JPS5885600A - Device for placing chip part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip component mounting device for mounting an electronic component formed in the shape of a chip (chip component) onto a circuit pattern formed on a substrate such as a ceramic printed wiring board. be.

For example, when chip components are mounted on a circuit pattern formed on a substrate such as a ceramic printed wiring board, conventionally (υ) A method of mounting one piece at a time onto the board using a big-and-place unit.

(2) Equipped with the same number of magazines as the number of chip components mounted on one board, and placing these magazines in the same state as the mounting pattern, taking out the components from each magazine at the same time, and removing the required number of chip components at once. A method of mounting the on the board.

etc. have been put into practical use.

However, in the method (1) above, one cycle of the pick-and-place unit consists of 6 operations (lowering-ascending-forward-moving-descending-ascending-retreating), resulting in two operations: holding and releasing the chip component.
Eight operations, including the above, must be performed in a precise order, and there is a limit to how quickly the operation time can be reduced. Furthermore, the time required to hold or release chip components using a shelf using a vacuum chuck for holding chip components and the vacuum chuck cannot be ignored. Therefore, there is a drawback that the number of man-hours required to mount the necessary number of chip components on one board increases. On the other hand, according to the method (2) above, a large number of chip components can be
Regardless of the number of chip components, they can be mounted on the board at once, and the time for mounting chip components can be significantly shortened. However, the present invention has the disadvantage that it is unsuitable for high-mix, small-scale production because it is necessary to replace the magazine arrangement and chip component chucks every time the pattern formed on the substrate changes. It is an object of the present invention to provide a chip component mounting device that eliminates the drawbacks of the prior art described above, can be easily applied to high-mix, low-volume production, and can mount chip components on a board at high speed.

In order to achieve the above object, the present invention temporarily holds a nap part on a perforated tape and mounts it on a board. holes are formed at a predetermined interval, and two adhesive tags are stretched along the tape longitudinal direction, protrude from both sides of the holes, and temporarily hold the chip component in the hole with adhesive. A tape holding the tape is moved intermittently at predetermined intervals along a predetermined path, and chip components are arranged in a regular order toward the tape from a plurality of component supply means arranged along the tape movement path. At the same time, position the board below the movement path of the chip part held by the tape, and lower the tape to bring the chip part into contact with the board. An embodiment of the present invention will be described below with reference to the drawings.

Figures 1 to 19 show an embodiment of the present invention. In these figures, 1 is a chip component, 2 is a substrate, and the surface (chip component mounting diagram) is coated with flux (or solder paste). , 4-electrical adhesive, thermosetting adhesive, etc.) is applied. 4 is a tape wound around a reel 14, and as shown in FIGS. 4 to 6, feeding holes 5 are formed at predetermined intervals on the side, and
A hole 6 for accommodating the chip component 1 is formed at the same pitch as the feeding hole 5, and on one side of the hole 6 is an adhesive tape 7 with an adhesive tape slanted as shown in FIG. and 7' are pasted in parallel at a predetermined distance from the center of the chip component 1 in the longitudinal direction. In other words, these two adhesive tapes 7°7
Approximately half of the adhesive surface of ' is protruding into the hole B so that the chip component 1 can be pasted thereon.

As shown in FIGS. 1 and 2, the one-chip component mounting apparatus A includes a winding means for stretching the tape 4 while applying a predetermined tension between a pair of glue rules 140 arranged at a predetermined interval. B and the tape 4 stretched by this winding means B
A plurality of supply units C, which supply chip components 1 to the tape 4 and which are arranged so that their supply positions face the transfer path of the tape 4, are arranged on the drawer side of the tape 4, and the chip components 1 are installed in advance. The component supply means adheres to the tape 4 in the order given and positions the board 2 so that the mounting position of the board 2 faces the transfer path of the chip component 1 adhesively held by the tape 4. a positioning means E consisting of a cave table; and a positioning means E comprising the tape 4;
The tape 4 is intermittently transferred at predetermined intervals, and the chip component 1 held by the tape 4 for t15N is pushed down together with the tape 4 to bring the chip component 1 into contact with the substrate 2. , only the tape 4 is lifted up, the tape 4 is peeled off from the chip component 1, and the chip component 1 is removed from the substrate 2.
It is composed of a mounting means F to be mounted on.

The winding means B includes a pair of brackets 11 arranged at both ends of the base 1o, as shown in FIGS. 1 to 3.
, a motor 12 supported by this bracket 11 , and a reel 14 for winding the tape 4 fixed to a rotating shaft 13 of this motor 12 .

In the above configuration, the tape 4 wound on the reel 14 on the right side of the drawing is pulled out, and the tape 4 wound on the reel 14 on the left side of the drawing is pulled out.
After winding the tape 4 around the tape 4, each motor 12 is rotated in the direction in which the tape 4 is pulled, thereby applying a required tension to the tape 4.

As shown in FIGS. 1, 2, and 7 to 12, the supply unit C includes an aligning and feeding unit C2 for chip components 1 disposed on a base 16 fixed to a base 1°; Cutting-edge chip parts 1 sent out to tape 4
The supply section C2 pulls up toward the tape 4, fits the chip component 1 into the hole 6 of the tape 4, and holds the chip component 1 adhesively on the adhesive tape 7.7'.
Consists of spikes.

The alignment and sending portion C3 includes a pair of leaf springs 18 and 19 each having one end supported by a support member 17 fixed to a base 16 so as to have different inclination directions, and an upper end portion of the leaf spring 18. A return track 21 is supported on the upper end of the forward track 20 and the leaf spring 19 at a predetermined distance from the track 2° (an interval smaller than the thickness of the chip component 1), and is fixed on the base 17. bracket 2
2 supported by an excitation magnet 23, and an adsorption gold-1 protruding from the tracks 20 and 21 so as to face the excitation magnet 23 at a predetermined interval.
424, and a cover 25 for preventing chips from flying out, which is provided at a predetermined interval (at intervals larger than the longitudinal direction of the chip component 1) at the delivery end of the track 21.

The track 20 includes a conveyance path 26 that gradually becomes higher in the feeding direction from the supply end of the chip components 1, and a conveyance path 26 that gradually increases the height of the chip components 1 from the supply side end thereof, and the chip components 1 that are fed on the conveyance path 26.
A wall surface 27 is formed at the end in the feeding direction to prevent the chip component 1 from falling off and to guide the chip component 1 toward the track 21. And the track 21
is formed at the same height as the end of the track 20 in the feeding direction and gradually becomes higher from the end on the receiving side that receives the chip component 1 from the track 20, and is connected to the transport path 28, An alignment conveyance path 29 for aligning the chip components 1 in a line and sending them out, and a wall surface 30 for guiding the chip components 1 sent by the conveyance path 28 toward the distorted alignment conveyance path 29 are formed. Note that the alignment conveyance path 29 passes under the cover 25.

With this configuration, track 2o and track 2
1 conveying force [6 mouths are reversed, each truck 20, 21
Then, the chip component 1 is transported in the direction of the arrow.

At the end of the track 20 in the feeding direction, a wall surface 27
Since the transport direction of the chip component 1 is regulated by , the chip component 1 is fed into the track 21 . Further, in the track 21, only the chip components 1 that have been transported along the wall surface 3o are fed into the alignment transport path 29, and the other chip components 1 fall toward the track 2o and are returned to the transport path 26.

As shown in FIG. 7, FIG. 9 to FIG. a housing 36 disposed such that the chip component 1 that comes into contact with the stopper 35 is located between the adhesive tapes 7 and 7' of the tape 4, and further located in the center of the hole 6 that receives the chip component 1; Through hole 36 of housing 33
A nozzle 57 is provided with a port 34 in a vacuum supply means (not shown) so as to attract and pull up the chip component 1 which is movably penetrated through the stopper 35 and is stopped in contact with the stopper 35. An elongated hole 4o formed at one end of the leg part is movably fitted into a bottle 39 planted in a 38-circle circle formed at the upper end of the leg part 37, and the center part is fixed to the base 31. A T-shaped lever 45 rotatably supported by a pin 42 supported by a bracket 41 and a pace 6
A pin 47 is supported by a bracket 44 fixed to 1 and implanted in a groove 46 formed at one end of the plunger 45.
The solenoid 49 is slidably fitted with an elongated portion 48 formed at one end of the lever 43, and one end is locked to the lever 43 and the other end is provided on a bracket 44. The lever 4 is locked by the hook receiver 50.
A spring 51 that applies a restoring force to the lever 6 and a bracket 52 supported by the base 31 so as to be located between the housing 33 and the bracket 440 are arranged so as to face each other across the lever 43. , lever 4
A pair of stoppers 53 are provided which restrict the range of movement of the nozzle 67 by restricting the range of rotation of the nozzle 67.

With such a configuration, the chip parts 1 supplied to the truck 2o as shown in FIGS. When they are fed into the path 29 and aligned and come into contact with the stopper 35 and stop, the solenoid 49 is actuated to retract the plunger 45. Then, the lever 46 shown in FIG. 9 rotates, the nozzle 57 descends, picks up the chip component 1, attracts the chip component 1 to the tape 4 located above it, and spreads the chip component 1 along the longitudinal direction of the tape 4. The chip component 1 is adhesively held on the adhesive tape 7, 7' which is stretched. At this time, when the nozzle 67 moves upward, vacuum pressure is supplied to the nozzle 37, and when the nozzle 37 comes into contact with the chip component 1, the chip component 1 can be held by suction.

Further, when the chip component 1 is pulled up by the nozzle 67 and comes into contact with the adhesive tape 7.7' of the tape 4, the vacuum pressure supplied to the nozzle 37 is switched to atmospheric pressure and released from the nozzle 37. It has become so.

As shown in FIGS. 1 and 2, the component supply means includes a plurality of supply units C (11 units in the drawing) arranged in a row on the base 10, and a tape 40 of the supply unit C. A pair of lower plates 54 are arranged to support the tape 4 at the front and rear in the running direction. The intervals between the supply units C are arranged to be an integral multiple of one pitch of the tape 4 that is intermittently transferred.

As shown in FIGS. 1, 13, 14, and 18, the positioning means E positions and mounts and fixes the substrate 2 in the same direction as the moving direction of the tape 4. an X table 56 for moving the tape 4; a pulse motor 57 for driving the X table 56; and a pulse motor 57 for driving the X table 56;
Y table 58 and Y table 58 to be moved in the direction
It is configured by a pulse motor 59 that drives the.

With the above configuration, the pulse motors 57 and 59 are rotated according to a preset program to position the substrate 2 placed on the X table 56.

As shown in FIGS. 1 and 1-2 and FIGS. 13 to 18, the biofilm F for mounting the chip component includes a mounting portion F1 for mounting the chip component 1 on the substrate, and this mounting portion. A drive section F that drives the FI, and a feed drive section F that uses the movement of the mounting section F1 to feed the tape 4 one pitch at a time.
It is composed of , and.

As shown in FIGS. 18 and 19, the mounting portion F includes a plate 64 supported on a mounting base 62 supported by a bracket 61 fixed to the base 10 so as to be movable up and down via a guide 63. A plate 67 is supported by this plate 64 at predetermined intervals via three shafts 65 and crosspieces 66.
Equipped with three shafts 6 between Plate 4 and Grate 670.
B, 69.70 are rotatably supported via bearings 71, respectively. Collars 72 are layered on both ends of the shaft 68, and a ratchet wheel 76 and a ratchet guide 74, which are fixed together, are inserted between the collars 72. A lever 75 is rotatably supported on the shaft 68 of the casing via a bearing 71.

The plate 64 includes a stopper 76 that engages with the ratchet gear 74 and prevents the ratchet gear 74 from reversing.
is provided. On the other hand, the shafts 69 and 70 have gears 77 and 78 that are integrally formed between the collars 72 inserted at both ends thereof and mesh with the gear 73, and a hole 5 of the tape 4. A sprocket 79.8[1 that fits in and feeds the tape 4 is inserted. The lever 75
One end of a spring 81 is locked to one end of the spring 81, and
The other end of the spring 81 is engaged with a hook receiver 82 implanted in the plate 67, urging the lever 75 to come into contact with a stopper 83 implanted in the plate 67. A pin 8 is attached to the other end of the lever 75.
4, a roller 85 is rotatably supported. The shaft 8 is located between the roller 85 of the lever 75 and the shaft 68.
A ratchet pawl 87 is rotatably supported by a ratchet pawl 87 and biased by a torsion spring 88 so as to engage with the ratchet gear 74. Therefore, when the roller 85 is pushed down, the lever 75 rotates in the direction of the arrow θ, and the ratchet pawl 87 rotates the ratchet gear 74, so the gear 76 also rotates in the direction of the arrow θ, and the gears 77 and 78 that mesh with it rotate. Rotate the sprocket (79.80) to feed tape 4 by one pitch. When the lever 75 returns, the stopper 76 closes the ratchet gear 740.
Since rotation is prevented, ratchet pawl 87 pivots against the pressure of torsion spring 88 and engages the next tooth of ratchet gear 74. A housing 89 is fixed to the crosspiece 66. A hollow shaft 90 that slidably passes through the housing 89 is supported at a predetermined height by contacting a flange 91 formed on the outer periphery or the lower end of the housing 89, and is supported at a predetermined height by a spring 92. Being pressed. A tape kite 93 having a semicircular diameter is fixed to the lower end of this shaft 90. A slot 95 for protruding the chip component 1 from the tape 4 is provided at the lower end of the pusher 94 which is slidably supported on the axis of the shaft 900. a bracket 96 fixed to the grate 67;
A pin 97 provided between the plates 670 has a lever 9
8 is (b) movably supported, 15 is there. At one end of this lever 98, the push rod 94
The upper ends of are engaged. A spring 100 is suspended between the lever 98 and a hook receiver 99 provided on the plate 67, and urges the lever 98 to push down the push rod 94.

The drive unit F includes a bracket 101 that is erected on the base 10 in opposition to the bracket 61 with the tape 4 sandwiched therebetween.
A motor 103 fixed to a support member 102 supported by
An eccentric shaft 106 is attached to a cam 105 attached to a rotating shaft 104 of this motor 103 so as to be eccentric by σ with respect to the axis of the rotating shaft 104, and this eccentric shaft 1
One end is rotatably supported by 06, and the other end is
rotatably coupled to one of the shafts 65 of the mounting portion F1;
and a link 107 that suspends and supports the movable part of the mounting part F1 with respect to the eccentric shaft 106, and when the motor 106 rotates,
The movable portion of the mounting portion 1i+ is configured to slide in the vertical direction by twice the eccentric cap σ. The support member 1
An L-shaped lever 110 is supported by a pin 16 109 implanted between a bracket 108 fixed to 02 and the support member 102.

A roller 112 is connected to one end of this lever by a pin 111.
is rotatably supported, and this roller 112 is in contact with one end of the lever 98 so as to push it.

Further, a roller 114 is rotatably supported by a pin 116 at the center of the lever 110, and a roller 114 is rotatably supported by a pin 116.
5 and swings the lever 110 according to the cam curve of the cam 105. The support member 102 and the lever 11
A spring 116 is hung between the hook receivers 1150 planted in the spring 115, and pulls up one end of the lever 110.

As shown in FIGS. 16 and 15, the feed drive unit F8 includes a stand 117 disposed to face the bracket 61, and a feed drive section F8, as shown in FIGS.
Arm 1 extended to intrude between 64 and 67
18 and a cam 119 fixed to one end of this arm 118 so as to face the roller 85. When the plate 64.67 rises, the cam 119 moves the roller 8
By pressing 5, the lever 75 is rotated in the direction of arrow θ, and the latinite gear 74 is turned to feed the tape 4.

In the above configuration, the reel 14 on which the tape 4 is wound is set on the winding means B on the component supply means side, and the empty reel 14
After setting it on the winding means B on the mounting means F side, pull out the drawer part attached to the tip of the tape 4 from the reel 14, run the lower surface of the nozzle 37 of the supply unit C, and make a hole in the sprocket 80 of the mounting means F. After fitting and further fitting the hole into the sprocket 79 via the cheap guide 93, one end thereof is locked to the empty reel 14.

Then, the two motors 12 are rotated in a direction that pulls the tape 4 relative to each other, thereby applying tension to the tape 4. On the other hand, the seventh
As shown in FIG. 8, the required chip components 1 are supplied to the tracks 20 of each supply unit C, and a drive current of a predetermined waveform is applied to the excitation magnet 23, so that the chip components 1 are line up and feed it until it hits the stopper 35.

When the motor 105 is rotated in this state, each rotation of the cam 105 causes the ratchet pawl 87. Ratchet gear 74. Gear 73. Gears 77, 78 and subblocks 79, 80 rotate one pitch at a time, transporting the tape 4 one pitch at a time. At this time, a current is applied to each solenoid 49 by a control device (not shown) so that each supply unit C of the component supply means operates in a predetermined order.

Then, the solenoid 49 to which the current is applied retracts the plunger 45 and rotates the lever 45.

Then, the nozzle 37 is moved by the lever 43 as shown in FIG.

As shown in FIG. 11, the chip component 1 is lowered and the nozzle 67 sucks and holds the chip component 1, and as shown in FIG. Then, when the adhesion of the nozzle 67 is released, the current of the solenoid 49 is cut off, and only the nozzle 37 rises to prepare for the next supply. In this way, the chip parts 1 are drilled into the holes B of the tape 4 in a predetermined order, and are fed into the mounting means F. When the chip parts 1 reach the lowest end of the tape guide 93, the X table Then, with the board 2 and the chip component 1 facing each other as shown in FIG. 19(a), the cam 105 is rotated by the motor 103, and the tape guide 93 is lowered. When this happens, the chip component 1 comes into contact with the substrate 2 as shown in FIG. Spring 9 shown in
2 is compressed to reduce the pressure applied to the chip component 1 and the substrate 2. Further, when the cam 105 rotates, the pusher 94 descends as shown in FIG.
2, the tape guide 93 rises as shown in FIG. 19(d). Chip part 1 is
It is peeled off from the adhesive tape 7.7' stretched over the tape 4 and mounted on the substrate 2.

Further, when the cam 105 rotates, the push rod 94 rises as shown in FIG. And further cam 105
rotates and the eccentric shaft 106 rises, the roller 85 of the lever 75 hits the cam 119, and as shown in FIG. At the same time, the pulse motors 57 and 59 rotate, and the next mounting position of the board 2 is determined.

As described above, by repeating the operations in FIGS. 19(a) to 19(D), the chip components 1 can be sequentially mounted at predetermined positions on the substrate 2.

In addition, in the above embodiment, the case where chip components are mounted on one type of board in two operations was explained, but when chip components are mounted on multiple types of boards, the board positioning means and the component supplying means are required. This can be done extremely easily by simply changing the program.

As described above, according to the present invention, a chip component is held and edited on a tape, and also on an adhesive tape stretched along the length of the tape, and is mounted directly onto a board from the tape. Therefore, chip components can be mounted on the board with simple operations, and the mounting speed can be improved. In addition, it is extremely easy to handle a wide variety of boards by simply changing the programs for the board positioning means and component supply means.Furthermore, since there is no adhesive part of the transport tape in the center of the parts, It does not damage the adhesive part of the transport tape, allows the transport tape to be used until the adhesive strength of the adhesive part runs out, and has the effect of improving the operating rate of the equipment.

[Brief explanation of drawings]

1 to 19 are diagrams for explaining one embodiment of the present invention, in which FIG. 1 is a front view of a chip component mounting device;
2 is a plan view of FIG. 1, FIG. 6 is a side view of the tape winding means, FIG. 4 is a plan view showing an example of the tape, FIG. 5 is a sectional view taken along the line V-V in FIG. 4, Fig. 6 is a plan view showing the tape holding chip components, Fig. 7 is a side view showing the supply unit and its surroundings, Fig. 8 is a partial plan view of Fig. 7, and Fig. 9 is the supply unit. FIG. 10, 1123 is a partial cross-sectional side view showing the supply section of the unit. 12 and 12 are process diagrams showing the operation of supplying chip components by the component supply unit, FIG. 13 is a front view of the positioning means and mounting means, FIG. 14 is a side view of FIG. 16, and FIG.
The figure is a cross-sectional view taken along the line XIV-XIV of FIG. 14, FIG. 16 is a cross-sectional view taken along the line XV-XV of FIG. 16, FIG. 17 is a cross-sectional view taken along the line XVI-XVI of FIG. 14, and FIG. XV
FIG. 19, which is a partial cross-sectional view taken along the line n to XVII, is a process diagram showing the process of mounting chip components. A. Chip component mounting device B... Winding means C... Supply unit"]...
- Parts supply means E... Positioning means F... Mounting means 4... Tape 6... Hole 7. 7'... Adhesive tape agent 5P Buriji Thin 1) Li Shin 4 Off 0 force O l no D] O120 2

Claims (1)

[Claims] A tape feed hole and a large chip-shaped hole for inserting a chip component are formed, and two chip-holding tapes are stretched in parallel at a predetermined interval into the large chip-fitting hole with the adhesive surface protruding from the large side surface. Adhesive tape for sealing tape,
A tape winding means stretches the adhesive tape at a predetermined tension along a predetermined path with the adhesive surface facing downward, and a chip component supplying section stretches the adhesive tape along a predetermined tension with the adhesive surface of the tape facing downward. At least two chip component supply means are arranged to face each other at intervals, and pull up chip components at a supply position and hold the chip components adhesively on the tape; a positioning means for holding the board so as to face the component and positioning the chip component mounting position of the board below the chip component; and a positioning means that can be raised and lowered so as to face each other at a predetermined interval with the tape between the positioning means and the tape. and mounting means for intermittently transporting the tape at predetermined intervals, pressing the chip component adhesively held by the tape against the substrate, peeling the chip component from the adhesive tape, and mounting the chip component on the substrate. A chip component mounting device characterized by