JPS62254403A - Manufacture of chip device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to heat-generating chip-like elements such as positive temperature coefficient thermistors (
The present invention relates to methods of manufacturing PTC), negative characteristic thermistors (NTC), CTRs, varistors, and the like.

[Prior art]

Due to the miniaturization of circuit elements, various elements are becoming chips. For example, when talking about current limiting PTC used for circuit protection, when conventional flat PTC is attached to a printed circuit board etc., the thickness of the PTC electrode is Since the thickness is only μm, there are variations when they are tightly fixed, and furthermore, because the thermal insulation interval is small, the heat dissipation characteristics vary widely, making circuit protection unstable and making it difficult to set the protection current.

[Problem that the invention seeks to solve]

The present invention provides an element having a shape that allows accurate setting of circuit protection current by providing a preset thermal insulation interval between the mounting surface of a printed circuit board, etc., and facilitates mounting work of the chip element on the board. This relates to a manufacturing method that allows for mass production.

[Means for solving problems]

The first method of the present invention is to create a shape as shown in FIG.
A notch 3.3 is provided in a part of the protrusions 2, 2 at one end of the front side and the other end of the back side, and this is partially press-molded with the element body. This is made into fired porcelain, a thin film electrode is formed on the entire outer surface of the element, and the upper and lower surfaces of the element and surfaces orthogonal to the protrusions are ground to remove the electrode thin film on the surface to produce a chip-shaped element. It is.

The second method of the present invention has a shape as shown in FIG.
The projecting portion 2 at one end of the front side and the other end of the back side is provided with notches 3, 3 facing left and right outward at equal intervals, and a portion of this is press-molded with the element body. A thin film electrode was formed on the entire outer surface of the element, and the upper and lower surfaces of the element were ground to remove the electrode thin film on the coughing surface, so that the notches provided on the front and back protrusions occupied the center position. A large number of chip elements having the same shape can be manufactured by cutting parallel to the .

[Effect]

A chip-like element having the shape shown in Fig. 1 is formed by press molding a part of the element body, and is fired, and a thin film electrode is formed on the entire surface, and the electrode is perpendicular to the upper and lower surfaces of the element and the protrusions. The electrode thin film is removed by grinding the surface to be removed, and the upper and lower surfaces and the surface orthogonal to the protrusion can be made parallel, and a product with a uniform shape can be manufactured, making mounting work easier.

Furthermore, in the second method of the present invention, chip elements of the same shape can be produced in large quantities by just a cutting operation, and there is little waste of material.

〔Example〕

The first method of the present invention is to create a shape as shown in FIG.
The protrusion 2 at one end of the front side and the protrusion 2 at the other end of the back side are provided with notches 3, 3 facing left and right outward, and are partially pressed with the element body. This is molded and fired into porcelain, and a thin film electrode is formed on the entire outer surface of the element by means such as Ni electroless plating, Ni electroless + electroplating, Ni electroless + Ag baking plating, sputtering, thermal spraying, etc. , the upper and lower surfaces of the element and the surfaces perpendicular to the protrusions are ground using a surface grinder or a flat ramp machine to remove unnecessary electrode thin films, and the upper and lower surfaces and surfaces perpendicular to the protrusions are made parallel and flat. Ru.

The second method of the present invention has a shape as shown in FIG.
The protrusion 2 on one end of the front side and the protrusion 2 on the other end of the back side are provided with notches 3, 3 facing left and right outward at equal intervals, and are partially pressed with the element body. This is molded and fired to make porcelain, and this element is coated with Ni electroless, Ni
A thin film electrode is formed on the entire outer surface of the element by means such as electroless electroplating, old-style electrolytic + baking plating, sputtering, and thermal spraying, and the upper and lower surfaces of the element are ground with a surface grinder or surface lapping machine to remove unnecessary materials. While removing the electrode thin film, the upper and lower surfaces are made parallel and flat, and cut in parallel so that the notches 3 provided on each of the front and back protrusions 2 occupy the center position.

In this way, a large number of chip elements having the same shape are manufactured. In this case, the surface grinding and cutting operations may be performed in the reverse order.

In addition, if the pitch of the notches provided at equal intervals on the front side protrusion and the back side protrusion is shifted appropriately, many of the notches are provided at the end of the protrusion 2 as shown in Fig. 2. It will be manufactured.

〔Effect of the invention〕

As described above, it is possible to inexpensively mass-produce chip elements in which the public insulation interval and the degree of electrical insulation are optimally set in heat-generating elements.

Furthermore, in order to facilitate the work of attaching the chip element to a printed circuit board or the like, it is possible to manufacture a device with a well-balanced ff1llft so that the element can be mounted on either the upper or lower surface.

[Brief explanation of drawings]

1 to 3 show embodiments of the present invention, FIG. 1 is a perspective view of a chip-like element manufactured by the first method of the present invention, and FIG. 2 is a plan view showing a modification of FIG. 1. , FIG. 3 is a schematic diagram illustrating the second method of the present invention. 1... Flat plate-shaped body, 2... Projection, 3... Notch.

Claims (2)

[Claims] (1) Protrusions are formed symmetrically on the front and back left and right ends of the flat plate-like body, and a notch facing left and right outward is provided in a part of the protrusion at one end on the front side and the other end on the back side, This is integrally press-molded with the element body, which is made into fired porcelain.A thin film electrode is formed on the entire outer surface of the element, and the upper and lower surfaces of the element and the surface orthogonal to the protrusion are ground to remove the electrode thin film on the surface. A method for manufacturing a chip-like element, characterized by removing the element. (2) Protrusions are formed symmetrically on the left and right ends of the front and back of the flat plate-like body, and cutouts facing outward to the left and right are provided at equal intervals in the protrusions at one end on the front side and the other end on the back side, This is integrally press-molded with the element body, which is then fired into porcelain.A thin film electrode is formed on the entire outer surface of the element, and the upper and lower surfaces of the element are ground to remove the electrode thin film on these surfaces. A method for producing a chip-like element, characterized in that cutting is carried out in parallel so that the notch provided in the part occupies the center position.