JPS5898214A - セラミツク板を片に細分割する方法およびこれに用いる装置 - Google Patents

セラミツク板を片に細分割する方法およびこれに用いる装置

Info

Publication number
JPS5898214A
JPS5898214A JP57205600A JP20560082A JPS5898214A JP S5898214 A JPS5898214 A JP S5898214A JP 57205600 A JP57205600 A JP 57205600A JP 20560082 A JP20560082 A JP 20560082A JP S5898214 A JPS5898214 A JP S5898214A
Authority
JP
Japan
Prior art keywords
die
dies
ceramic plate
plate
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57205600A
Other languages
English (en)
Japanese (ja)
Inventor
クリスチヤン・ハンメル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5898214A publication Critical patent/JPS5898214A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/16—Transversely of continuously fed work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP57205600A 1981-11-25 1982-11-25 セラミツク板を片に細分割する方法およびこれに用いる装置 Pending JPS5898214A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8122043 1981-11-25
FR8122043A FR2516848A1 (fr) 1981-11-25 1981-11-25 Procede et machine pour subdiviser une plaque de ceramiqueŸa

Publications (1)

Publication Number Publication Date
JPS5898214A true JPS5898214A (ja) 1983-06-11

Family

ID=9264345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57205600A Pending JPS5898214A (ja) 1981-11-25 1982-11-25 セラミツク板を片に細分割する方法およびこれに用いる装置

Country Status (5)

Country Link
US (1) US4865241A (enExample)
EP (1) EP0080765B1 (enExample)
JP (1) JPS5898214A (enExample)
DE (1) DE3269486D1 (enExample)
FR (1) FR2516848A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2586159A1 (fr) * 1985-08-07 1987-02-13 Comptoir Europ Mat Electro Machine de casse
KR920004514B1 (ko) * 1987-05-01 1992-06-08 스미도모덴기고오교오 가부시기가이샤 반도체소자 제조장치
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
US5454002A (en) * 1994-04-28 1995-09-26 The Board Of Regents Of The University Of Oklahoma High temperature semiconductor diode laser
US7497362B2 (en) * 1999-10-16 2009-03-03 Bally Gaming, Inc. Printer tear bar and presenter system
US6857804B2 (en) * 1999-10-16 2005-02-22 Sierra Design Group Vertically mounted modular printer system
US6443642B1 (en) * 1999-10-16 2002-09-03 Sierra Design Group Modular printing system
US7513401B1 (en) * 2000-06-19 2009-04-07 Bally Gaming, Inc. Printer tear bar and presenter system
US7862418B2 (en) * 1999-10-16 2011-01-04 Bally Gaming, Inc. Voucher gaming systems and methods
JP2004526603A (ja) * 2001-05-29 2004-09-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 基板及び基板から部品を分離する方法
US20050023260A1 (en) * 2003-01-10 2005-02-03 Shinya Takyu Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
DE102004022430A1 (de) * 2004-05-06 2005-12-01 Siemens Ag Verfahren zum maschinellen Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
CN104552615B (zh) * 2015-01-05 2016-09-28 深圳顺络电子股份有限公司 一种陶瓷片裂片装置
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers
EP3410473B1 (de) * 2017-05-30 2021-02-24 Infineon Technologies AG Anordnung und verfahren zum vereinzeln von substraten

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4731405U (enExample) * 1971-04-20 1972-12-08
JPS53148787A (en) * 1977-05-31 1978-12-25 Ngk Spark Plug Co Ltd Device for cutting ceramic sheets

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1193172B (de) * 1962-11-24 1965-05-20 Telefunken Patent Verfahren und Vorrichtungen zum Zerbrechen einer geritzten und auf einen Klebestreifen aufgeklebten Halbleiterplatte
FR1481711A (fr) * 1965-06-02 1967-05-19 Nippon Electric Co Dispositif pour briser une masse semi-conductrice en morceaux élémentaires
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers
US3743148A (en) * 1971-03-08 1973-07-03 H Carlson Wafer breaker
US3730410A (en) * 1971-06-16 1973-05-01 T Altshuler Wafer breaker
US3786973A (en) * 1972-03-28 1974-01-22 Ncr Method and apparatus for breaking semiconductor wafers
US4247031A (en) * 1979-04-10 1981-01-27 Rca Corporation Method for cracking and separating pellets formed on a wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4731405U (enExample) * 1971-04-20 1972-12-08
JPS53148787A (en) * 1977-05-31 1978-12-25 Ngk Spark Plug Co Ltd Device for cutting ceramic sheets

Also Published As

Publication number Publication date
FR2516848B1 (enExample) 1984-11-09
FR2516848A1 (fr) 1983-05-27
DE3269486D1 (en) 1986-04-03
EP0080765A1 (fr) 1983-06-08
EP0080765B1 (fr) 1986-02-26
US4865241A (en) 1989-09-12

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