JPS589348A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS589348A
JPS589348A JP10790581A JP10790581A JPS589348A JP S589348 A JPS589348 A JP S589348A JP 10790581 A JP10790581 A JP 10790581A JP 10790581 A JP10790581 A JP 10790581A JP S589348 A JPS589348 A JP S589348A
Authority
JP
Japan
Prior art keywords
common connection
lead frame
notch
connection strip
supporting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10790581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6220706B2 (enrdf_load_stackoverflow
Inventor
Mikio Nishikawa
西川　幹雄
Hiroyuki Fujii
博之 藤井
Kenichi Tateno
立野　健一
Masami Yokozawa
横沢　真覩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP10790581A priority Critical patent/JPS589348A/ja
Priority to CA000406545A priority patent/CA1195782A/en
Priority to US06/395,799 priority patent/US4482915A/en
Priority to EP82106033A priority patent/EP0069390B1/en
Priority to DE8282106033T priority patent/DE3277757D1/de
Priority to DE198282106033T priority patent/DE69390T1/de
Publication of JPS589348A publication Critical patent/JPS589348A/ja
Priority to CA000471714A priority patent/CA1213678A/en
Publication of JPS6220706B2 publication Critical patent/JPS6220706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10790581A 1981-07-06 1981-07-09 リ−ドフレ−ム Granted JPS589348A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP10790581A JPS589348A (ja) 1981-07-09 1981-07-09 リ−ドフレ−ム
CA000406545A CA1195782A (en) 1981-07-06 1982-07-05 Lead frame for plastic encapsulated semiconductor device
US06/395,799 US4482915A (en) 1981-07-06 1982-07-06 Lead frame for plastic encapsulated semiconductor device
EP82106033A EP0069390B1 (en) 1981-07-06 1982-07-06 Lead frame for plastic encapsulated semiconductor device
DE8282106033T DE3277757D1 (en) 1981-07-06 1982-07-06 Lead frame for plastic encapsulated semiconductor device
DE198282106033T DE69390T1 (de) 1981-07-06 1982-07-06 Leiterrahmen fuer halbleiteranordnung in plastikverkapselung.
CA000471714A CA1213678A (en) 1981-07-06 1985-01-08 Lead frame for plastic encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10790581A JPS589348A (ja) 1981-07-09 1981-07-09 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS589348A true JPS589348A (ja) 1983-01-19
JPS6220706B2 JPS6220706B2 (enrdf_load_stackoverflow) 1987-05-08

Family

ID=14471032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10790581A Granted JPS589348A (ja) 1981-07-06 1981-07-09 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS589348A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029143A (ja) * 2008-08-29 2015-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法、リードフレーム
US9905497B2 (en) 2008-08-29 2018-02-27 Semiconductor Components Industries, Llc Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015029143A (ja) * 2008-08-29 2015-02-12 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 樹脂封止型半導体装置とその製造方法、リードフレーム
US9905497B2 (en) 2008-08-29 2018-02-27 Semiconductor Components Industries, Llc Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Also Published As

Publication number Publication date
JPS6220706B2 (enrdf_load_stackoverflow) 1987-05-08

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