JPS58182202A - Method of producing thermistor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a thermistor that is easy to work with and provides a thermistor with excellent responsiveness at a low cost.

In the conventional manufacturing of thin film thermistors, when a thin film thermistor layer is deposited on a ceramic plate on which many electrodes are printed, a mask is used on the part that will become the lead electrode of each electrode, and the thermistor layer is not deposited. That's what I do. The thus formed product was then cut into individual chips.

In products manufactured in this manner, the dimensional accuracy of the electrodes has a large effect on variations in the characteristics of the product. Furthermore, since a mask is used during vapor deposition of the thermistor layer, workability during production is also poor.

The present invention proposes a method for manufacturing a thermistor that eliminates the above-mentioned conventional drawbacks, and one embodiment thereof will be described below with reference to FIGS. 1 to 7.

First, in the figure, 1 is a ceramic substrate such as an alumina plate having excellent thermal conductivity, and as shown in FIG. 1, a large number of holes 2 are formed in an array. An electrode material is printed on one side of the substrate 1, and at this time, the electrode material flows into the hole 2 so that the electrode material completely fills the hole 2. This state is shown in FIG. 2, in which - the conductive portion 3 provided on one side of the substrate 1 reaches into the hole 2; Next, the above board 1
The same electrode material as above is printed on the other side to form the conductive part 4 as shown in FIG. As a result, the conductive portion 3.4 becomes completely electrically conductive through the numerous holes 2. Next, as shown in FIG. 4, a thin film thermistor layer 5 is formed by depositing a material having thermistor characteristics on the conductive portion 3-hi on one side of the substrate 1, and further on the ``y'' of the thermistor layer 5. The same or different electrode material as described above is printed or deposited to form the conductive portion 6 as shown in FIG.

Thereafter, the conductive parts 3.4 are electrically connected through a large number of holes 2, and as shown in FIG. Cut into a conductive shape. The thermistor is manufactured in this way, and FIG. 7 shows the thermistor in a single-chip state.

As a result of this manufacturing process, for example, an alumina plate used as a ceramic substrate is thin and has excellent thermal conductivity, so that it has excellent responsiveness. Furthermore, since a mask is not used as in the conventional method, there is no positioning work, which improves the work efficiency.

As described above, according to the manufacturing method of the present invention, since a thin film thermistor layer is not formed on a ceramic substrate with excellent thermal conductivity, high quality and excellent assembly workability can be achieved at low cost. It has practical value in that it can be manufactured and manufactured using the following methods.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a ceramic substrate for detailed explanation of the present invention, FIGS. 2 to 6 are cross-sectional views showing the same manufacturing process, and FIG. 6 is a perspective view showing the cutting process. , FIG. 7 is a perspective view showing the thermistor cut into one chip. 1... Ceramic board, 2... Hole, 3
・4...First and second conductive parts, 5o...Thin film thermistor layer, 6...Third conductive part. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 6 Figure 7

Claims (1)

[Claims] First and second conductive parts are provided by printing through the holes on both sides of a ceramic substrate having a plurality of holes with excellent thermal conductivity, and a material having thermistor characteristics is evaporated onto the conductive part on one side of the ceramic substrate. A thin film thermistor layer is formed by forming a thin film thermistor layer, a third conductive part is provided by depositing or printing a conductive material on the thin film thermistor layer, and then a number of holes are used to connect the first and second conductive parts to each other. A method of manufacturing a thermistor, which is characterized by cutting a thermistor into a shape that is conductive through one hole.