JPS5889833A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS5889833A
JPS5889833A JP56188626A JP18862681A JPS5889833A JP S5889833 A JPS5889833 A JP S5889833A JP 56188626 A JP56188626 A JP 56188626A JP 18862681 A JP18862681 A JP 18862681A JP S5889833 A JPS5889833 A JP S5889833A
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
cut
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56188626A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6256659B2 (enrdf_load_stackoverflow
Inventor
Takeshi Hasegawa
猛 長谷川
Mitsuru Kyohara
鏡原　満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56188626A priority Critical patent/JPS5889833A/ja
Publication of JPS5889833A publication Critical patent/JPS5889833A/ja
Publication of JPS6256659B2 publication Critical patent/JPS6256659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56188626A 1981-11-25 1981-11-25 ワイヤボンデイング方法 Granted JPS5889833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56188626A JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56188626A JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5889833A true JPS5889833A (ja) 1983-05-28
JPS6256659B2 JPS6256659B2 (enrdf_load_stackoverflow) 1987-11-26

Family

ID=16226976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56188626A Granted JPS5889833A (ja) 1981-11-25 1981-11-25 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5889833A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442830A (en) * 1987-08-11 1989-02-15 Marine Instr Co Ltd Wire bonding
JPH0244744A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
JPH0244743A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
WO2012157599A1 (ja) * 2011-05-17 2012-11-22 株式会社新川 ワイヤボンディング装置及びボンディング方法
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6442830A (en) * 1987-08-11 1989-02-15 Marine Instr Co Ltd Wire bonding
JPH0244744A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
JPH0244743A (ja) * 1988-08-05 1990-02-14 Marine Instr Co Ltd ワイヤボンディング方法
WO2012157599A1 (ja) * 2011-05-17 2012-11-22 株式会社新川 ワイヤボンディング装置及びボンディング方法
JP2012256861A (ja) * 2011-05-17 2012-12-27 Shinkawa Ltd ワイヤボンディング装置及びボンディング方法
TWI488243B (zh) * 2011-05-17 2015-06-11 Shinkawa Kk Threading device and joining method
US9337166B2 (en) 2011-05-17 2016-05-10 Shinkawa Ltd. Wire bonding apparatus and bonding method
WO2014077026A1 (ja) * 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
JP5700482B2 (ja) * 2012-11-16 2015-04-15 株式会社新川 ワイヤボンディング装置及び半導体装置の製造方法
US9793236B2 (en) 2012-11-16 2017-10-17 Shinkawa Ltd. Wire-bonding apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS6256659B2 (enrdf_load_stackoverflow) 1987-11-26

Similar Documents

Publication Publication Date Title
US5953624A (en) Bump forming method
JP3765778B2 (ja) ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
JP3513444B2 (ja) ピン状ワイヤ等の形成方法
US5981371A (en) Bump forming method
JPS5889833A (ja) ワイヤボンデイング方法
US5024367A (en) Wire bonding method
JP3128718B2 (ja) ワイヤボンデイング方法
JP3455126B2 (ja) ワイヤボンデイング方法
JP2531434B2 (ja) ワイヤボンディング装置および方法
JP2978852B2 (ja) 半導体装置のワイヤボンディング接続方法
JP3381910B2 (ja) ワイヤボンディング装置
JP2976645B2 (ja) バンプ形成方法
JP2000106381A (ja) 半導体装置の製造方法
JPS5925377B2 (ja) ワイヤボンデイング方法
JP3457196B2 (ja) ボールボンディング方法
JP2894344B1 (ja) ワイヤボンディング方法
JP3346192B2 (ja) バンプの形成方法
JPS61105850A (ja) ワイヤボンデイング方法
JPS6366423B2 (enrdf_load_stackoverflow)
JPS62264634A (ja) 圧着用キヤピラリ−チツプ
JP2574054B2 (ja) ワイヤボンダ及びワイヤボンディング方法
JPH07263477A (ja) 被覆ボンディング細線接合用キャピラリー
JPH11168119A (ja) ワイヤボンディング方法とそれに用いる押圧ツール
JPH0341981B2 (enrdf_load_stackoverflow)
JPS5623750A (en) Ultrasonic wire bonding apparatus