JPS5887812A - 導電性物体と絶縁性物体とを結合するボンディング方法 - Google Patents

導電性物体と絶縁性物体とを結合するボンディング方法

Info

Publication number
JPS5887812A
JPS5887812A JP57195845A JP19584582A JPS5887812A JP S5887812 A JPS5887812 A JP S5887812A JP 57195845 A JP57195845 A JP 57195845A JP 19584582 A JP19584582 A JP 19584582A JP S5887812 A JPS5887812 A JP S5887812A
Authority
JP
Japan
Prior art keywords
potential
metal
conductive
bonding
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57195845A
Other languages
English (en)
Japanese (ja)
Other versions
JPH046888B2 (cg-RX-API-DMAC7.html
Inventor
ドナルド・オラ・メイア−ズ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JPS5887812A publication Critical patent/JPS5887812A/ja
Publication of JPH046888B2 publication Critical patent/JPH046888B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP57195845A 1981-11-09 1982-11-08 導電性物体と絶縁性物体とを結合するボンディング方法 Granted JPS5887812A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/319,860 US4384899A (en) 1981-11-09 1981-11-09 Bonding method adaptable for manufacturing capacitive pressure sensing elements
US319860 1981-11-09

Publications (2)

Publication Number Publication Date
JPS5887812A true JPS5887812A (ja) 1983-05-25
JPH046888B2 JPH046888B2 (cg-RX-API-DMAC7.html) 1992-02-07

Family

ID=23243918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57195845A Granted JPS5887812A (ja) 1981-11-09 1982-11-08 導電性物体と絶縁性物体とを結合するボンディング方法

Country Status (2)

Country Link
US (1) US4384899A (cg-RX-API-DMAC7.html)
JP (1) JPS5887812A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133463A (ja) * 2001-10-30 2003-05-09 Kyocera Corp 圧力検出装置用パッケージ
JP2003156400A (ja) * 2001-11-21 2003-05-30 Kyocera Corp 圧力検出装置用パッケージ

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JPS6189643A (ja) * 1984-10-09 1986-05-07 Toshiba Corp 半導体装置及びその製造方法
FI75426C (fi) * 1984-10-11 1988-06-09 Vaisala Oy Absoluttryckgivare.
US4617606A (en) * 1985-01-31 1986-10-14 Motorola, Inc. Capacitive pressure transducer
US4746893A (en) * 1985-01-31 1988-05-24 Motorola, Inc. Pressure transducer with sealed conductors
US4744863A (en) * 1985-04-26 1988-05-17 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4853669A (en) * 1985-04-26 1989-08-01 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
US4639631A (en) * 1985-07-01 1987-01-27 Motorola, Inc. Electrostatically sealed piezoelectric device
US4872945A (en) * 1986-06-25 1989-10-10 Motorola Inc. Post seal etching of transducer diaphragm
US4772523A (en) * 1987-03-13 1988-09-20 Motorola, Inc. Stress relief substrate metallization
USH606H (en) 1987-11-27 1989-03-07 Motorola, Inc. Pressure sensor assembly
US4807477A (en) * 1988-02-01 1989-02-28 Motorola, Inc. Capacitive temperature compensation for a pressure sensor
US5160560A (en) * 1988-06-02 1992-11-03 Hughes Aircraft Company Method of producing optically flat surfaces on processed silicon wafers
DE3943859B4 (de) * 1988-06-08 2005-04-21 Denso Corp., Kariya Verfahren zur Herstellung eines Halbleiterdrucksensors
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
JP2527834B2 (ja) * 1990-07-20 1996-08-28 三菱電機株式会社 陽極接合法
US6113218A (en) * 1990-09-21 2000-09-05 Seiko Epson Corporation Ink-jet recording apparatus and method for producing the head thereof
US5912684A (en) * 1990-09-21 1999-06-15 Seiko Epson Corporation Inkjet recording apparatus
US6164759A (en) * 1990-09-21 2000-12-26 Seiko Epson Corporation Method for producing an electrostatic actuator and an inkjet head using it
US6168263B1 (en) 1990-09-21 2001-01-02 Seiko Epson Corporation Ink jet recording apparatus
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US6314823B1 (en) * 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
US5365790A (en) * 1992-04-02 1994-11-22 Motorola, Inc. Device with bonded conductive and insulating substrates and method therefore
JPH0671882A (ja) * 1992-06-05 1994-03-15 Seiko Epson Corp インクジェットヘッド及びその製造方法
IL106790A (en) * 1992-09-01 1996-08-04 Rosemount Inc A capacitive pressure sensation consisting of the bracket and the process of creating it
JP3300060B2 (ja) * 1992-10-22 2002-07-08 キヤノン株式会社 加速度センサー及びその製造方法
US6282956B1 (en) 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor
DE4311762C2 (de) * 1993-04-08 1995-02-02 Josef Dr Kemmer Verfahren zur Verbindung elektrischer Kontaktstellen
DE4325140C2 (de) * 1993-07-27 2002-09-26 Karl Suss Dresden Gmbh Elektrode zum anodischen Bonden
US5744725A (en) * 1994-04-18 1998-04-28 Motorola Inc. Capacitive pressure sensor and method of fabricating same
DE4426288C2 (de) * 1994-07-26 2003-05-28 Suss Microtec Test Sys Gmbh Elektrode zum anodischen Bonden
KR0179784B1 (ko) * 1995-12-19 1999-04-15 문정환 반도체 웨이퍼 세정장치
US5917264A (en) * 1996-09-05 1999-06-29 Nagano Keiki Co Ltd Electrostatic capacitance type transducer and method for producing the same
US5920013A (en) * 1997-02-07 1999-07-06 Ford Motor Company Silicon micromachine with sacrificial pedestal
US6232150B1 (en) 1998-12-03 2001-05-15 The Regents Of The University Of Michigan Process for making microstructures and microstructures made thereby
IT1308402B1 (it) * 1999-03-03 2001-12-17 Cselt Centro Studi Lab Telecom Procedimento e dispositivo per accoppiare fibre ottiche e componentioptoelettronici.
US6583631B2 (en) * 2001-01-12 2003-06-24 Kavlico Corporation Precise dielectric constant sensor
US7204737B2 (en) * 2004-09-23 2007-04-17 Temic Automotive Of North America, Inc. Hermetically sealed microdevice with getter shield
US20070090479A1 (en) * 2005-10-20 2007-04-26 Chien-Hua Chen Controlling bond fronts in wafer-scale packaging
US7851246B2 (en) * 2007-12-27 2010-12-14 Stats Chippac, Ltd. Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3417361A (en) * 1966-03-07 1968-12-17 Conrac Corp Semiconductive pressure transducer
US3328653A (en) * 1966-09-22 1967-06-27 Budd Co Thin film pressure transducer
US3634727A (en) * 1968-12-03 1972-01-11 Bendix Corp Capacitance-type pressure transducer
US3697917A (en) * 1971-08-02 1972-10-10 Gen Electric Semiconductor strain gage pressure transducer
US3858097A (en) * 1973-12-26 1974-12-31 Bendix Corp Pressure-sensing capacitor
US4025942A (en) * 1974-03-18 1977-05-24 Kulite Semiconductor Products, Inc. Low pressure transducers employing large silicon diaphragms having non-critical electrical properties
US3993939A (en) * 1975-01-07 1976-11-23 The Bendix Corporation Pressure variable capacitor
US4083710A (en) * 1977-01-21 1978-04-11 Rca Corporation Method of forming a metal pattern on an insulating substrate
US4225632A (en) * 1977-11-11 1980-09-30 Motorola, Inc. Fabrication of capacitive transducers
US4261086A (en) * 1979-09-04 1981-04-14 Ford Motor Company Method for manufacturing variable capacitance pressure transducers
US4277814A (en) * 1979-09-04 1981-07-07 Ford Motor Company Semiconductor variable capacitance pressure transducer assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133463A (ja) * 2001-10-30 2003-05-09 Kyocera Corp 圧力検出装置用パッケージ
JP2003156400A (ja) * 2001-11-21 2003-05-30 Kyocera Corp 圧力検出装置用パッケージ

Also Published As

Publication number Publication date
JPH046888B2 (cg-RX-API-DMAC7.html) 1992-02-07
US4384899A (en) 1983-05-24

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