JPS592303A - Method of producing angular chip resistor - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method of manufacturing a rectangular chip resistor, and particularly to a method of manufacturing a rectangular chip resistor that is easy to connect.

B) Prior art and problems A conventional method for manufacturing a square chip resistor will be explained with reference to FIG.

FIG. 1 is a perspective view of a conventional thin film rectangular chip resistor. In the figure, 1 is a ceramic substrate, 2 is a resistive film, and a and 3' are external connection electrodes.

There are two types of film forming methods for square chip resistors: thick film and thin film, and each type is used depending on the purpose of use.

In general, a method for manufacturing a square chip resistor involves forming two resistor films and a conductor film on a ceramic substrate 1 or the like by printing, vapor deposition, sputtering, or the like, and then cutting the film. Thick film (printing)
In the case of a rectangular chip resistor, the 9 external electrodes, including the top (resistive surface) and bottom surface, are connected in the same manner as a ceramic chip capacitor, in order to facilitate connection during mounting and to obtain connection reliability. It is provided depending on the firing method, etc.

However, in the case of a rectangular chip resistor made of a thin film, providing the connection electrode 3-' on the cut surface and the bottom surface after cutting increases manufacturing man-hours and costs, so the connection electrode is only placed on the resistance surface. What is provided is being used.

In the rectangular chip resistor formed as shown in FIG.
It is difficult to obtain reliable connections. Therefore, it is difficult to obtain reliable connections using conventional manufacturing methods. Currently, the amount of use is small due to lack of performance.

(e) Purpose of the Invention The present invention provides a method for manufacturing a rectangular chip resistor that can manufacture rectangular chip resistors that are easy to connect at a low cost and eliminates the drawbacks of the conventional method for manufacturing a rectangular chip resistor. The purpose is to

(d) Structure of the Invention In order to achieve the above object, the present invention includes providing a hole penetrating from the front surface to the back surface of the substrate at the electrode formation position on the surface of the substrate where the resistive film and the electrode are formed. The resistive film and the electrode are formed on the front surface of the substrate, and the electrode is formed in the L that surrounds the hole on the back surface of the substrate.

(e) Embodiments of the Invention Hereinafter, the method for manufacturing a rectangular chip resistor according to the present invention will be explained in detail with reference to FIGS. 2 to 5.

FIGS. 2 to 4 are explanatory diagrams of a method for manufacturing a rectangular chip resistor according to the present invention. In the figure, 4 is a ceramic substrate;
5 is a through hole, 5 is a shorting conductor, 6 is a resistive film, 7 is an external connection electrode, and 8 is a connection electrode on the back side.

First, as shown in FIG. 2, a through hole 5 is provided through the ceramic substrate 4 at a position where the external connection electrode 7 will be formed after the resistive film 6 is formed. A film is sequentially formed by a method such as vapor deposition or sputtering. Furthermore,
An electrode 8 is formed on the opposite side of FIG. 2, that is, at a position opposite to the electrode 7 as shown in FIG. 3, by the same method as described above.

Then, by cutting along lines AA' and B-B shown in Figure M3, the square chip resistor shown in Figure 4 is completed. At this time, the cutting A-A is performed so as to pass approximately through the center of the through hole 5. In this way, the electrodes 7 and 8 can be connected to the through hole 5.
Conductivity is maintained by 5 formed on the side surfaces of the film from the upper and lower surfaces, and solder is applied to 8 and 5' during mounting, so that the deposit can be handled using a connection method no different from the conventional method. FIG. 5 shows a cross section of the square chip resistor shown in FIG. 4.

As described above, the present invention can provide a method for manufacturing a rectangular chip resistor that can be easily soldered by a method similar to the conventional method.

(f) Effects of the Invention As detailed above, according to the method for manufacturing a prismatic chip resistor of the present invention, conduction can be maintained between the electrode portions on the top and bottom surfaces of the prismatic chip resistor. This has the effect of making it easier to connect and improving the reliability of the connection.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional thin film rectangular chip resistor, FIGS. 2 to 4 are explanatory diagrams of the method of manufacturing the rectangular chip resistor of the present invention, and FIG. be. In the figure, 1.4 is a ceramic substrate, 2.6 is a resistor 4-5 is a shorting conductor. Bamboo 1 Ron No. 20 Senior 3 times Φ No. 40 Stalk 5 times

Claims (1)

[Claims] After providing a hole penetrating from the front surface to the back surface of the substrate at the electrode formation position on the surface of the substrate where the resistive film and the electrode are formed,
A method of manufacturing a rectangular chip resistor, comprising forming the resistive film and the electrode on the front surface of the substrate, and forming an electrode so as to surround a hole on the back surface of the substrate.