JPS5889935U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5889935U JPS5889935U JP1982140485U JP14048582U JPS5889935U JP S5889935 U JPS5889935 U JP S5889935U JP 1982140485 U JP1982140485 U JP 1982140485U JP 14048582 U JP14048582 U JP 14048582U JP S5889935 U JPS5889935 U JP S5889935U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- hole
- chromium coating
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来のテープキャ１プアボンデイング法を説
明する図。第２図は、従来の半導体回路の実装方法の他
の実施例を示す図である。第３図は、本考案のリード先
端構造を示す図である。第４図は、本考案のボンディン
グ構造を示す図である。
１・・・・・・リード線、２・・・・・・フレキシブル
な電気絶縁テープ、３・・・・・・接着剤、４・・・・
・・半導体集積回路の突起電極、５・・・・・・半導体
集積回路、ｑ・・・・・・リード線、７・・・・・・リ
ード線先端部、８・・・・・・半導体集積回路の電極、
９・・・・・・半導体集積回路、１０・・・・・・レジ
スト、１１・・・・・・部分メッキに形成したボール、
１２・・・・・・アルミニウム被膜、１３・・・・・・
パッシベーション被膜、１４・・・・・・フィールド酸
化膜、１５・・・・・・シリコン基板、１６・・・・・
・クローム被膜、１７・・・・・・金被膜。FIG. 1 is a diagram illustrating a conventional tape cap bonding method. FIG. 2 is a diagram showing another embodiment of the conventional semiconductor circuit mounting method. FIG. 3 is a diagram showing the lead tip structure of the present invention. FIG. 4 is a diagram showing the bonding structure of the present invention. 1... Lead wire, 2... Flexible electrical insulation tape, 3... Adhesive, 4...
... Protruding electrode of semiconductor integrated circuit, 5 ... Semiconductor integrated circuit, q ... Lead wire, 7 ... Lead wire tip, 8 ... Semiconductor integrated circuit electrodes,
9...Semiconductor integrated circuit, 10...Resist, 11...Ball formed on partial plating,
12... Aluminum coating, 13...
Passivation film, 14...Field oxide film, 15...Silicon substrate, 16...
-Chrome coating, 17...gold coating.
Claims (1)
から該孔の中央部に向って突き出た複数本のリード線の
先端部分に、ハンダ又はスズのメッキにて直径３０〜１
００μの球に近いボールを形成した半導体集積回路支持
体の該ボール部は、半導体集積回路のアルミニウムパッ
ド上に１００〜５００Ａのクロム被膜及び５００〜５０
００“人の金被膜を形成したポンディングパッドに圧着
されてなる半導体装置。The tips of multiple lead wires protruding from the periphery of a hole in a portion of a long electrical insulating tape toward the center of the hole are plated with solder or tin to form wires with a diameter of 30 mm to 1 mm.
The ball portion of the semiconductor integrated circuit support body, which is formed into a ball close to a 00μ sphere, has a chromium coating of 100 to 500A and a chromium coating of 500 to 50A on the aluminum pad of the semiconductor integrated circuit.
00 "A semiconductor device that is pressure-bonded to a bonding pad formed with a gold film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982140485U JPS5838610Y2 (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982140485U JPS5838610Y2 (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5889935U true JPS5889935U (en) | 1983-06-17 |
| JPS5838610Y2 JPS5838610Y2 (en) | 1983-09-01 |
Family
ID=29933645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982140485U Expired JPS5838610Y2 (en) | 1982-09-16 | 1982-09-16 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5838610Y2 (en) |
-
1982
- 1982-09-16 JP JP1982140485U patent/JPS5838610Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5838610Y2 (en) | 1983-09-01 |
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