JP2019083239A - Electronic equipment - Google Patents

Abstract

To provide electronic equipment that comprises a plurality of members and a circuit element provided together with those members and that hardly causes unnecessary coupling between the members and circuit element.SOLUTION: Electronic equipment 101 comprises a first member 1 made partially or entirely of an electric conductor or magnetic body, a second member 2, and a circuit element 3 connected to the second member 2 and arranged in predetermined position relation with the first member 1. The circuit element 3 consists of a circuit formation part 31, a connection part 32, and a wiring part 33. The first member 1 is arranged at a position that a formation surface of a mount electrode 2E of the second member 2 faces, a wiring conductor 33W is formed in a layer closer to a first principal surface MS1 than a second principal surface MS2, and the wiring part 33 has a bent part 32BS bent with the side of the first principal surface MS1 outside the bending such that the first principal surface MS1 is farther away from the first member 1 than the second principal surface MS2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device comprising a plurality of members and a circuit element provided together with the members.

  For example, in a portable electronic device, in order to mount a coil antenna, the end of the coil antenna is inserted into a connector provided on one side of the circuit board, and the main part of the coil antenna is folded back to the other side of the circuit board Patent Document 1 shows an electronic device of a structure.

International Publication No. 2017/018134

  In the electronic device described in Patent Document 1, in the coil antenna, a connector insertion portion, a coil antenna formation portion, and a wiring portion connecting the two are formed by one multilayer substrate. The wiring portion is bent so as to wrap the edge of the circuit board. Therefore, depending on the position of the conductor pattern formed on the circuit board, there is a possibility that the conductor pattern and the wiring conductor formed in the wiring portion may be unnecessarily coupled electrically or magnetically. The occurrence of such unnecessary coupling causes problems such as deterioration of predetermined electrical characteristics of the coil antenna and deterioration of predetermined characteristics of the circuit formed on the circuit board.

  The unnecessary coupling is not limited to one generated between the circuit board and the coil antenna, and is a common problem generated between a circuit member and a certain member which is partially or entirely made of a conductor or a magnetic body.

  Therefore, an object of the present invention is to provide an electronic device that is less likely to cause unnecessary coupling between the members and the circuit element in the electronic device provided with a plurality of members and a circuit element provided with these members.

(1) The electronic device of the present invention is
A first member which is partially or entirely a conductor or a magnetic body, a second member, and a circuit element connected to the second member and disposed in a predetermined positional relationship with the first member; An electronic device comprising
The circuit element has a first main surface and a second main surface facing each other,
The circuit element is
A circuit forming portion in which a circuit is formed;
A connection portion electrically connected to the second member;
A wiring conductor that connects between the circuit formation portion and the connection portion is formed, and is configured by a wiring portion that is continuous with the circuit formation portion and the connection portion,
An external connection electrode connected to the second member is formed on the first main surface of the connection portion of the circuit element,
The second member includes a mounting electrode to which the external connection electrode of the circuit element is connected,
The first member is disposed at a position where the formation surface of the mounting electrode of the second member is opposed to each other.
The wiring conductor is formed on the first main surface or a layer closer to the first main surface than the second main surface,
The wiring portion has a bent portion in which the first main surface side is the outside of bending, and the first main surface is bent away from the first member from the second main surface.
It is characterized by

  According to the above configuration, since the wiring conductors of the wiring portion of the circuit element are arranged in a distance away from the first member, unnecessary electrical and magnetic coupling between the wiring conductor and the first member is suppressed.

(2) The first member is, for example, a magnetic component such as a permanent magnet or a yoke. In this case, unnecessary magnetic coupling between the wiring conductor of the wiring portion of the circuit element and the first member (magnetic component) is suppressed.

(3) The first member is, for example, a substrate on which a circuit is formed. In this case, unnecessary electromagnetic field coupling between the wiring conductor of the wiring portion of the circuit element and the circuit of the first member (substrate) is suppressed.

(4) It is preferable that a high frequency circuit is formed in the circuit formation portion, and the substrate is a substrate on which a digital circuit is formed. According to this structure, the high frequency circuit and the digital circuit which are particularly problematic are separated in position, and unnecessary coupling between the two is suppressed.

(5) It is preferable that the width of the wiring portion in the direction orthogonal to the extending direction of the wiring conductor is smaller than that of the circuit forming portion. According to this structure, bending at the bending portion becomes easy.

(6) It is preferable that the said circuit formation part, the said connection part, and the said wiring part were comprised by the single multilayer board | substrate by which several base material layers are laminated | stacked. By this, the circuit formation portion, the connection portion, and the wiring portion can be easily manufactured as an integral body. Further, since the boundary between the circuit formation portion and the wiring portion and the boundary between the connection portion and the wiring portion are all continuous, damage due to bending stress is suppressed.

(7) It is preferable that the said wiring conductor is formed in one layer among these base material layers. According to this structure, compared to the structure in which the wiring conductor is formed in a plurality of layers, the tensile and compressive expansion / contraction stress on the wiring conductor due to the bending of the wiring portion becomes smaller, and the breakage of the wiring conductor is less likely to occur.

(8) The circuit formation portion and the connection portion are preferably thicker than the wiring portion. With this structure, the rigidity of the circuit formation portion and the connection portion is increased, and the rigidity of the wiring portion is relatively lowered, so that deformation of the circuit formation portion and deformation of the connection portion due to external stress are suppressed. This maintains the electrical characteristics of the circuit element.

(9) The extending position of the wiring portion with respect to the circuit forming portion and the extending position of the wiring portion with respect to the connection portion are preferably positions closer to the first main surface than the second main surface. . According to this structure, since the wiring conductor of the wiring portion is disposed at a position further away from the first member, unnecessary electrical and magnetic coupling between the wiring conductor and the first member is effectively suppressed.

  According to the present invention, in the electronic device including the plurality of members and the circuit element provided together with the members, unnecessary coupling between the members and the circuit element is effectively suppressed.

FIG. 1 is a longitudinal sectional view of the electronic device 101 according to the first embodiment. FIG. 2 is a longitudinal sectional view of the circuit element 3 before bending. FIG. 3 is a plan view of the substrates of the circuit element 3 before lamination. FIG. 4 is a longitudinal sectional view of the electronic device 102 according to the second embodiment. FIG. 5 is a longitudinal sectional view of the electronic device 103 according to the third embodiment. FIG. 6 is a plan view of the substrates of the circuit element 3 before lamination.

  Hereinafter, some specific examples will be described with reference to the drawings to show a plurality of modes for carrying out the present invention. The same reference numerals are given to the same parts in each drawing. Although the embodiments are shown separately for convenience in consideration of the description of the main points or the ease of understanding, partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, descriptions of matters in common with the first embodiment will be omitted, and only different points will be described. In particular, the same operation and effect by the same configuration will not be sequentially referred to in each embodiment.

First Embodiment
FIG. 1 is a longitudinal sectional view of the electronic device 101 according to the first embodiment. The electronic device 101 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1.

  The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The circuit element 3 includes a circuit forming portion 31, a connecting portion 32 electrically connected to the second member 2, and a wiring portion 33 continuous to the circuit forming portion 31 and the connecting portion 32.

  In the circuit formation portion 31, a circuit including the circuit conductor 31C and the like is formed. In the wiring portion 33, a wiring conductor 33W that connects between the circuit formation portion 31 and the connection portion 32 is formed.

  In this example, both of the first member 1 and the second member 2 are circuit boards. In particular, the first member 1 is a circuit board on which a digital circuit is configured. A conductor (circuit conductor) 2C is formed inside the first member 1 which is the circuit board.

  An external connection electrode 32 </ b> E is formed on the first main surface MS <b> 1 of the connection portion 32 of the circuit element 3. The second member 2 includes a mounting electrode 2E to which the external connection electrode 32E of the circuit element 3 is connected. The external connection electrode 32E of the connection portion 32 of the circuit element 3 is bonded to the mounting electrode 2E of the second member 2 via a bonding material such as solder.

  The first member 1 is disposed at a position facing the formation surface of the mounting electrode 2E of the second member 2.

  The wiring conductor 33W is formed in a layer closer to the first main surface MS1 than the second main surface MS2.

  The wiring portion 33 of the circuit element 3 has a bent portion 32BS. The bent portion 32BS is a portion where the first main surface MS1 side is the outside of bending, and the first main surface MS1 is bent so as to be farther from the first member 1 than the second main surface MS2.

  Note that a wiring conductor or a circuit forming conductor other than the wiring conductor 33W may be formed in the connection portion 32.

  FIG. 2 is a longitudinal sectional view of the circuit element 3 before bending. The circuit element 3 is, for example, a multilayer substrate formed by laminating a thermoplastic resin base material having a liquid crystal polymer (LCP) or a polyetheretherketone (PEEK) as a main material. Of the circuit conductor 31C, the wiring conductor 33W, and the external connection electrode 32E, the conductor pattern extending in the layer direction of the base material is a patterned copper foil. Conductor patterns formed in different layers are connected by interlayer connection conductors. In this interlayer connection conductor, for example, after forming a hole in the above-mentioned base material by a laser etc., a conductive paste containing conductive particles such as Cu, Sn or an alloy thereof is disposed, and the heat and pressure treatment is performed later. It is provided by curing.

  FIG. 3 is a plan view of the substrates of the circuit element 3 before lamination. In addition, in FIG. 3, it is a top view in the state cut out to one piece for convenience of explanation. The actual manufacturing process of the multilayer substrate is performed in the collective substrate state.

  As shown in FIG. 3, the circuit conductor 31C is formed on the substrates S2 and S3, and the external connection electrode 32E is formed on the substrate S3. Further, the wiring conductor 33W is formed on the base material S4. The broken-line circles in FIG. 3 represent interlayer connection conductors. Conductor patterns are not formed on the substrates S1 and S5. The circuit conductor 31C forms a coil of about 2 turns.

  The circuit formation part 31 is comprised by the base material layer of four layers, the connection part 32 is comprised by the base material layer of three layers, and the wiring part 33 is comprised by the base material layer of two layers. That is, the circuit formation portion 31 and the connection portion 32 are thicker than the wiring portion 33.

  In the wiring portion 33, the width W in the direction (Y-axis direction) orthogonal to the extending direction (X-axis direction) of the wiring conductor 33W is smaller than the width of the circuit forming portion 31.

  When mounting the circuit element 3, as shown in FIG. 1, the external connection electrode 32 E of the connection portion 32 is connected to the mounting electrode 2 E of the second member 2, and a predetermined portion of the wiring portion 33 of the circuit element 3 is Y The circuit forming portion 31 is disposed on the upper surface of the first member 1 by being bent in a U-shaped cross section along an axis parallel to the axis.

  According to the present embodiment, the following effects can be obtained.

(A) Since the distance between the conductor (circuit conductor) 2C of the second member (circuit board) 2 and the wiring conductor 33W is effectively separated, unnecessary electrical and magnetic coupling between the both is suppressed.

(B) Unnecessary coupling between the high frequency circuit of the circuit forming portion 31 and the digital circuit of the second member 2 is effectively suppressed.

(C) Since the width of the wiring portion 33 in the direction orthogonal to the extending direction of the wiring conductor 33W is smaller than the width of the circuit forming portion 31, bending at the bending portion 32BS is facilitated.

(D) The circuit formation portion 31, the connection portion 32, and the wiring portion 33 are formed of a single multilayer substrate in which a plurality of base material layers are stacked. , And the wiring portion 33 can be easily manufactured as an integral body.

(E) The boundary between the circuit formation portion 31 and the wiring portion 33 and the boundary between the connection portion 32 and the wiring portion 33 form a continuous structure, so that damage due to bending stress is suppressed.

(F) Since the wiring conductor 33W is formed in one layer of the plurality of base layers, the wiring conductor 33W is bent to the wiring conductor 33W compared to the structure in which the wiring conductor 33W is formed in a plurality of layers. The tensile and compressive expansion and contraction stress is reduced, and breakage of the wiring conductor 33W is also less likely to occur.

(G) The wiring conductor 33W formation layer is provided in the inner layer only from the surface layer. The outermost layer is a layer which is also continuous with the circuit formation portion 31 and the connection portion 32. Thereby, peeling of the outermost layer hardly occurs, and the wiring conductor 33W and the wiring conductor 33W forming layer can be effectively protected against external impact.

(H) The circuit forming portion 31 and the connecting portion 32 are thicker than the wiring portion 33. Therefore, the rigidity of the circuit forming portion 31 and the connecting portion 32 is high, and the rigidity of the wiring portion 33 is relatively low. The deformation of the formation portion 31 and the deformation of the connection portion 32 are suppressed. By this, the electrical characteristics of the circuit element 3 are maintained.

Second Embodiment
The second embodiment shows an example of an electronic device in which the shape of the circuit element 3 and the configuration of the first member 1 are different from those of the first embodiment.

  FIG. 4 is a longitudinal sectional view of the electronic device 102 according to the second embodiment. The electronic device 102 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1.

  The circuit element 3 has a first main surface MS1 and a second main surface MS2 facing each other. The circuit element 3 includes a circuit forming portion 31, a connecting portion 32 electrically connected to the second member 2, and a wiring portion 33 continuous to the circuit forming portion 31 and the connecting portion 32.

  In the circuit formation portion 31, a circuit including the circuit conductor 31C and the like is formed. In the wiring portion 33, a wiring conductor 33W that connects between the circuit formation portion 31 and the connection portion 32 is formed.

  The configurations of the connection portion 32 and the second member 2 are the same as those shown in the first embodiment. However, the wiring portion 33 of the circuit element 3 is bent in an L-shaped cross section.

  In the present embodiment, the second member 2 is a circuit board, and the first member 1 is a permanent magnet. The circuit conductor 31C of the circuit forming unit 31 acts as an electromagnet. The interaction between the electromagnet by the circuit conductor 31C and the first member (permanent magnet) 1 causes an electromagnetic force to act between the two. In this example, since the circuit forming portion 31 is fixed, the first member (permanent magnet) 1 is moved in the arrow direction (X-axis direction) in the figure by the electromagnetic force.

  In addition to the permanent magnet, the first member 1 can achieve the same function and effect even if it is a magnetic component such as a yoke.

  In the circuit element 3 according to the present embodiment, the extension position EP1 of the wiring portion 33 with respect to the circuit formation portion 31 and the extension position EP2 of the wiring portion 33 with respect to the connection portion 32 have a first main surface than the second main surface MS2. It is a position closer to MS1.

  According to this structure, the wiring conductor 33W of the wiring portion 33 is disposed at a position further away from the first member 1. Therefore, unnecessary electrical and magnetic coupling between the wiring conductor 33W and the first member 1 is effectively suppressed.

  Further, in the circuit element 3 in the present embodiment, the extension position EP2 of the wiring portion 33 is a position closer to the first main surface MS1 than the second main surface MS2. Therefore, the path length from the wiring conductor 33W to the external connection electrode 32E (the length of the interlayer connection conductor) is shortened, so that the conductor resistance in the connection portion 32 can be reduced.

Third Embodiment
The third embodiment shows an example in which the structure of the connection portion of the circuit element is different from that of the first and second embodiments.

  FIG. 5 is a longitudinal sectional view of the electronic device 103 according to the third embodiment. The electronic device 103 includes a first member 1, a second member 2, and a circuit element 3 connected to the second member 2 and disposed in a predetermined positional relationship with the first member 1. The configurations of the first member 1 and the second member 2 are the same as those shown in the second embodiment.

  As shown in FIG. 5, a resist film 32L such as a solder resist film is formed on the surface of the connection portion 32 of the circuit element 3 on which the external connection electrode 32E is formed.

  FIG. 6 is a plan view of the substrates of the circuit element 3 before lamination. In FIG. 6, the circuit conductor 31C is formed on the substrates S2 and S3, and the wiring conductor 33W is formed on the substrate S4. The conductor pattern is not formed on the substrate S1.

  The circuit forming portion 31 is formed of four base layers, and the connection portion 32 and the wiring portion 33 are both formed of two base layers.

  As described above, even if the number of laminated layers of the connection portion 32 of the circuit element 3 and the base of the wiring portion 33 is the same, the rigidity of the connection portion 32 can be enhanced more than the wiring portion 33 by forming the resist film 32L. it can.

  Instead of the resist film 32L, a cover film made of, for example, polyimide (PI) may be attached.

  The resist film 32L and the cover film may be formed on the surface opposite to the surface on which the external connection electrode 32E of the connection portion 32 is formed.

  Further, the resist film and the cover film may be provided not only at the connection portion 32 but also at the circuit forming portion 31. It is preferable that such a resist film or cover film be made of a material having a high Young's modulus. Even if the connection portion 32 and the circuit formation portion 31 are thin, they can be hardly deformed.

Other Embodiments
Although FIG. 1, FIG. 2 etc. showed the example which formed the wiring conductor 33W in the layer near 1st main surface MS1 rather than 2nd main surface MS2, the wiring conductor 33W has the 1st main surface of the wiring part 33. It may be formed on MS1.

  Although FIG. 1 shows an example in which the first member 1 is a circuit board, the entire first member 1 may be, for example, a conductor such as a frame or a shield plate disposed in a housing of an electronic device. .

  In each embodiment shown above, although circuit element 3 of a multilayer substrate structure was shown, a circuit element may be a single layer substrate structure.

  In each embodiment shown above, although the example in which both the circuit formation part 31 and the connection part 32 were thicker than the wiring part 33 was shown, one of the circuit formation part 31 or the connection part 32 is a structure thicker than the wiring part 33. May be

  Although FIG. 1, FIG. 4, etc. show an example in which substantially the whole of the wiring portion 33 of the circuit element 3 is a bent portion, a bent portion with a relatively small radius of curvature may be formed in a part of the wiring portion 33 .

  Moreover, in the example shown in FIG. 1, FIG. 2, etc., the circuit element 3 is in the XY plane before bending, and shows an example of bending it only around an axis parallel to the Y axis. However, there may be a plurality of bends. Among the bent portions, one may be a bent portion which is bent around an axis different from the axis parallel to the Y axis.

  Finally, the description of the above embodiments is illustrative in all respects and not restrictive. Modifications and variations are possible as appropriate to those skilled in the art. The scope of the present invention is indicated not by the embodiments described above but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope of the claims and equivalents.

EP1, EP2 ... extension position MS1 ... first main surface MS2 ... second main surface S1 to S5 ... base material 1 ... first member 2 ... second member 2 C ... conductor 2 E of the second member ... mounting electrode 3 ... circuit element 31 Circuit forming portion 31C Circuit conductor 32 Connecting portion 32BS Bending portion 32E External connection electrode 32L Resist film 33 Wiring portion 33W Wiring conductor 101 to 103 Electronic device

Claims (9)

A first member which is partially or entirely a conductor or a magnetic body, a second member, and a circuit element connected to the second member and disposed in a predetermined positional relationship with the first member; An electronic device comprising
The circuit element has a first main surface and a second main surface facing each other,
The circuit element is
A circuit forming portion in which a circuit is formed;
A connection portion electrically connected to the second member;
A wiring conductor that connects between the circuit formation portion and the connection portion is formed, and is configured by a wiring portion that is continuous with the circuit formation portion and the connection portion,
An external connection electrode connected to the second member is formed on the first main surface of the connection portion of the circuit element,
The second member includes a mounting electrode to which the external connection electrode of the circuit element is connected,
The first member is disposed at a position where the formation surface of the mounting electrode of the second member is opposed to each other.
The wiring conductor is formed on the first main surface or a layer closer to the first main surface than the second main surface,
The wiring portion has a bent portion in which the first main surface side is the outside of bending, and the first main surface is bent away from the first member from the second main surface.
Electronics. The first member is a magnetic component,
The electronic device according to claim 1. The first member is a substrate on which a circuit is formed,
The electronic device according to claim 1.   The electronic device according to claim 3, wherein a high frequency circuit is formed in the circuit forming portion, and the substrate is a substrate on which a digital circuit is formed. The width of the wiring portion in the direction perpendicular to the extending direction of the wiring conductor is narrower than that of the circuit forming portion.
The electronic device according to any one of claims 1 to 4.   The electronic device according to any one of claims 1 to 5, wherein the circuit formation portion, the connection portion, and the wiring portion are constituted by a single multilayer substrate in which a plurality of base material layers are laminated. machine.   The electronic device according to claim 6, wherein the wiring conductor is formed in one of the plurality of base layers. The circuit formation portion and the connection portion are thicker than the wiring portion.
The electronic device according to claim 6 or 7.   The extension position of the wiring portion with respect to the circuit forming portion and the extension position of the wiring portion with respect to the connection portion are positions closer to the first main surface than the second main surface. Electronic devices.

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