FR1481711A - Dispositif pour briser une masse semi-conductrice en morceaux élémentaires - Google Patents

Dispositif pour briser une masse semi-conductrice en morceaux élémentaires

Info

Publication number
FR1481711A
FR1481711A FR63728A FR63728A FR1481711A FR 1481711 A FR1481711 A FR 1481711A FR 63728 A FR63728 A FR 63728A FR 63728 A FR63728 A FR 63728A FR 1481711 A FR1481711 A FR 1481711A
Authority
FR
France
Prior art keywords
breaking
semiconductor mass
elementary pieces
elementary
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR63728A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to FR63728A priority Critical patent/FR1481711A/fr
Application granted granted Critical
Publication of FR1481711A publication Critical patent/FR1481711A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052Means for supporting or holding work during breaking
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
FR63728A 1965-06-02 1966-06-01 Dispositif pour briser une masse semi-conductrice en morceaux élémentaires Expired FR1481711A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR63728A FR1481711A (fr) 1965-06-02 1966-06-01 Dispositif pour briser une masse semi-conductrice en morceaux élémentaires

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3260065 1965-06-02
FR63728A FR1481711A (fr) 1965-06-02 1966-06-01 Dispositif pour briser une masse semi-conductrice en morceaux élémentaires

Publications (1)

Publication Number Publication Date
FR1481711A true FR1481711A (fr) 1967-05-19

Family

ID=26171040

Family Applications (1)

Application Number Title Priority Date Filing Date
FR63728A Expired FR1481711A (fr) 1965-06-02 1966-06-01 Dispositif pour briser une masse semi-conductrice en morceaux élémentaires

Country Status (1)

Country Link
FR (1) FR1481711A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2044689A1 (fr) * 1969-02-19 1971-02-26 Gen Electric
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
EP0289045A2 (fr) * 1987-05-01 1988-11-02 Sumitomo Electric Industries Limited Appareil pour la fabrication de dispositifs semi-conducteurs
EP0661737A1 (fr) * 1993-03-29 1995-07-05 Texas Instruments Incorporated Procédé de masquage avec ruban matricé

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2044689A1 (fr) * 1969-02-19 1971-02-26 Gen Electric
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
EP0080765A1 (fr) * 1981-11-25 1983-06-08 R.T.C. LA RADIOTECHNIQUE-COMPELEC Société anonyme dite: Procédé et machine pour subdiviser une plaque de céramique
EP0289045A2 (fr) * 1987-05-01 1988-11-02 Sumitomo Electric Industries Limited Appareil pour la fabrication de dispositifs semi-conducteurs
EP0289045A3 (fr) * 1987-05-01 1991-01-16 Sumitomo Electric Industries Limited Appareil pour la fabrication de dispositifs semi-conducteurs
US5104023A (en) * 1987-05-01 1992-04-14 Sumitomo Electric Industries, Ltd. Apparatus for fabrication semiconductor device
EP0661737A1 (fr) * 1993-03-29 1995-07-05 Texas Instruments Incorporated Procédé de masquage avec ruban matricé

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