flexible wiring board has a first wiring pattern 22 formed on the insulating film 21 by screen printing or the like. A first cover coat insulating layer 23 is selectively formed on the first wiring pattern 22.
Further, a bulk metal layer 24 is formed on the portion where the chip component (not shown) is mounted on the first wiring pattern 22, and a second cover coat insulating layer 25 is formed on the portion excluding the bulk metal layer 24. A second wiring pattern 26 is formed on the first wiring pattern 22 and the bulk metal layer 24.

更に、第２配線パターン２６上には、第３カバーコート絶縁層２７が形成され、前記第２配線パターン２６が形成された部分の絶縁フィルム２１の裏面には補強板２８が接着されている。
そして、補強板２８上の絶縁フィルム２１には、複数のチップ部品（図示せず）が面実装されて第１配線パターン２２および第２配線パターン２６に接続されている。
このような従来のフレキシブル配線基板は、第１配線パターン２２の折り曲げ性を必要とする部分（Ｂ部）に可撓性の第１カバーコート絶縁層２３を形成すると共に、第１配線パターン２２上にメッキにより形成されたバルクメタル層２４と、少なくとも半田付けランド・接続部を除く部分に可撓性を有する第２カバーコート絶縁層２５を設けたので、Ｂ部で絶縁フィルム２１を湾曲させることができる。
特開平０６−１２０６４３号公報 Further, a third cover coat insulating layer 27 is formed on the second wiring pattern 26, and a reinforcing plate 28 is bonded to the back surface of the insulating film 21 where the second wiring pattern 26 is formed.
A plurality of chip parts (not shown) are surface-mounted on the insulating film 21 on the reinforcing plate 28 and connected to the first wiring pattern 22 and the second wiring pattern 26.
In such a conventional flexible wiring board, a flexible first cover coat insulating layer 23 is formed on a portion (B part) of the first wiring pattern 22 that requires bendability, and on the first wiring pattern 22. Since the bulk metal layer 24 formed by plating and the second cover coat insulating layer 25 having flexibility at least on the portion excluding the soldering land / connection portion are provided, the insulating film 21 is curved at the B portion. Can do.
Japanese Patent Laid-Open No. 06-120643

しかし、従来のフレキシブル配線基板は、補強板２８上およびそれ以外の部分に形成した第１配線パターン２２が、すべて同じ材料で形成していたので、折り曲げ部であるＢ部の折り曲げ性を優先して、第１配線パターン２２を柔軟性のある導電ペーストで形成すると、スクリーン印刷時に、第１配線パターン２２ににじみ等が発生する。
そのために、チップ部品等を面実装する部分の第１配線パターン２２をファインパターン化して実装密度を高めようとした場合に、隣り合う第１配線パターン２２同士が短絡するおそれがあった。また、柔軟性のある導電ペーストを用いると、第１配線パターン２２の抵抗値が高くなり、ファイパターン化し難かった。 However, in the conventional flexible wiring board, since the first wiring pattern 22 formed on the reinforcing plate 28 and other portions are all made of the same material, the bending property of the B portion which is the bending portion is given priority. If the first wiring pattern 22 is formed of a flexible conductive paste, bleeding or the like occurs in the first wiring pattern 22 during screen printing.
For this reason, when trying to increase the mounting density by making the first wiring pattern 22 on the surface mounting portion of the chip component or the like into a fine pattern, the adjacent first wiring patterns 22 may be short-circuited. In addition, when a flexible conductive paste is used, the resistance value of the first wiring pattern 22 becomes high and it is difficult to form a phi pattern.

逆に、第１配線パターン２２のにじみを無くするために、硬い導電ペーストを用いて第１配線パターン２２をファインパターン化した場合は、第１配線パターン２２が硬くなって折り曲げ性が悪くなり、第１配線パターン２２が折り曲げ部であるＢ部で断線するおそれがあった。
本発明は前述したような課題を解決して、配線パターンをファインパターン化して実装密度を高めることができると共に、折り曲げ性に優れた接続パターンを有するフレキシブル配線基板を提供することを目的とする。 Conversely, when the first wiring pattern 22 is made into a fine pattern using a hard conductive paste in order to eliminate the bleeding of the first wiring pattern 22, the first wiring pattern 22 becomes hard and the bendability deteriorates. There is a possibility that the first wiring pattern 22 may be disconnected at a portion B which is a bent portion.
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems and to provide a flexible wiring board having a connection pattern that is capable of increasing the mounting density by making the wiring pattern fine and increasing the mounting density.

前記課題を解決するための第１の手段として本発明のフレキシブル配線基板は、可撓性を有する１枚の絶縁フィルム上に形成した複数の配線パターンと、この配線パターンに接続される接続パターンとを備え、前記配線パターンを形成した部分の前記絶縁フィルムは、補強板で補強されてリジッド部となり、前記接続パターンを形成した部分の前記絶縁フィルムは、可撓性のあるフレキ部となり、このフレキ部に形成した前記接続パターンは、柔軟性のある導電ペーストを用いて形成して前記配線パターンに接続したことを特徴とする。   As a first means for solving the above problems, a flexible wiring board of the present invention includes a plurality of wiring patterns formed on a flexible insulating film, and a connection pattern connected to the wiring pattern. The insulating film in the portion where the wiring pattern is formed is reinforced by a reinforcing plate to become a rigid portion, and the insulating film in the portion where the connection pattern is formed becomes a flexible portion. The connection pattern formed on the portion is formed using a flexible conductive paste and connected to the wiring pattern.

また、前記課題を解決するための第２の手段として、前記接続パターンに用いている前記導電ペーストは、ポリエステル樹脂からなるバインダを用いていることを特徴とする請求項１記載のフレキシブル配線基板。   2. The flexible wiring board according to claim 1, wherein the conductive paste used in the connection pattern uses a binder made of a polyester resin as a second means for solving the problem.

また、前記課題を解決するための第３の手段として、前記配線パターンは、前記接続パターンと接続する接続部の幅寸法が前記接続パターンと同等あるいは幅狭に形成され、前記配線パターンの接続部上に前記接続パターンを重ね合わせて印刷形成したことを特徴とする。   Further, as a third means for solving the above problem, the wiring pattern is formed so that a width dimension of a connection portion connected to the connection pattern is equal to or narrower than the connection pattern, and the connection portion of the wiring pattern It is characterized in that the connection pattern is superimposed on the top and printed.

また、前記課題を解決するための第４の手段として、前記フレキ部の端部を補強板で補強し、この部分に前記接続パターンを延長させてリード部を形成したことを特徴とする。   Further, as a fourth means for solving the above-mentioned problem, the end portion of the flexible portion is reinforced with a reinforcing plate, and the lead pattern is formed by extending the connection pattern in this portion.

本発明に係わるフレキ部に形成した前記接続パターンは、柔軟性のある導電ペーストを用いて印刷形成して配線パターンに接続したので、フレキ部が折れ曲がったとしても、このフレキ部に追従して接続パターンが折れ曲がることができる。そのために、断線等の障害が発生することのないフレキシブル配線基板を提供できる。
また、配線パターンを形成した部分の絶縁フィルムを補強板で補強することにより、配線パターンを硬質の導電ペーストで形成することができ、配線パターンをファインパターン化できる。そのために、チップ部品等の電気部品を高密度で表面実装することができる。 Since the connection pattern formed on the flexible portion according to the present invention is printed using a flexible conductive paste and connected to the wiring pattern, even if the flexible portion is bent, the connection pattern follows the flexible portion. The pattern can be bent. Therefore, it is possible to provide a flexible wiring board that does not cause a failure such as disconnection.
Further, by reinforcing the insulating film in the portion where the wiring pattern is formed with a reinforcing plate, the wiring pattern can be formed with a hard conductive paste, and the wiring pattern can be made into a fine pattern. Therefore, electrical components such as chip components can be surface-mounted with high density.

また、接続パターンに用いている導電ペーストは、ポリエステル樹脂からなるバインダを用いているので、柔軟性に優れ、更に確実にフレキ部の折れ曲がりに追従して接続パターンが折れ曲がることができる。   Moreover, since the conductive paste used for the connection pattern uses a binder made of a polyester resin, it is excellent in flexibility, and the connection pattern can be bent more reliably following the bending of the flexible portion.

また、配線パターンは、接続パターンと接続する接続部の幅寸法が接続パターンと同等あるいは幅狭に形成され、配線パターンの接続部上に接続パターンを重ね合わせて印刷形成したので、配線パターンと接続パターンとに印刷ズレがあったとしても、配線パターンと接続パターンとを確実に接続することができる。   In addition, the wiring pattern is formed so that the width dimension of the connection part connected to the connection pattern is equal to or narrower than the connection pattern, and the connection pattern is overlaid on the connection part of the wiring pattern and printed. Even if there is a printing misalignment with the pattern, the wiring pattern and the connection pattern can be reliably connected.

また、フレキ部の端部を補強板で補強し、この部分に接続パターンを延長させてリード部を形成したので、外部の電子機器等のコネクタ等にリード部を確実に接続することができる。   Further, since the end portion of the flexible portion is reinforced with a reinforcing plate and the connection pattern is extended to this portion to form the lead portion, the lead portion can be reliably connected to a connector or the like of an external electronic device or the like.

以下、図面に基づいて本発明のフレキシブル配線基板を図１〜図３に基づいて説明する。図１は本発明のフレキシブル配線基板を説明する斜視図であり、図２は本発明に係わるパターン接続部の要部断面図であり、図３は図２の平面図である。
まず、本発明のフレキシブル配線基板１は、図１に示すように、横長状の１枚の絶縁フィルム２が配設され、絶縁フィルム２の例えば長手方向の２箇所に面積の大きな第１、第２リジッド部３、４が形成され、この第１、第２リジッド部３、４は、下面に、例えばアクリル樹脂等の硬質樹脂板からなる第１、第２補強板５、６が、接着剤等で固着され、上面に複数の第１、第２配線パターン３ａ、４ａが形成されている。 Hereinafter, the flexible wiring board of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view for explaining a flexible wiring board according to the present invention, FIG. 2 is a cross-sectional view of a main part of a pattern connecting portion according to the present invention, and FIG. 3 is a plan view of FIG.
First, as shown in FIG. 1, the flexible wiring board 1 of the present invention is provided with a single horizontally long insulating film 2, and the insulating film 2 has first and second large areas at two locations in the longitudinal direction, for example. 2 rigid portions 3 and 4 are formed, and the first and second rigid portions 3 and 4 are provided on the lower surface with first and second reinforcing plates 5 and 6 made of a hard resin plate such as acrylic resin, for example. A plurality of first and second wiring patterns 3a and 4a are formed on the upper surface.

前記第１、第２リジッド部３、４の複数の配線パターン３ａ、４ａには、例えばコンデンサ、抵抗等のチップ部品からなる複数の電気部品（図示せず）が表面実装されて接続されている。
また、第１、第２配線パターン３ａ、４ａは、導電フィラ（金属粉末）の混合量を多くすると共に硬質の導電ペーストを用いて、第１、第２リジッド部３、４上にスクリーン印刷等で形成されている。
そのために、第１、第２配線パターン３ａ、４ａは、印刷時ににじみ等の発生が無くファインパターン化が可能となり、電気部品の実装密度を向上させることができる。また、第１、第２配線パターン３ａ、４ａは、ファインパターン化しても、比抵抗が１×１０−５Ω・ｃｍと低抵抗とすることができる。 A plurality of electrical components (not shown) made of chip components such as capacitors and resistors are surface-mounted and connected to the plurality of wiring patterns 3a, 4a of the first and second rigid portions 3, 4. .
The first and second wiring patterns 3a and 4a are screen-printed on the first and second rigid portions 3 and 4 by using a hard conductive paste while increasing the amount of conductive filler (metal powder) mixed. It is formed with.
Therefore, the first and second wiring patterns 3a and 4a can be formed into fine patterns without causing bleeding or the like during printing, and the mounting density of electrical components can be improved. Moreover, even if the first and second wiring patterns 3a and 4a are made into fine patterns, the specific resistance can be as low as 1 × 10 −5 Ω · cm.

また、第１、第２リジッド部３、４間にの絶縁フィルム２には、細長状のフレキ部７が形成され、このフレキ部７によって、第１、第２リジッド部３、４がつながって一体化されている。
前記フレキ部７には、複数の第１接続パターン７ａが形成され、この第１接続パターン７ａは、柔軟性のあるポリエステル樹脂等からなるバインダを用い、このバインダに混合する導電フィラ（金属粉）の混合量を、第１、第２配線パターン３ａ、４ａより少なくした導電ぺーストを用いて、フレキ部７上にスクリーン印刷等により形成されている。 Further, an elongated flexible portion 7 is formed in the insulating film 2 between the first and second rigid portions 3, 4, and the first and second rigid portions 3, 4 are connected by the flexible portion 7. It is integrated.
The flexible portion 7 is formed with a plurality of first connection patterns 7a. The first connection patterns 7a use a binder made of a flexible polyester resin or the like, and a conductive filler (metal powder) mixed with the binder. Is formed on the flexible portion 7 by screen printing or the like using a conductive paste in which the mixed amount is less than that of the first and second wiring patterns 3a and 4a.

そのために、第１接続パターン５ａは、柔軟性に優れており、設計等の都合上フレキ部７を折れ曲げて使用したとしても第１接続パターン５ａに断線等の不具合が発生することがない。
また、第１接続パターン５ａの比抵抗は、８×１０−５Ω・ｃｍと第１、第２配線パターン３ａ、４ａの比抵抗より高いが、第１フレキ部７に形成する数が少ないので、幅広にすることにより比抵抗を低くすることができる。
また、複数の第１接続パターン７ａは、ピッチ寸法が、例えば０．５ｍｍで形成され、この第１接続パターン７ａと第１、第２配線パターン３ａ、４ａの一部とが電気的に接続形成されている。 Therefore, the first connection pattern 5a is excellent in flexibility, and even if the flexible portion 7 is bent and used for the sake of design or the like, the first connection pattern 5a does not suffer from problems such as disconnection.
Further, the specific resistance of the first connection pattern 5a is 8 × 10 −5 Ω · cm, which is higher than the specific resistance of the first and second wiring patterns 3a and 4a, but the number formed in the first flexible portion 7 is small. The specific resistance can be lowered by increasing the width.
The plurality of first connection patterns 7a are formed with a pitch dimension of, for example, 0.5 mm, and the first connection pattern 7a is electrically connected to a part of the first and second wiring patterns 3a and 4a. Has been.

また、図１に示す第１接続パターン７ａと第１、第２配線パターン３ａ、４ａとの接続部Ａは、図２、図３に示すように、絶縁フィルム２の第１リジッド部３上に形成した第１配線パターン３ａの端部に形成した接続部３ｂ上に、第１接続パターン７ａが印刷等で積層形成されて、第１配線パターン３ａと第１接続パターン７ａとが電気的に接続されている。
前記第１配線パターン３ａは、厚さが５〜１５μｍに形成されると共に、幅寸法が略０．２５ｍｍに形成され、接続部３ｂが幅寸法０．２ｍｍ〜０．２５ｍｍの幅狭に形成されている。
また、第１接続パターン７ａの幅寸法は、第１配線パターン３ａの幅寸法と略同等に形成されている。 Further, the connection portion A between the first connection pattern 7a and the first and second wiring patterns 3a and 4a shown in FIG. 1 is formed on the first rigid portion 3 of the insulating film 2 as shown in FIGS. A first connection pattern 7a is stacked on the connection portion 3b formed at the end of the formed first wiring pattern 3a by printing or the like, and the first wiring pattern 3a and the first connection pattern 7a are electrically connected. Has been.
The first wiring pattern 3a is formed to have a thickness of 5 to 15 μm, a width dimension of approximately 0.25 mm, and a connection portion 3b having a width dimension of 0.2 mm to 0.25 mm. ing.
Further, the width dimension of the first connection pattern 7a is formed substantially equal to the width dimension of the first wiring pattern 3a.

そのために、印刷形成時に、第１配線パターン３ａの接続部３ｂと第１接続パターン７ａとが若干の印刷ズレがあっても、互いに確実に接続させることができる。
また、第２リジッド部４の第２配線パターン４ａの図示左右両端部にも、第１配線パターン３ａの接続部３ｂと同様の幅狭の端部（図示せず）が形成されている。 Therefore, even when there is a slight print misalignment between the connection portion 3b of the first wiring pattern 3a and the first connection pattern 7a at the time of printing formation, the connection can be made reliably.
In addition, narrow end portions (not shown) similar to the connection portions 3b of the first wiring pattern 3a are also formed on the left and right ends of the second wiring pattern 4a of the second rigid portion 4 in the drawing.

また、第２リジッド部４からは、図示左側に第２フレキ部８が所定長さで延長形成され、この第２フレキ部８の上面に、第１接続パターン７ａと同じ材質、寸法の第２接続パターン８ａが第２配線パターン４ａに接続して形成されている。
また、第２フレキ部８の図示左端部側の下面には、第３補強板９が固着され、この第３補強板９が固着された部分の第２フレキ部８の上面に、第２接続パターン８ａが延長されてリード部８ｂとなり、このリード部８ｂが外部機器に配設されたコネクタ（図示せず）等に接続可能になっている。 A second flexible portion 8 is formed to extend from the second rigid portion 4 to the left side of the figure with a predetermined length on the left side of the figure, and a second material having the same material and dimensions as the first connection pattern 7a is formed on the upper surface of the second flexible portion 8. A connection pattern 8a is formed in connection with the second wiring pattern 4a.
Further, a third reinforcing plate 9 is fixed to the lower surface of the second flexible portion 8 on the left end side in the drawing, and the second connection is formed on the upper surface of the second flexible portion 8 where the third reinforcing plate 9 is fixed. The pattern 8a is extended to become a lead portion 8b, and the lead portion 8b can be connected to a connector (not shown) provided in an external device.

このような本発明のフレキシブル配線基板１は、第１、第２リジッド部３、４が第１、第２補強板５、６で補強されているので、第１、第２リジッド部３、４が折れ曲がることがない。
そのために、第１、第２リジッド部３、４に形成した第１、第２配線パターン３ａ、４ａがファインパターン化されても、第１、第２配線パターン３ａ、４ａに断線等の不具合が発生することがない。
そのために、第１、第２リジッド部３、４にチップ部品等の電気部品を高密度に表面実装することができ、第１、第２リジッド部３、４の面積を小さくできる。 In such a flexible wiring board 1 of the present invention, the first and second rigid portions 3, 4 are reinforced by the first and second rigid plates 5, 6. Will not bend.
Therefore, even if the first and second wiring patterns 3a and 4a formed on the first and second rigid portions 3 and 4 are finely patterned, the first and second wiring patterns 3a and 4a have defects such as disconnection. It does not occur.
Therefore, electrical components such as chip components can be surface-mounted on the first and second rigid portions 3 and 4 with high density, and the areas of the first and second rigid portions 3 and 4 can be reduced.

更に、第１、第２フレキ部７、８の第１、第２接続パターン７ａ、８ａを柔軟性のある導電ペーストを用いて印刷形成しているので、フレキ部７、８の折り曲げに追従して第１、第２接続パターン７ａ、８ａが折り曲げることができる。
そのために、第１、第２接続パターン７ａ、８ａに断線等の障害が発生することがない。 Furthermore, since the first and second connection patterns 7a and 8a of the first and second flexible portions 7 and 8 are formed by printing using a flexible conductive paste, the flex portions 7 and 8 follow the bending. Thus, the first and second connection patterns 7a and 8a can be bent.
Therefore, the first and second connection patterns 7a and 8a do not have a failure such as disconnection.

本発明のフレキシブル配線基板を説明する斜視図である。It is a perspective view explaining the flexible wiring board of this invention. 本発明に係わるパターン接続部の要部断面図である。It is principal part sectional drawing of the pattern connection part concerning this invention. 図２の平面図である。FIG. 3 is a plan view of FIG. 2. 従来のフレキシブル配線基板を説明する要部断面図である。It is principal part sectional drawing explaining the conventional flexible wiring board.

符号の説明Explanation of symbols

１ 本発明のフレキシブル配線基板
２ 絶縁フィルム
３ 第１リジッド部
３ａ 第１配線パターン
３ｂ 接続部
４ 第２リジッド部
４ａ 第２配線パターン
５ 第１補強板
６ 第２補強板
７ 第１フレキ部
７ａ 第１接続パターン
８ 第２フレキ部
８ａ 第２接続パターン
８ｂ リード部
９ 第３補強板
DESCRIPTION OF SYMBOLS 1 Flexible wiring board 2 of this invention Insulating film 3 1st rigid part 3a 1st wiring pattern 3b Connection part 4 2nd rigid part 4a 2nd wiring pattern 5 1st reinforcement board 6 2nd reinforcement board 7 1st flexible part 7a 1st 1 connection pattern 8 second flexible part 8a second connection pattern 8b lead part 9 third reinforcing plate

Claims (4)

可撓性を有する１枚の絶縁フィルム上に形成した複数の配線パターンと、この配線パターンに接続される接続パターンとを備え、前記配線パターンを形成した部分の前記絶縁フィルムは、補強板で補強されてリジッド部となり、前記接続パターンを形成した部分の前記絶縁フィルムは、可撓性のあるフレキ部となり、このフレキ部に形成した前記接続パターンは、柔軟性のある導電ペーストを用いて印刷形成して前記配線パターンに接続したことを特徴とするフレキシブル配線基板。   A plurality of wiring patterns formed on a flexible insulating film and a connection pattern connected to the wiring pattern, wherein the insulating film in the portion where the wiring pattern is formed is reinforced with a reinforcing plate The portion of the insulating film where the connection pattern is formed becomes a flexible portion, and the connection pattern formed on the flexible portion is formed by printing using a flexible conductive paste. A flexible wiring board connected to the wiring pattern. 前記接続パターンに用いている前記導電ペーストは、ポリエステル樹脂からなるバインダを用いていることを特徴とする請求項１記載のフレキシブル配線基板。   The flexible wiring board according to claim 1, wherein the conductive paste used for the connection pattern uses a binder made of a polyester resin. 前記配線パターンは、前記接続パターンと接続する接続部の幅寸法が前記接続パターンと同等あるいは幅狭に形成され、前記配線パターンの接続部上に前記接続パターンを重ね合わせて印刷形成したことを特徴とする請求項１、または２記載のフレキシブル配線基板。   The wiring pattern is formed so that a width dimension of a connection portion connected to the connection pattern is equal to or narrower than the connection pattern, and the connection pattern is superimposed on the connection portion of the wiring pattern and printed. The flexible wiring board according to claim 1 or 2. 前記フレキ部の端部を補強板で補強し、この部分に前記接続パターンを延長させてリード部を形成したことを特徴とする請求項１乃至３のいずれかに記載のフレキシブル配線基板。

The flexible wiring board according to claim 1, wherein an end portion of the flexible portion is reinforced with a reinforcing plate, and a lead portion is formed by extending the connection pattern in this portion.

JP2004192995A 2004-06-30 2004-06-30 Flexible wiring board Expired - Fee Related JP4336628B2 (en)

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