FR1481711A - Dispositif pour briser une masse semi-conductrice en morceaux élémentaires - Google Patents
Dispositif pour briser une masse semi-conductrice en morceaux élémentairesInfo
- Publication number
- FR1481711A FR1481711A FR63728A FR63728A FR1481711A FR 1481711 A FR1481711 A FR 1481711A FR 63728 A FR63728 A FR 63728A FR 63728 A FR63728 A FR 63728A FR 1481711 A FR1481711 A FR 1481711A
- Authority
- FR
- France
- Prior art keywords
- breaking
- semiconductor mass
- elementary pieces
- elementary
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR63728A FR1481711A (fr) | 1965-06-02 | 1966-06-01 | Dispositif pour briser une masse semi-conductrice en morceaux élémentaires |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3260065 | 1965-06-02 | ||
FR63728A FR1481711A (fr) | 1965-06-02 | 1966-06-01 | Dispositif pour briser une masse semi-conductrice en morceaux élémentaires |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1481711A true FR1481711A (fr) | 1967-05-19 |
Family
ID=26171040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR63728A Expired FR1481711A (fr) | 1965-06-02 | 1966-06-01 | Dispositif pour briser une masse semi-conductrice en morceaux élémentaires |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1481711A (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2044689A1 (fr) * | 1969-02-19 | 1971-02-26 | Gen Electric | |
FR2516848A1 (fr) * | 1981-11-25 | 1983-05-27 | Radiotechnique Compelec | Procede et machine pour subdiviser une plaque de ceramiquea |
EP0289045A2 (fr) * | 1987-05-01 | 1988-11-02 | Sumitomo Electric Industries Limited | Appareil pour la fabrication de dispositifs semi-conducteurs |
EP0661737A1 (fr) * | 1993-03-29 | 1995-07-05 | Texas Instruments Incorporated | Procédé de masquage avec ruban matricé |
-
1966
- 1966-06-01 FR FR63728A patent/FR1481711A/fr not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2044689A1 (fr) * | 1969-02-19 | 1971-02-26 | Gen Electric | |
FR2516848A1 (fr) * | 1981-11-25 | 1983-05-27 | Radiotechnique Compelec | Procede et machine pour subdiviser une plaque de ceramiquea |
EP0080765A1 (fr) * | 1981-11-25 | 1983-06-08 | R.T.C. LA RADIOTECHNIQUE-COMPELEC Société anonyme dite: | Procédé et machine pour subdiviser une plaque de céramique |
EP0289045A2 (fr) * | 1987-05-01 | 1988-11-02 | Sumitomo Electric Industries Limited | Appareil pour la fabrication de dispositifs semi-conducteurs |
EP0289045A3 (fr) * | 1987-05-01 | 1991-01-16 | Sumitomo Electric Industries Limited | Appareil pour la fabrication de dispositifs semi-conducteurs |
US5104023A (en) * | 1987-05-01 | 1992-04-14 | Sumitomo Electric Industries, Ltd. | Apparatus for fabrication semiconductor device |
EP0661737A1 (fr) * | 1993-03-29 | 1995-07-05 | Texas Instruments Incorporated | Procédé de masquage avec ruban matricé |
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