JPS6142843U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6142843U
JPS6142843U JP1984126686U JP12668684U JPS6142843U JP S6142843 U JPS6142843 U JP S6142843U JP 1984126686 U JP1984126686 U JP 1984126686U JP 12668684 U JP12668684 U JP 12668684U JP S6142843 U JPS6142843 U JP S6142843U
Authority
JP
Japan
Prior art keywords
bump electrode
semiconductor equipment
bonded
connecting conductor
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984126686U
Other languages
Japanese (ja)
Inventor
彰 矢野
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP1984126686U priority Critical patent/JPS6142843U/en
Publication of JPS6142843U publication Critical patent/JPS6142843U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例ｊこおけるバンプ電極形成工
程を順次示す断面図、第２図は従来のバンプ電極のリー
ド線との熱圧着工程を示す断面図、第３図はその圧着後
の状態を示す断面図、第４図は圧着後のバンプ電極間の
短絡を示す平面図、第５図はバンプ電極形成前の状態を
示す断面図、第６図は従来のバンプ電極形成後の状態を
示す断面図である。 １：シリコン基板、３：アルミニウム電極膜、・ ５：
密着金属層、６：バリヤ金属層、７：バンプ電極、８：
リード線、９：すずめつき層、１０：ボンデイングッー
ル、７１：芯体、７２：金層。Fig. 1 is a cross-sectional view showing the step of forming a bump electrode according to an embodiment of the present invention, Fig. 2 is a cross-sectional view showing a process of thermocompression bonding of a conventional bump electrode with a lead wire, and Fig. 3 is a cross-sectional view showing the process of bonding a conventional bump electrode with a lead wire. 4 is a plan view showing a short circuit between bump electrodes after crimping, FIG. 5 is a sectional view showing the state before bump electrode formation, and FIG. 6 is a conventional bump electrode after formation. FIG. 1: Silicon substrate, 3: Aluminum electrode film, 5:
Adhesion metal layer, 6: Barrier metal layer, 7: Bump electrode, 8:
Lead wire, 9: tin layer, 10: bonding gourd, 71: core, 72: gold layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子上にバンプ電極が設けられ、該バンプ電極と
接続導体が熱圧着により結合されるものにおいて、バン
プ電極が硬い金属よりなる芯体と１７ その接続
導体との結合側に被着された軟らかい金属層とよりなる
ことを特徴とする半導体装置。In a device in which a bump electrode is provided on a semiconductor element and the bump electrode and a connecting conductor are bonded by thermocompression bonding, the bump electrode is made of a core made of a hard metal and a soft metal core adhered to the side where the connecting conductor is bonded. A semiconductor device comprising a metal layer.
JP1984126686U 1984-08-21 1984-08-21 semiconductor equipment Pending JPS6142843U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984126686U JPS6142843U (en) 1984-08-21 1984-08-21 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984126686U JPS6142843U (en) 1984-08-21 1984-08-21 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6142843U true JPS6142843U (en) 1986-03-19

Family

ID=30685358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984126686U Pending JPS6142843U (en) 1984-08-21 1984-08-21 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6142843U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236432U (en) * 1988-09-01 1990-03-09

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151069A (en) * 1975-06-20 1976-12-25 Matsushita Electric Ind Co Ltd Electrode forming method of a semiconductor element
JPS5285468A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151069A (en) * 1975-06-20 1976-12-25 Matsushita Electric Ind Co Ltd Electrode forming method of a semiconductor element
JPS5285468A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Production of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236432U (en) * 1988-09-01 1990-03-09

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