JPH04199794A - Apparatus and method for mounting electronic component - Google Patents

Abstract

PURPOSE:To eliminate a problem of easy positional deviation by operating a transfer head also as a transfer head for taking up an electronic component with leads of an electronic component supply feeder by the head and transferring to place it on a board. CONSTITUTION:A tape feeder 20 having a both-side adhesive single piece 18 adhered to a peeling tape, and a transfer head 11 having an adhering element 40 for adhering to take up the piece 18 on the peeling tape fed from the feeder 20 and transferring to adhere it to a board 1 positioned at a positioning unit 2, are provided. The element 40 is freely replaced with an electronic component suction nozzle 50, and the head 11 is used also as a transfer head for taking up the component with leads of electronic component supply feeders 6, 7 and transferring to place on a board. Thus, the component can be momentarily adhered on the board, and the positional deviation of the component is eliminated.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus and a mounting method. Concerning means.

(Prior art) As a means of mounting electronic components such as QFI and SOP on a board, as shown in FIG.
After pre-applying the bond 102 to 1 by dispensing, the electronic component P is adsorbed to the nozzle 104 of 71" l 03, and the mold body M of this electronic component P is adhered to the bond 102 described in -. things are being done.

(5 strategies to solve bald hair) However, the above conventional method uses bond 1 by dispenser.
There was a problem in that the amount of coating of 02 varied, easily resulting in mounting defects, and since the bond 102 had fluidity, the electronic component P was easily misaligned, and the lead L was easily misaligned from the electrode 105 of the board 101. .

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting means that can solve the problems of the conventional means described above.

(Means for Solving the Problems) The present invention includes a tape feeder equipped with a tape made by adhering a double-sided adhesive single piece to a release tape, and a tape feeder that adheres the single piece on the release tape fed from the tape feeder. and a transfer head equipped with an adhesive that picks up the substrate and transfers and adheres it to the board positioned in the positioning section.The adhesive is replaceable with an electronic component suction nozzle. However, it also serves as a transfer head for picking up leaded electronic components of the electronic component supply feeder and transferring and mounting them on the substrate.

(Function) In the above configuration, the double-sided adhesive single piece sent out from the tape feeder is glued to the adhesive of the transfer head and ticked up, and after this single piece is glued to the substrate positioned in the positioning section, the A transfer head equipped with a component suction nozzle suctions and ticks up the leaded electronic component of the electronic component supply feeder, and adheres the molded body of the electronic component to the single piece adhered to the substrate.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of the electronic component mounting apparatus.

Reference numeral 1 denotes a substrate, which is positioned by a positioning section 2 consisting of clamping means. 3 is a conveyor for carrying the substrate 1 into the positioning section 2 and carrying it out from there.

Tables 4.5 are provided on both sides of the positioning section 2. On one table 4, a large number of electronic component supply feeders 6 such as tape feeders and tube feeders are arranged in parallel.

Further, a tray feeder 7 is arranged on the other table 5. This l-ray feeder 7 includes QFP and SO
Electronic parts with leads such as P are stored.

Reference numeral 11 denotes a transfer head, which is provided on the XY child table 2.13. By driving the XY child table 2.13, the transfer head 11 moves in the xy force direction and transfers and mounts the electronic components of the feeder 6.7 onto the substrate 1.

A tape feeder 20 on which a tape 15 (described later) is wound is provided on the side of the feeder 6 . FIG. 2 is a side view of this tape feeder 20. In the figure, 21
is a main frame, a supply reel 22 is provided at the rear thereof, and a take-up reel 23 is provided at the front of the supply reel 22.

FIG. 4 shows the tape 15 wound around the supply reel 22. As shown in FIG. This child loop 15 is made by sandwiching a double-sided adhesive single piece 18 between peeling tapes 16 and 17, and pin holes 19 for pitch feeding are provided along the edges of the piece 18. A hole is drilled at the center. This single piece 18
is made by cutting double-sided adhesive tape, and has sufficient heat resistance to withstand the adhesive flow in the post-process.

In FIG. 2, 24 is a sprocket provided at the front of the main frame 21, 25 is a drive lever thereof,
The tape 15 is pitch-fed. 26 is supply reel 2
The second sprocket provided on the second side, 27 is its driving lever, and the re-driving lever 25.27 is connected to the shaft 28.
are connected. This shaft 28 has a swing lever 2
9 are connected. 30 is its swing axis. This swing lever 29 is connected to the drive arm 3 of the take-up reel 23.
1 and a spring material 32.

The drive lever 25 of the sprocket 24 is connected to an elevating shaft 34 that is driven by a cylinder 33 and moves up and down. When the rod 33a of the cylinder 33 protrudes and retracts, the elevating shaft 34 moves up and down, and the drive levers 25 and 27 swing.
Sprockets 24 and 26 rotate in a pinch, and the tape 1
5 is pitch fed. At this time, the swing lever 29 and the drive arm 31 also swing, and in conjunction with the pinch rotation of the sprockets 24 and 26, the take-up reel 23 also pinch-rotates. A cutter 35 is provided below the sprocket 24 and cuts the release tape 16.

A cover plate 36 is provided along the upper surface of the main frame 21. The release tape 17 is attached to this cover plate 3.
The film is folded back and peeled off at the edge 6, and then wound onto a take-up reel 23. 37 is a second cover plate provided along the sprocket 24. A pick-up stage 38 is provided between the double force bar plates 36 and 37. This amplifier stage 38 is made of a sheet-like base having some elasticity.

In FIG. 2, an adhesive 40 is attached to the nozzle shaft 8 of the transfer head 11.

This adhesive 40 includes a mounting part 41 that is detachably mounted on the lower end of the nozzle shaft 8, a vertical shaft 42,
It consists of an adhesive part 43 provided at the lower end of this shaft 42, and a rib 44 is provided protruding from the lower surface of the adhesive part 43. The nozzle shaft 8 has a lever 9 made of a spring material, and when this lever 9 is elastically fitted to the side of the mounting part 41, the adhesive 40 is attached to the nozzle shaft 8.
It is detachably attached to the

The transfer head 11 arrives above the tick-up stage 38, and the adhesive member 40 moves up and down, so that the adhesive part 4
The single piece 18 on the peeling tape 16 is glued to the rib 44 of No. 3 and ticked up, and then the transfer head 11 moves above the substrate 1 and the adhesive 40 moves up and down, so that the single piece 18 is attached to the substrate. 1. In this case, in order to transfer the single piece to the substrate 1, the adhesive force of the substrate 1 needs to be greater than the adhesive force of the adhesive part 43.
A rib 44 is provided protruding from 3 to reduce the bonding area.

In this way, as a means to make the adhesive force of the adhesive part 43 smaller than that of the substrate 1, instead of the rib 44, the lower surface of the adhesive part 43 is made a slippery surface with a small adhesive force, or the adhesive part 43 Measures such as making the dimensions of the single piece 18 smaller than the dimensions of the single piece 18 may also be used.

FIG. 3 shows the adhesive 40 and the electronic component suction nozzle 50.
It shows the transfer head 11 after replacing. This suction nozzle 50 consists of a mounting part 51 and a nozzle 52.
The leaded electronic component P is attracted to the lower end of the nozzle 52.

That is, this transfer head 11 has a single piece 18 and an electronic component P.
It also serves as the transfer head.

In FIG. 1, reference numeral 60 denotes an exchange table in which a plurality of suction nozzles 50 of different shapes and dimensions and adhesives 40 are housed. The transfer head 11 arrives on this exchange table 60, and the nozzle 50 and adhesive 40 are automatically exchanged.

This replacement is performed by a well-known means similar to the nozzle replacement means, and detailed explanation thereof will be omitted.

This electronic component mounting apparatus has the above-mentioned configuration, and its operation will be explained next.

By driving the cylinder 33, the sprocket 7 and 2
4.26 rotates at a pitch, and the tape 15 wound around the supply reel 22 is pinch-fed. On the way, the release tape 17 on the upper surface side is wound up on the take-up reel 23, and the single piece 18 on the release tape 16 on the lower surface side is ticked up to the adhesive 4o on the tick-up stage 38.

After the release tape 16 circulates around the sprocket 24, it is cut by a cutter 35. Note that two sprockets 24 and 26 are provided so that the weak tape 15 can be reliably fed in a pinch manner.

The transfer head 11 that has picked up the single piece 18 picks up the substrate 1
, and adhere this single piece 18 to the mounting position of the electronic component P.

When the adhesion of the single piece 18 to the substrate 1 is completed, the transfer head 11 is moved onto the exchange table 60, and the adhesive member 40 and suction nozzle 50 are exchanged. Next, transfer head 1
1 moves above the feeder 7 and delivers the desired electronic component P.
is taken up and moved above the single piece 18 bonded to the substrate 1 in advance. Next, mold body M of this electronic component P
is glued onto the single piece 18 (see FIG. 3).

In this case, the electronic component P is bonded to the single piece 18 (instantly bonded) and does not shift in position.

The electronic components P mounted on the board 1 by a single piece 18 are generally large electronic components with leads such as QFP or SOP, and electronic components such as capacitor chips and resistor chips are printed on the board by a screen printer. It is mounted on cream solder applied in advance to 1.

After all the electronic components P are mounted on the board 1 in the above manner, the board 1 is sent to a reflow device, and the electronic components P are fixed to the board 1 by heat treatment of the solder.

By the way, the dimensions of the mold body M of the electronic component P vary. Therefore, if the dimensions of the single piece 18 are determined in accordance with the small electronic component, it is possible to
8 allows a wide variety of electronic components to be bonded to the substrate 1.

In addition, some electronic component mounting apparatuses of this kind are equipped with a plurality of transfer heads, and in this case, each transfer head should be able to be attached with two replacement adhesives 40 and suction nozzles 50. By doing so, the single piece 18 or the electronic component P may be bonded to the substrate 1 while ensuring the flexibility of using the transfer head, or one transfer head may be dedicated to the single piece 18 and the other transfer head may be used exclusively for the single piece 18. The mounting head may be used exclusively for electronic components P.

Also, the adhesive strength of the single piece 18 to the mold body M and the substrate 1
The adhesion strength is not necessarily the same. Also single piece 18
The adhesion strength of is influenced by the amount of bond impregnated.

Therefore, if the adhesive force of the substrate 1 is greater than that of the mold body M, for example, as shown in FIG.
The thickness of the bond 18b on the upper surface side of the Nohes material 18a is
It may be made thicker than the bond 18C on the lower surface side to enhance adhesive strength. Of course, the adhesive force of the mold body M is
If the adhesive force is greater than the bond 18C on the lower surface side, make it thicker.

The above embodiment has been described using a mounting apparatus in which the transfer head 11 moves in the XY force direction to transfer and mount electronic components onto the board 1. The present invention can also be applied to a mounting apparatus that transfers and mounts electronic components onto a board that is rotated by an XY child table and positioned.

(Effects of the Invention) As explained above, the present invention provides a tape feeder equipped with a tape made by adhering a double-sided adhesive single piece to a release tape, and a tape feeder that adheres the single piece on the release tape fed from the tape feeder. The device is then ticked up, transferred to the substrate positioned in the positioning section, and transferred to the transfer unit equipped with an adhesive to adhere it.
By making the adhesive head replaceable with an electronic component suction nozzle, the transfer head picks up the leaded electronic component of the electronic component supply feeder and transfers and mounts it on the board. Since it also serves as a head, the following effects can be obtained.

(1) Instead of bond, a double-sided adhesive single piece is used, so
Electronic components can be stably and reliably mounted on a board without causing problems such as mounting defects due to variations in the amount of bond applied.

(2) Tape is easier and more convenient to handle than bond, which is a fluid.

(3) Electronic components can be bonded to the substrate instantaneously, and no displacement of the electronic components occurs.

(4) Transfer and mount the electronic components onto the board.
It can be used directly as a means of transporting and gluing single pieces, so
The structure is simple and costs are reduced, and unlike conventional means, the dispenser device and the space for dispensing the dispenser device are not required, so the line configuration can be made more compact.

(5) Since the bonding position of the single piece to the board is the same as the mounting position of electronic components, this is extremely advantageous in terms of convenience store software.

(6) Since the adhesive and suction nozzle can be installed on the exchange table and used interchangeably, bonding to a single piece of board and mounting electronic components can be done as a series of tasks with good work efficiency. Implementation speed can be increased.

[Brief explanation of the drawing]

The figures show an embodiment of the present invention, in which Fig. 1 is a plan view of an electronic component mounting apparatus, Fig. 2 is a side view of a tape supply mechanism, and Fig. 3 is a diagram showing an electronic component being mounted on a board. Side view, 4th
The figure is a perspective view of the tape, FIG. 5 is a side view of another embodiment, and FIG. 6 is a side view of electronic components being mounted by conventional means. ■... Board 2... Positioning part 6.7... Electronic component supply feeder 11... Transfer head 15... Tape 16.17... Peeling tape 18... Single piece 20... Tape feeder 40... Adhesive 50... Suction nozzle

Claims (2)

[Claims] (1) A tape feeder equipped with a tape made by adhering a double-sided adhesive single piece to a release tape, and the single piece on the release tape fed from this tape feeder is adhered and taken up, and is positioned in the positioning section. and a transfer head equipped with an adhesive for transferring and adhering to a printed circuit board, and the adhesive is replaceable with an electronic component suction nozzle.
An electronic component mounting apparatus characterized in that the transfer head also serves as a transfer head for taking up lead-equipped electronic components from an electronic component supply feeder and transferring and mounting them on the substrate. (2) After gluing the double-sided adhesive single piece sent out from the tape feeder to the adhesive of the transfer head and taking it up, and gluing this single piece to the substrate positioned in the positioning section,
A transfer head equipped with an electronic component suction nozzle sucks and takes up electronic components with leads from an electronic component supply feeder, and the molded body of this electronic component is adhered to a single piece adhered to the above-mentioned substrate. Characteristic electronic component mounting method.