JPS5885608A - Manufacture of ceramic element - Google Patents

Abstract

PURPOSE:To short-circuit electrodes of the surface and the reverse side of a thin plate-like ceramic element with very good productivity, by piercing said element provided with the electrodes on the front and rear surfaces, and conducting a part of the electrodes on the front and rear surfaces. CONSTITUTION:On a thin plate-like ceramic element 1, a surface electrode 5, a signal fetching electrode 2 and a reverse side electrode 3 are provided by a conventional means, and after baking, on the part of the signal fetching electrode 2, a hole 6 is made by a laser light. In this case, a part of the electrodes 5, 3 of the front and rear surfaces of the thin plate-like ceramic element 1 evaporates, a part of the electrodes 5, 3, which has evaporated is deposited onto the inside surface of the pierced hole 6, and the electrode 5 and the electrode 3 conduct electrically. When a lead wire is attached to the surface electrode 5 and the signal fetching electrode 2 of the ceramic element 1 generated in this way, a signal can be fetched from both faces of ceramics. Thus, it is possible to short-circuit the electrodes of the front and rear surfaces of the thin plate-like ceramic element, with very good productivity.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a ceramic element that allows easy short-circuiting of a portion of the electrodes on the front and back surfaces of the ceramic thin plate element.

Conventionally, ceramic thin plate elements used as signal pickup elements, etc. are often used by pasting them onto objects, and as shown in Figure 1, a soldering plate is attached to one side of the ceramic thin plate element 1 for signal extraction. Attach the folded electrode 2,
In order to establish conduction with the back electrode 3, the signal extraction electrode 2
is short-circuited to the back electrode 3 at the short-circuit electrode 4. 6 is a surface electrode.

In order to actually produce such a ceramic element, first, the surface electrode 6 and the signal extraction electrode 2 are screen printed, and after drying, the surface electrode 3 is printed, and after drying, the shorting electrode 4 is printed with a brush or the like. was granted. For this reason, productivity was poor and required five steps.

The manufacturing method of the present invention eliminates these conventional drawbacks and aims to achieve the original purpose without requiring the provision of short-circuiting electrodes as in the conventional method.

That is, the present invention will be described with reference to FIGS. 2 and 3, in which the same numbers are given to the same parts as above, and the front surface electrode 6, the signal extraction electrode 2, and the back surface are formed on the ceramic thin plate element 1 by the usual method. After applying the mold F@3 and baking it, a hole 6 is made in the part of the signal extraction electrode 2 using a laser beam.

At this time, a portion of the ceramic thin plate element 1 and the electrodes 2.3 on the front and back surfaces evaporate, and the evaporated portion of the electrode 2.3 adheres to the inner surface of the hole 6 through which the electrode 2 and the electrode 2.3 are attached. 3 and will be electrically connected. Surface electrode 5 and signal extraction electrode 2 of the ceramic element thus created
By attaching lead wires to the ceramic, it becomes possible to extract signals from both sides of the ceramic.

Next, a thin plate sintered body of PZT piezoelectric material (30φxo, 1s
Baked silver electrodes were provided in the shape shown in the figure by screen printing using ts). Baking thickness is 10μ per side
It is. Next, after baking at 700° C., holes with a diameter of 100 μm were made using a laser beam. The second part of this ceramic element
The resistance between electrode 2 and electrode 3 in FIGS. 3 and 3 was Ω. When the device according to this example was subjected to the same sensitivity test as the conventional device, no difference was found.

Further, the electrode of the present invention can be formed by a plating method, a vacuum evaporation method, etc. other than baked silver. The thickness of the ceramic thin plate element depends on the diameter of the hole, but unless it is 15 m1 or less, the resistance value of short circuit will be large.

According to the manufacturing method of the present invention, it is possible to short-circuit the electrodes on the front and back surfaces of the ceramic thin plate element with very good productivity, which is of great industrial value.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a ceramic element made by the conventional method;
The figure is a top view of a ceramic element according to the method of the present invention, and FIG. 3 is a sectional view taken along the line A' in FIG. 1... Ceramic thin plate element, 2...
Signal extraction electrode, 3... Back electrode, 6...
...Surface electrode, 6...hole. Name of agent: Patent attorney Toshio Nakao and one other person Figure 1 Figure 3 J ( Figure [□□-!

Claims (1)

[Claims] A laser beam is used to penetrate a hole w, m in a part of a thin ceramic element having electrodes provided on the front and back surfaces. A method of manufacturing a ceramic element in which conduction is established between some electrodes on the back side.