JPH046888B2 - - Google Patents
Info
- Publication number
- JPH046888B2 JPH046888B2 JP57195845A JP19584582A JPH046888B2 JP H046888 B2 JPH046888 B2 JP H046888B2 JP 57195845 A JP57195845 A JP 57195845A JP 19584582 A JP19584582 A JP 19584582A JP H046888 B2 JPH046888 B2 JP H046888B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- potential
- conductive
- metal
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 122
- 229910052751 metal Inorganic materials 0.000 claims description 122
- 238000000034 method Methods 0.000 claims description 70
- 239000004065 semiconductor Substances 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 32
- 239000003989 dielectric material Substances 0.000 claims description 31
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 58
- 239000000758 substrate Substances 0.000 description 30
- 238000001465 metallisation Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 15
- 239000000523 sample Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 229910001415 sodium ion Inorganic materials 0.000 description 6
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000006023 eutectic alloy Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/319,860 US4384899A (en) | 1981-11-09 | 1981-11-09 | Bonding method adaptable for manufacturing capacitive pressure sensing elements |
| US319860 | 1981-11-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5887812A JPS5887812A (ja) | 1983-05-25 |
| JPH046888B2 true JPH046888B2 (cg-RX-API-DMAC7.html) | 1992-02-07 |
Family
ID=23243918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57195845A Granted JPS5887812A (ja) | 1981-11-09 | 1982-11-08 | 導電性物体と絶縁性物体とを結合するボンディング方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4384899A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS5887812A (cg-RX-API-DMAC7.html) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189643A (ja) * | 1984-10-09 | 1986-05-07 | Toshiba Corp | 半導体装置及びその製造方法 |
| FI75426C (fi) * | 1984-10-11 | 1988-06-09 | Vaisala Oy | Absoluttryckgivare. |
| US4617606A (en) * | 1985-01-31 | 1986-10-14 | Motorola, Inc. | Capacitive pressure transducer |
| US4746893A (en) * | 1985-01-31 | 1988-05-24 | Motorola, Inc. | Pressure transducer with sealed conductors |
| US4744863A (en) * | 1985-04-26 | 1988-05-17 | Wisconsin Alumni Research Foundation | Sealed cavity semiconductor pressure transducers and method of producing the same |
| US4853669A (en) * | 1985-04-26 | 1989-08-01 | Wisconsin Alumni Research Foundation | Sealed cavity semiconductor pressure transducers and method of producing the same |
| US4639631A (en) * | 1985-07-01 | 1987-01-27 | Motorola, Inc. | Electrostatically sealed piezoelectric device |
| US4872945A (en) * | 1986-06-25 | 1989-10-10 | Motorola Inc. | Post seal etching of transducer diaphragm |
| US4772523A (en) * | 1987-03-13 | 1988-09-20 | Motorola, Inc. | Stress relief substrate metallization |
| USH606H (en) | 1987-11-27 | 1989-03-07 | Motorola, Inc. | Pressure sensor assembly |
| US4807477A (en) * | 1988-02-01 | 1989-02-28 | Motorola, Inc. | Capacitive temperature compensation for a pressure sensor |
| US5160560A (en) * | 1988-06-02 | 1992-11-03 | Hughes Aircraft Company | Method of producing optically flat surfaces on processed silicon wafers |
| DE3943859B4 (de) * | 1988-06-08 | 2005-04-21 | Denso Corp., Kariya | Verfahren zur Herstellung eines Halbleiterdrucksensors |
| US4996627A (en) * | 1989-01-30 | 1991-02-26 | Dresser Industries, Inc. | High sensitivity miniature pressure transducer |
| JP2527834B2 (ja) * | 1990-07-20 | 1996-08-28 | 三菱電機株式会社 | 陽極接合法 |
| US6113218A (en) * | 1990-09-21 | 2000-09-05 | Seiko Epson Corporation | Ink-jet recording apparatus and method for producing the head thereof |
| US5912684A (en) * | 1990-09-21 | 1999-06-15 | Seiko Epson Corporation | Inkjet recording apparatus |
| US6164759A (en) * | 1990-09-21 | 2000-12-26 | Seiko Epson Corporation | Method for producing an electrostatic actuator and an inkjet head using it |
| US6168263B1 (en) | 1990-09-21 | 2001-01-02 | Seiko Epson Corporation | Ink jet recording apparatus |
| US5421213A (en) * | 1990-10-12 | 1995-06-06 | Okada; Kazuhiro | Multi-dimensional force detector |
| US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
| US5365790A (en) * | 1992-04-02 | 1994-11-22 | Motorola, Inc. | Device with bonded conductive and insulating substrates and method therefore |
| JPH0671882A (ja) * | 1992-06-05 | 1994-03-15 | Seiko Epson Corp | インクジェットヘッド及びその製造方法 |
| IL106790A (en) * | 1992-09-01 | 1996-08-04 | Rosemount Inc | A capacitive pressure sensation consisting of the bracket and the process of creating it |
| JP3300060B2 (ja) * | 1992-10-22 | 2002-07-08 | キヤノン株式会社 | 加速度センサー及びその製造方法 |
| US6282956B1 (en) | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
| DE4311762C2 (de) * | 1993-04-08 | 1995-02-02 | Josef Dr Kemmer | Verfahren zur Verbindung elektrischer Kontaktstellen |
| DE4325140C2 (de) * | 1993-07-27 | 2002-09-26 | Karl Suss Dresden Gmbh | Elektrode zum anodischen Bonden |
| US5744725A (en) * | 1994-04-18 | 1998-04-28 | Motorola Inc. | Capacitive pressure sensor and method of fabricating same |
| DE4426288C2 (de) * | 1994-07-26 | 2003-05-28 | Suss Microtec Test Sys Gmbh | Elektrode zum anodischen Bonden |
| KR0179784B1 (ko) * | 1995-12-19 | 1999-04-15 | 문정환 | 반도체 웨이퍼 세정장치 |
| US5917264A (en) * | 1996-09-05 | 1999-06-29 | Nagano Keiki Co Ltd | Electrostatic capacitance type transducer and method for producing the same |
| US5920013A (en) * | 1997-02-07 | 1999-07-06 | Ford Motor Company | Silicon micromachine with sacrificial pedestal |
| US6232150B1 (en) | 1998-12-03 | 2001-05-15 | The Regents Of The University Of Michigan | Process for making microstructures and microstructures made thereby |
| IT1308402B1 (it) * | 1999-03-03 | 2001-12-17 | Cselt Centro Studi Lab Telecom | Procedimento e dispositivo per accoppiare fibre ottiche e componentioptoelettronici. |
| US6583631B2 (en) * | 2001-01-12 | 2003-06-24 | Kavlico Corporation | Precise dielectric constant sensor |
| JP3878836B2 (ja) * | 2001-10-30 | 2007-02-07 | 京セラ株式会社 | 圧力検出装置用パッケージ |
| JP4223709B2 (ja) * | 2001-11-21 | 2009-02-12 | 京セラ株式会社 | 圧力検出装置用パッケージの製造方法 |
| US7204737B2 (en) * | 2004-09-23 | 2007-04-17 | Temic Automotive Of North America, Inc. | Hermetically sealed microdevice with getter shield |
| US20070090479A1 (en) * | 2005-10-20 | 2007-04-26 | Chien-Hua Chen | Controlling bond fronts in wafer-scale packaging |
| US7851246B2 (en) * | 2007-12-27 | 2010-12-14 | Stats Chippac, Ltd. | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1138401A (en) * | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
| US3417361A (en) * | 1966-03-07 | 1968-12-17 | Conrac Corp | Semiconductive pressure transducer |
| US3328653A (en) * | 1966-09-22 | 1967-06-27 | Budd Co | Thin film pressure transducer |
| US3634727A (en) * | 1968-12-03 | 1972-01-11 | Bendix Corp | Capacitance-type pressure transducer |
| US3697917A (en) * | 1971-08-02 | 1972-10-10 | Gen Electric | Semiconductor strain gage pressure transducer |
| US3858097A (en) * | 1973-12-26 | 1974-12-31 | Bendix Corp | Pressure-sensing capacitor |
| US4025942A (en) * | 1974-03-18 | 1977-05-24 | Kulite Semiconductor Products, Inc. | Low pressure transducers employing large silicon diaphragms having non-critical electrical properties |
| US3993939A (en) * | 1975-01-07 | 1976-11-23 | The Bendix Corporation | Pressure variable capacitor |
| US4083710A (en) * | 1977-01-21 | 1978-04-11 | Rca Corporation | Method of forming a metal pattern on an insulating substrate |
| US4225632A (en) * | 1977-11-11 | 1980-09-30 | Motorola, Inc. | Fabrication of capacitive transducers |
| US4261086A (en) * | 1979-09-04 | 1981-04-14 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
| US4277814A (en) * | 1979-09-04 | 1981-07-07 | Ford Motor Company | Semiconductor variable capacitance pressure transducer assembly |
-
1981
- 1981-11-09 US US06/319,860 patent/US4384899A/en not_active Expired - Lifetime
-
1982
- 1982-11-08 JP JP57195845A patent/JPS5887812A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4384899A (en) | 1983-05-24 |
| JPS5887812A (ja) | 1983-05-25 |
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