JPS589348A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS589348A JPS589348A JP10790581A JP10790581A JPS589348A JP S589348 A JPS589348 A JP S589348A JP 10790581 A JP10790581 A JP 10790581A JP 10790581 A JP10790581 A JP 10790581A JP S589348 A JPS589348 A JP S589348A
- Authority
- JP
- Japan
- Prior art keywords
- common connection
- lead frame
- notch
- connection strip
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、比較的大きな電力を取り扱うことのできる樹
脂封止形半導体装置を製造するために用いるリードフレ
ームに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame used for manufacturing a resin-sealed semiconductor device that can handle relatively large amounts of power.
近年、半導体装置の樹脂封止化が進み、たとえばかなり
大きな電力を取り扱うことのできるトランジスタも樹脂
封止構造とされるに至っているが、この樹脂封止形電力
用半導体装置では、これを組みたてるために用いるリー
ドフレームの基板支持部が放熱板を兼ね、半導体基板の
接着される面とは反対側の面が成型樹脂により覆われる
こと遅く露出する構造となっている。このような構造を
有する樹脂封止形電力用半導体装置は各種の機器にとり
つける際して露出する基板支持部を放熱板へ熱的に結合
されるが、このとき放熱板と基板支持部との間を絶縁板
等を介在させるなどして電気的に絶縁させる必要があっ
た。このため取り付は作業が煩雑となり、組立作業能率
の面で問題があった。In recent years, the use of resin encapsulation in semiconductor devices has progressed, and for example, transistors that can handle considerably large amounts of power have also come to be encapsulated in resin. The substrate supporting portion of the lead frame used for the purpose of cooling also serves as a heat sink, and the surface opposite to the surface to which the semiconductor substrate is bonded is covered with molded resin and is later exposed. When a resin-encapsulated power semiconductor device having such a structure is installed in various devices, the exposed substrate support portion is thermally coupled to the heat sink, but at this time, the connection between the heat sink and the substrate support portion is It was necessary to provide electrical insulation by interposing an insulating plate or the like between them. For this reason, the installation work was complicated, and there was a problem in terms of assembly work efficiency.
このような不都合を排除するために、基板支持体の半導
体基板が接着される側とは反対側の面上を成型樹脂で薄
く被覆した絶縁構造の樹脂封止形半導体装置の実用化が
進められている。In order to eliminate such inconveniences, the practical use of resin-sealed semiconductor devices with an insulating structure in which the surface of the substrate support opposite to the side to which the semiconductor substrate is bonded is thinly coated with molded resin is underway. ing.
第１図はかかる樹脂封止形半導体装置の組み立てに際し
て用いられるリードフレームとして、出願人が特願昭６
６−３２２２９号で提案したＩＪ−ドフレームの平面図
であり、図中１はトランジスタ素子の接着される基板支
持部、２は放熱板への取り付けを可能にするためのねじ
止め用貫通孔、３．４．５は外部リード部、６は移送ピ
ッチの決定ならびに樹脂封止時の位置決めをなす孔７が
穿設された共通接続細条であり、さらに基板支持体１の
外部リード３に繋る辺とは反対側の辺から２本の細条８
，９が延び、これらが第２の共通接続細条１ｏに繋った
構造となっている。なお、第２の共通接続細条１０には
樹脂封止工程で金型の一部と嵌合し、位置規正のための
孔１１が形成されている。第２図は、このような形状の
リードフレームを用いて形成したトランジスタ組立構体
を樹脂で封止成型する状態を示す図であり、上下の金型
１２と１３の間に形成される空所内へ樹脂１４を注入し
て成型がなされる。FIG. 1 shows a lead frame used in assembling such a resin-sealed semiconductor device, which the applicant filed in a patent application in 1983.
This is a plan view of the IJ-do frame proposed in No. 6-32229, in which 1 is a substrate support part to which a transistor element is bonded, 2 is a through hole for screwing to enable attachment to a heat sink, 3.4.5 is an external lead part, 6 is a common connection strip in which a hole 7 is bored for determining the transfer pitch and positioning during resin sealing, and is further connected to the external lead 3 of the substrate support 1. Two strips 8 from the opposite side
, 9 are extended, and these are connected to the second common connection strip 1o. Note that a hole 11 is formed in the second common connection strip 10 to fit into a part of the mold during the resin sealing process and for position adjustment. FIG. 2 is a diagram showing a state in which a transistor assembly structure formed using a lead frame having such a shape is sealed and molded with resin. Molding is performed by injecting resin 14.
リードフレームは、外部リード部３〜６が一方の側にお
いて上下の金型によって挾持されるとともに、他方の側
でも細条１０，１１ならびに第２の共通接続細条８が上
下の金型によって挾持される。また第１の共通接続細条
６に設けた孔７に金型の突出部が嵌合（図示せず）する
ばかりでなく第２の共通接続細条１ｏの孔１１にも金型
の突出部１６が嵌合する。なお１６はねじ止め用の孔を
形成するべく樹脂を部分的に排除する突起、１７はトラ
ンジスタ素子である。The lead frame has external lead parts 3 to 6 held between upper and lower molds on one side, and strips 10, 11 and second common connection strip 8 held between upper and lower molds on the other side. be done. Moreover, not only the protrusion of the mold fits into the hole 7 provided in the first common connection strip 6 (not shown), but also the protrusion of the mold fits into the hole 11 of the second common connection strip 1o. 16 is fitted. Note that 16 is a projection that partially removes the resin to form a hole for screwing, and 17 is a transistor element.
か＼るリードフレームによって封止を行なえば、トラン
ジスタ素子１７の接着された基板支持部１は、上下の金
型１２，１３によって挾持される外部リード３と細条１
０，１１とにより支持されて、金型空所内に浮いた状態
で位置し、放熱板を兼ねる基板支持体の一方の主面（半
導体基板の接着面とは反対の面）の直下にも薄い樹脂の
層を形成した構造の樹脂封止形半導体装置を製造するこ
とができる。If the sealing is performed using such a lead frame, the substrate support portion 1 to which the transistor element 17 is bonded will be connected to the external leads 3 and the strips 1 held between the upper and lower molds 12 and 13.
0 and 11, and is located in a floating state within the mold cavity, and is also directly under one main surface (the surface opposite to the adhesive surface of the semiconductor substrate) of the substrate support that also serves as a heat sink. A resin-sealed semiconductor device having a structure in which a resin layer is formed can be manufactured.
しかしながらか＼るリードフレームを用いて封止成形す
る場合、第１の共通接続細条６、第２の共通接続細条１
ｏ及び基板支持体１の形状及び厚みの差等によって、封
止工程での加熱時に熱変形を生ずる場合があり、各々の
共通接続細条に形成した位置規正用孔７および１１に対
して封止金型の位置規正ピンが嵌合しにくくなること、
あるいは金型で挾持する際にリードフレームの一部が押
しつぶされ、封止成型不良が発生しやすいことなどの改
良すべき余地が残されていた。特に第２の共通接続細条
１０は基板支持部１に対して機械的に強固に接続されて
おり、この第２の共通接続細条１ｏにおいて熱変形が生
じた場合、この変形による影響が基板支持部１へ及びや
すい。However, when performing sealing molding using such a lead frame, the first common connection strip 6 and the second common connection strip 1
Due to differences in the shape and thickness of the substrate support 1 and the substrate support 1, thermal deformation may occur during heating in the sealing process. It becomes difficult to fit the positioning pin of the stopper type,
Alternatively, when the lead frame is clamped with a mold, a portion of the lead frame is crushed, which tends to cause sealing molding defects, which leaves room for improvement. In particular, the second common connection strip 10 is mechanically and firmly connected to the substrate support 1, and if thermal deformation occurs in this second common connection strip 1o, the influence of this deformation will be It easily reaches the support part 1.
本発明は、かかるリードフレームにおける不都合の発生
を排除することのできる改良されたリードフレームを提
供するものであり、本発明のリードフレームの特徴は第
１図で示したリードフレームの一部くとも第２の共通接
続細条に、熱変形の防止と封止成型時の位置決め部とし
て作用する切欠部を等しいピッチで形成したところにあ
る。The present invention provides an improved lead frame that can eliminate the occurrence of such inconveniences in lead frames, and the lead frame of the present invention has the following features: The second common connection strip is provided with notches formed at equal pitches to prevent thermal deformation and to function as positioning portions during sealing molding.
以下に本発明のリードフレームの実施例を示す第３図を
参照して詳しく説明する。A detailed explanation will be given below with reference to FIG. 3 showing an embodiment of the lead frame of the present invention.
第３図は本発明の実施例にかかるリードフレームの平面
形状を示す図である。その全体的な形状は第１図で示し
たリードフレームと同じである。FIG. 3 is a diagram showing a planar shape of a lead frame according to an embodiment of the present invention. Its overall shape is the same as the lead frame shown in FIG.
第１図で示したリードフレームと異る点は、第２の共通
接続細条１ｏの基板支持部１と対向する側の辺で、しか
も細条８と９との間に位置する部分に、たとえば、くさ
び形の切欠部１８が形成されている点である。このよう
に切欠部１８が形成された本発明のリードフレームでは
、第２の共通接続細条１０の幅が切欠部の形成部分にお
いて局部的に狭くなり、この部分で封止金型による加熱
に基く変形が緩和され、したがって、基板支持体１への
変形の影響が少くなる。The difference from the lead frame shown in FIG. 1 lies in the side of the second common connection strip 1o facing the substrate support section 1, and in the part located between the strips 8 and 9. For example, a wedge-shaped notch 18 is formed. In the lead frame of the present invention in which the notch 18 is formed, the width of the second common connection strip 10 is locally narrowed in the part where the notch is formed, and this part is not easily heated by the sealing mold. The underlying deformation is relaxed, and therefore the influence of the deformation on the substrate support 1 is reduced.
また、切欠部１８は封止成型時に位置規正ピンが嵌合す
る位置規正部としても作用するが、図示するようにくさ
び形の形状をしているため、位置規正ピンと切欠部との
相対的な関係に多少のずれが生じたとしても、位置規正
ピンに確実に切欠部１８に嵌入するところとなり、この
嵌入の過程で、各基板支持部の位置を正しい位置に修正
する規正効果が奏される。したがって、極めて良好な封
止作業が可能となり、位置規正の不備によって生じる封
止成型不良が著るしく減少する。Furthermore, the notch 18 also functions as a positioning part into which the positioning pin fits during sealing molding, but since it has a wedge shape as shown in the figure, the positioning pin and the notch are relative to each other. Even if a slight deviation occurs in the relationship, the positioning pin will surely fit into the notch 18, and in the process of this fitting, a regulating effect will be produced to correct the position of each board support part to the correct position. . Therefore, extremely good sealing work is possible, and sealing molding defects caused by inadequate positioning are significantly reduced.
なお、図示する例では、切欠部１８の角度を約９００に
設定しているが、この角度に設定した場合封止成型前の
組立工程で実施されるダイスボンドあるいはワイヤボン
ドに際してのリードフレームの移送における位置規正面
で特に良好な結果が得られた。なお、以上の実施例では
、切欠部１８の形状をくさび形としたが、たとえば第４
図で示すように台形あるいは略半楕円形としてもよい。In the illustrated example, the angle of the notch 18 is set to approximately 900 degrees, but if this angle is set, the lead frame will not be transferred during die bonding or wire bonding performed in the assembly process before sealing molding. Particularly good results were obtained on the positioning plane. In the above embodiment, the shape of the notch 18 is wedge-shaped.
As shown in the figure, it may be trapezoidal or approximately semi-elliptical.
さらに切欠部の形成位置ならびに形成辺についても図示
するところに特定されるものではなく、基板支持体間の
第２の共通接続細条部分としてもよい、。Further, the position and side of the notch are not limited to those shown in the drawings, but may be formed as a second common connection strip between the substrate supports.
また、第１の共通接続細条の側にも形成してもよい。It may also be formed on the side of the first common connection strip.
第１図は、従来の樹脂封止形半導体装置用ＩＪ−ドフレ
ームの形状を示す平面図、第２図はその封止状態を示す
断面図、第３図は本発明の樹脂封止形半導体装置用リー
ドフレームの形状を示す平面図、第４図は切欠部の形状
を示す図である。
１・・・・・・基板支持部、２・・・・・・ねじ止め用
の孔、３ 、４ 、６ 壷＠＠＠ｍｍ外部す−ド部、５
、１０ ｍｍｍ＠＠＠共通接続細条、７，１１・・・
・・・位置決め用の孔、８．９０・・・−細条、１２．
１３−・・・ｅ金型、１４・・・・・・樹脂、１５・・
・・・・金型の突起、１６・・・・・・ねじ止め用の孔
を形成するための金型の突起、１７・・・・・・トラン
ジスタ素子、１８・・・・・・切欠部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
第３図
第４図
９ｊ ／σFIG. 1 is a plan view showing the shape of a conventional resin-sealed IJ-doped frame for a semiconductor device, FIG. 2 is a sectional view showing its sealed state, and FIG. 3 is a resin-sealed semiconductor device according to the present invention. FIG. 4 is a plan view showing the shape of the device lead frame, and FIG. 4 is a diagram showing the shape of the notch. 1... Board support part, 2... Hole for screw fixing, 3, 4, 6 Pot@@@mm external cup part, 5
, 10 mm @ @ common connection strip, 7, 11...
...Positioning hole, 8.90...-Strip, 12.
13-... e mold, 14... resin, 15...
...Protrusion of the mold, 16...Protrusion of the mold for forming a hole for screwing, 17...Transistor element, 18...Notch . Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4 9j /σ
Claims (4)
向へ延びる複数本の外部リード部、同外部リード部の１
本の先端部に繋る放熱板を兼ねる基板支持部、同基板支
持部の前記外部リード部との連繋部側とは反対の反対側
に一端が繋る少くとも２本の細条および同細条の他端に
繋り、前記第１の共通接続細条と基板支持部をはさんで
向い合う第２の共通接続細条を有するとともに、同第２
の共通接続細条に位置決めならびに熱変形緩和用の切欠
部が形成されていることを特徴とするリードフレーム。(1) A first common connection strip, a plurality of external lead portions extending in the same direction from the common connection strip, and one of the same external lead portions.
A board support part that also serves as a heat sink that connects to the tip of the book, at least two thin strips that have one end connected to the opposite side of the board support part that is opposite to the connecting part side with the external lead part, and a second common connection strip connected to the other end of the strip and facing the first common connection strip across the board support portion;
A lead frame characterized in that a notch for positioning and thermal deformation mitigation is formed in the common connection strip of the lead frame.
細条部分に形成されていることを特徴とする特許請求の
範囲第１項に記載のリードフレーム。(2) The lead frame according to claim 1, wherein the notch is formed in the second common connection strip portion located between the two strips.
形のいずれかであることを特徴とする特許請求の範囲第
１項に記載のリードフレーム。(3) The lead frame according to claim 1, wherein the shape of the notch is either a wedge-shaped bitrapezoid or a substantially semi-ellipse.
に選定されていることを特徴とする特許請求の範囲第
１項に記載のリードフレーム。(4) The shape of the notch is wedge-shaped, and the cutting angle is approximately 900.
The lead frame according to claim 1, wherein the lead frame is selected as follows.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10790581A JPS589348A (en) | 1981-07-09 | 1981-07-09 | Lead frame |
| CA000406545A CA1195782A (en) | 1981-07-06 | 1982-07-05 | Lead frame for plastic encapsulated semiconductor device |
| DE8282106033T DE3277757D1 (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| US06/395,799 US4482915A (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| DE198282106033T DE69390T1 (en) | 1981-07-06 | 1982-07-06 | LADDER FRAME FOR SEMICONDUCTOR ARRANGEMENT IN PLASTIC ENCLOSURE. |
| EP82106033A EP0069390B1 (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| CA000471714A CA1213678A (en) | 1981-07-06 | 1985-01-08 | Lead frame for plastic encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10790581A JPS589348A (en) | 1981-07-09 | 1981-07-09 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS589348A true JPS589348A (en) | 1983-01-19 |
| JPS6220706B2 JPS6220706B2 (en) | 1987-05-08 |
Family
ID=14471032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10790581A Granted JPS589348A (en) | 1981-07-06 | 1981-07-09 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589348A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (en) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Resin encapsulated semiconductor device and method of manufacturing the same, and lead frame |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
-
1981
- 1981-07-09 JP JP10790581A patent/JPS589348A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029143A (en) * | 2008-08-29 | 2015-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | Resin encapsulated semiconductor device and method of manufacturing the same, and lead frame |
| US9905497B2 (en) | 2008-08-29 | 2018-02-27 | Semiconductor Components Industries, Llc | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6220706B2 (en) | 1987-05-08 |
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