JPS5889969U - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS5889969U
JPS5889969U JP18470281U JP18470281U JPS5889969U JP S5889969 U JPS5889969 U JP S5889969U JP 18470281 U JP18470281 U JP 18470281U JP 18470281 U JP18470281 U JP 18470281U JP S5889969 U JPS5889969 U JP S5889969U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
insulating substrate
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18470281U
Other languages
Japanese (ja)
Inventor
志熊 孝夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP18470281U priority Critical patent/JPS5889969U/en
Publication of JPS5889969U publication Critical patent/JPS5889969U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a、  bは従来の印刷基板の一例を示す裏面お
よび表面図、第2図は、モールドケースの開口部より見
た平面図、第3図は第1図の基板をモールドケースに装
着した平面図、第4図は本考案の一実施例を示す裏面図
、第5図は第4図の基板を第2図のケースに装着した平
面図である。 1.11・・・・・・セラミック絶縁基板、2.12・
・・・・・リード端子、3・・・・・・電子部品、4・
・・・・・モールドケース、5・・・・・・1番端子方
向を示す突起部、16・・・・・・保護ガラス〔1番端
子表示マーク〕。
Figures 1a and b are back and front views of an example of a conventional printed circuit board, Figure 2 is a plan view seen from the opening of the mold case, and Figure 3 is the circuit board shown in Figure 1 installed in the mold case. FIG. 4 is a back view showing an embodiment of the present invention, and FIG. 5 is a plan view of the board shown in FIG. 4 mounted on the case shown in FIG. 2. 1.11...Ceramic insulating substrate, 2.12.
...Lead terminal, 3...Electronic component, 4.
...Mold case, 5... Protrusion indicating the direction of the No. 1 terminal, 16... Protective glass [No. 1 terminal display mark].

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁体の基板上に電気回路が形成された印刷基板に、該
印刷基板に設けられるリード端子の配列方向を示すマー
クを設けたことを特徴とする印刷基板。
1. A printed circuit board having an electrical circuit formed on an insulating substrate, and provided with a mark indicating the arrangement direction of lead terminals provided on the printed circuit board.
JP18470281U 1981-12-11 1981-12-11 printed circuit board Pending JPS5889969U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18470281U JPS5889969U (en) 1981-12-11 1981-12-11 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18470281U JPS5889969U (en) 1981-12-11 1981-12-11 printed circuit board

Publications (1)

Publication Number Publication Date
JPS5889969U true JPS5889969U (en) 1983-06-17

Family

ID=29985087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18470281U Pending JPS5889969U (en) 1981-12-11 1981-12-11 printed circuit board

Country Status (1)

Country Link
JP (1) JPS5889969U (en)

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