JPS6155279B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component assembling apparatus for assembling chip-shaped electronic components onto the surface of a substrate such as a ceramic substrate.

2. Description of the Related Art As a method for assembling chip-shaped electronic components onto a circuit pattern such as a ceramic substrate, the method shown in FIGS. 1 and 2 is known. That is, the electronic component 2, which is adhesively held by the adhesive tape 1 that is intermittently transferred and sent above the assembly position, is held by suction by the head 3, and is removed from the adhesive tape 1, and the board 4 that is waiting below it is held by the head 3. It is designed to be assembled into.

In such a method, the adhesive force of the adhesive tape 1 that adhesively holds the electronic component 2 is likely to decrease due to the influence of temperature and dust in the air, resulting in low work stability. Furthermore, if the adhesive tape 1 is used repeatedly, the adhesive strength decreases, so the adhesive tape 1 must be replaced each time. moreover,
Not only is it impossible to attach a positioning means to the adhesive tape 1, but also the electronic components cannot be positioned with high precision due to the elongation of the adhesive tape 1.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component assembling apparatus that eliminates the drawbacks of the prior art described above and enables high-speed, high-precision electronic component assembly.

In order to achieve the above object, in the present invention,
A plurality of clamping tools are provided at predetermined intervals on a chain circulating in a predetermined route, and electronic components are loaded into the clamping tools from a plurality of component supply means so as to be lined up in a preset assembly order. , the electronic component removed from the holding tool is assembled onto the pre-positioned board after being transferred to the assembly position.

An embodiment of the present invention will be described below with reference to the drawings.

3 to 17 show an embodiment of the present invention. In the figures, an assembly apparatus A for electronic components 2 moves a chain 23 provided with a plurality of clamping tools at predetermined intervals. a transfer means B that moves intermittently in pitches; and a plurality of clamping tools arranged along the path of the clamping tools moved by the transporting means B, and facing the clamping tools whose supply position is at a stop position at a predetermined interval. A component supply means C consisting of component supply units C ₁ , C ₂ , C ₃ , and C ₄ , and a supply position of each of the component supply units C ₁ , C ₂ , C ₃ , and C ₄ and the clamping tool are sandwiched between the parts supply means C and the clamping tool. A loading means D is provided with a pair of upper and lower chucks facing each other, and is configured to clamp the electronic component 2 at the supply position with the chuck and load it into the clamping tool.
, the assembly position of the board 4 is positioned below the stop position of the electronic component 2, which is placed along the transfer path of the electronic component 2 which is held by the clamping tool and transferred by the transfer means B. A positioning means E, and a chuck disposed above the assembly position so as to face the board with the electronic component 2 held between the clamping tools held therebetween, and the chuck holds the electronic component 2. It also includes an assembly means F for removing it from the clamping tool and assembling it onto the board 4.

The transfer means B includes a guide member 11 fixed on a base 10, as shown in FIGS. 4 to 7.
a support member 12 that is slidably supported by the support member 12 and pulled toward the end of the base 10 by a spring 15;
The driven side sprocket 14 is rotatably supported via the shaft 13, and the support member 17 fixed to the side surface of the cover 16 of the assembly means F disposed on the base 10 is connected via the shaft 18. The drive-side sprocket 19 is rotatably supported by the sprocket, and the chain 23 is stretched between the sprocket 14 and the sprocket 19. A gear 20 is integrally fixed to the sprocket 19 and meshes with a gear 22 fixed to the rotating shaft of a pulse motor 21. Each link 2 constituting the chain 23
7 , plate springs 26 formed in a substantially U-shape are fixed to face each other to form a clamping tool 29 . Further, a pair of rails 25 for regulating the movement path of the chain 23 and preventing sagging of the chain 23 are each supported by a pair of supports 24.

With such a configuration, the pulse motor 21
By intermittent rotation of the chain 23, the clamping tool 29
The installation interval is one pitch, and the transfer is carried out intermittently one pitch at a time.

The component supply means C is configured by combining various component supply units so as to correspond to the packaging form of the purchased electronic components 2 at the time of delivery and to be adaptable to any condition. For example, as shown in FIG. 8, the electronic component 2 is housed in the hole 32 of the holding tape 31 pasted on the base tape 30, and the electronic component 2 is supplied by a tape magazine 37 covered with cover tape 33. Supplied using parts supply unit _C1 . Furthermore, when the cylindrical electronic component 2 as shown in FIG. 10 is supplied by a magazine 46 as shown in FIG.
C ₂ separates and supplies the electronic components 2 one by one. Further, as shown in FIG. 13, when the supply is carried out by a stick-shaped magazine 56,
The parts are arranged and supplied by the parts supply unit _C3 . Furthermore, the electronic components 2 that are supplied in pieces are
Parts supply unit using ball feeder etc.
It is designed to be aligned and supplied by C ₄ .

As shown in FIG. 9, the component supply unit _C1 includes a reel 36 that is detachably supported on a pair of rollers 35, and a guide roller 38 that guides the path of the tape magazine 37 pulled out from the reel 36. a sprocket 39 having a protrusion that engages with a feeding hole 34 formed in the tape magazine 37; a pulse motor 40 that rotates the sprocket 39 at predetermined intervals; A roller 42 that presses the tape magazine 37 against the guide roller 38 by the tensile force of 41 and rotates as the tape magazine 37 moves, a peeling plate 43 disposed between this roller 42 and the supply position, and this peeling At the end of the plate 43, the roller 4 is moved so as to wind up the cover tape 33 that has been peeled off from the tape magazine 37.
2, and a reel 44 that rotates upon receiving rotational force from a roller 42.

With such a configuration, the pulse motor 40
When the sprocket 39 rotates intermittently, the tape magazine 37 is pulled out from the reel 36, and the electronic component 2 is sent directly below the clamping tool 29 of the chain 23. At this time, the cover tape 33 of the tape magazine 37 that has passed through the peeling plate 43 is peeled off from the holding tape 31 by the rotation of the reel 44 and wound onto the reel 44. On the other hand, the base tape 30 and the holding tape 31
are sent to a desired location, rolled up or cut, and disposed of. In this way, the electronic components 2 can be sequentially fed to the supply position.

As shown in FIG. 12, the component supply unit C ₂ includes a support member 47 that allows the magazine 46 to be index-fed at intervals of "P" between the holes 45 that accommodate the electronic components 2, and a support member 47 of the support member 47. a chute 48 coupled to the lower end, and slidably disposed between the support member 47 and the chute 48;
It also includes a separation plate 49 in which a hole 50 into which only one electronic component 2 can be inserted is formed. The chute 48 is provided with a hole 51 into which the electronic component 2 housed in the hole 50 of the separation plate 49 falls, and a tube 53 is connected to the lower end of the hole 51 via a pipe 52.
is connected. One end of this tube 53 is
connected to a predetermined supply location.

With such a configuration, by sliding the separation plate 49 back and forth, electronic components can be taken out one by one from the magazine 46 and supplied to a predetermined supply position.

As shown in FIG. 13, the component supply unit _C3 includes a vibrating feeder 5 in which a groove 57 communicating with the opening at the lower end of each stick-like magazine 56 is formed.
8. At the end of the delivery side of the groove 57, there is provided a lower chuck 60 of a loading means D, which will be described later.
A hole 55 is formed through which the hole 55 passes.

With such a configuration, the vibration feeder 58
By vibrating the stick-like magazine 5
The electronic component 2 that fell into the groove 57 from the lower end of the
The groove 57 is fed along the groove 57 and covers the hole 55.
is sent to the end of the Incidentally, when loading the electronic component 2 into the clamping tool 29, the vibration feeder 58 is stopped.

The component supply unit _C4 consists of a ball feeder 59, and is adapted to align the supplied electronic components 2 in a line and feed them to a supply position.

Note that the component supply means C supplies one or more component supply units C ₁ , C ₂ , C ₃ , C ₄ such that the respective supply positions are the same as the intervals between the clamping tools 29 arranged on the chain 23 or It is arranged so that it is an integer multiple of that number.

As shown in FIGS. 14 and 15, the loading means D is arranged to be movable up and down below the component supply position, and includes a lower chuck 60 connected to a vacuum supply source through a tube 66, and a bent portion. a lever 62 rotatably supported by the lower chuck 61, one end of which engages with the shaft of the lower chuck 60, and which is biased by a spring 65 in a direction to lower the lower chuck 60;
A cylinder 64 facing the other end of this lever 62 and having a rod connected to the lever 62 by a wire 63
A push-up unit D ₁ consisting of a push-up unit D 1 and a component supply unit C ₁ (or C ₂ ,
Alternatively, an upper chuck 67 which is disposed so as to be movable up and down so as to face the chuck 60 across the chain 23 from the supply position of C ₃ or C ₄ ), and which is connected to a vacuum supply source through a tube 73, is rotatably supported by a shaft 68, one end engages with the shaft of the upper chuck 67, and a spring 72
A lifting mechanism consisting of an L-shaped lever 69 biased in the direction of lowering the upper chuck 67 and a cylinder 71 facing the other end of the lever 69 and having a rod connected to the lever 69 by a wire 70. Part D ₂
It is equipped with multiple sets of loading units consisting of.

With this configuration, when the chain 23 stops and the clamping tool 29 is located above the electronic component 2 in the supply position, the rod of the cylinder 71 protrudes and the upper chuck 67 descends due to the tensile force of the spring 67. , as shown in FIG. 15a, the clamping tool 29
As shown in FIG. 15b, the electronic component 2 is held by suction as it comes into contact with the electronic component 2. Then, the cylinder 64 is actuated to retract the rod, rotate the lever 62, raise the lower chuck 60, and the lower chuck 60 sucks and holds the electronic component 2 from below. At this time, when the electronic component 2 is being supplied by the tape magazine 37, the lower chuck 60 will suck and hold the base tape 30 of the tape magazine 37, but the upper chuck 67 and the lower chuck 60 will The parts 2 are clamped and loaded into the clamping tool 29 without any hindrance. When the electronic component is clamped between the upper chuck 67 and the lower chuck 60, the cylinder 71 is actuated to transport the electronic component 2 toward the clamping tool 29, as shown in FIG. 15c. At this time, the base tape 30 of the tape magazine 37 is cut by the lower chuck 60. Furthermore, the electronic component 2 rises and the 15th
As shown in FIG. d, when the electronic component 2 is loaded between the clamps 29, it is clamped by the elasticity of the clamps 29. In this state, the vacuum suction between the lower chuck 60 and the upper chuck 67 is released, the operating direction of the cylinder 64 is reversed, and the lower chuck 60
descends. On the other hand, the upper chuck 67 continues to rise and returns to the standby position.

The loading means D loads the loading unit into each component supply unit C ₁ , C ₂ , C ₃ , C ₄ of the component supply means C.
The number of parts supply units C ₁ , C 2 , C 3 , and C 4 is the same as that of the parts supply units C 1 , C ₂ , C ₃ , and C ₄ .

The positioning means E, as shown in FIG.
A lifting platform 7 arranged to be able to rise and fall on the base 10
5, and a Y that is movably placed on the lifting table 75 in a direction perpendicular to the moving direction of the chain 23 and that moves by the rotation of the pulse motor 76.
It is composed of a table 77 and an X table 79 which is placed on the Y table 77 so as to be movable in a direction parallel to the moving direction of the chain 23 and is moved by the rotation of a pulse motor 78. There is.

With such a configuration, after positioning and fixing the substrate 4 on the X table 79 with the lifting table 75 lowered, the lifting table 75 is raised,
Move the board 4 to the assembly position. At this time, the pulse motors 76 and 78 are also rotated at the same time to align the component loading position of the board 4 to a predetermined position.

As shown in FIGS. 16 and 17, the mounting means F is arranged so as to face the substrate 4 placed on the positioning means E with the electronic component 2 held between the holding tools 29 in between. a chuck 80 that is movably arranged above the assembly position of the electronic component 2 and connected to a vacuum supply source through a tube 81;
An L-shaped lever 83 whose bent portion is rotatably supported by a shaft 82, one end engages with the shaft portion of the chuck 80, and is biased by a spring 86 in a direction to lower the chuck 80; A cylinder 85 is arranged to face the other end of the lever 83, and one end of the rod is connected to the lever 83 by a wire 84.

With such a configuration, when the board 4 is positioned and the electronic component 2 is fed above the assembly position, the cylinder 85 is activated to cause the rod to protrude. Then, the wire 84 becomes loose, so
The lever 83 is rotated by the tensile force of the spring 86, and the chuck 80 is lowered. The tip of the chuck 80 is inserted between the clamping tools 29 and the electronic component 2
When the chuck 80 comes into contact with the upper surface of the electronic component 2, the chuck 80 attracts and holds the electronic component 2. Furthermore, when the chuck 80 descends, the shaft of the chuck 80 pushes out the clamping tool 29 and pushes out the electronic component 2 from the clamping tool 29.
It is lowered toward the substrate 4. And electronic parts 2
When it comes into contact with the substrate 4, the suction force of the chuck 80 is released and the electronic component 2 is released. At this time, the force with which the electronic component 2 is pressed against the substrate 4 can be set to a desired value by adjusting the tensile strength of the spring 86. Then, the cylinder 85 operates in the opposite direction to pull the wire 84, rotate the lever 83, and pull up the chuck 80, completing the loading of the electronic component 2.

In the above configuration, the board 4 is placed on the positioning means E, moved to the assembly position, and kept on standby. Further, each of the component supply units C ₁ , C ₂ , C ₃ , and C ₄ of the component supply means C feeds out the electronic component 2 to the supply position. In this state, the pulse motor 21 of the transfer means B is intermittently rotated to move the chain 23 one pitch at a time. During the period when the chain 23 is stopped, each loading unit of the loading means D is selectively operated according to a preset program, and the lower chuck 60
The electronic component 2 at the supply position is held between the upper chuck 67 and the upper chuck 67, and is loaded into the holding tool 29 waiting above the chuck. In this way, chain 23 has
The electronic components 2 are loaded on the board 4 in the order in which they are loaded,
It is sent one pitch at a time toward the assembly position. When the electronic component 2 is sent above the assembly position, the assembly means F is activated, the chuck 80 is lowered, the electronic component 2 is taken out from the clamping tool 29, and is assembled onto the board 4, and the chuck 80 is Return. Then, the pulse motors 76 and 78 of the positioning means E rotate to position the next assembly position of the board 4, and at the same time the pulse motor 21 of the transfer means B rotates to move the electronic component 2 to be assembled next. Feed it above the assembly position. On the other hand, the component supply means C sequentially feeds the electronic components 2 to the supply position, and the loading means D loads the electronic components 2 toward the clamping tool 29 of the chain 23 in a required order.

After all the required electronic components 2 are assembled on the board 4 in a predetermined order as described above, the elevating table 75 of the positioning means E is lowered, and the board 4 is taken out and sent to the next process. The substrate 4 is supplied.

As described above, according to the present invention, clamping tools are arranged at predetermined intervals on a chain that circulates in a predetermined path, the electronic components are clamped by the clamping tools, transferred to an assembly position, and assembled on a board. Since the electronic components are attached, it is possible to position the electronic components with high precision, and to perform assembly with high precision. Furthermore, electronic components can be reliably held and transferred without being affected by humidity, dust, etc. Further, there are effects such as being able to improve the reliability and operation rate of the device.

[Brief explanation of the drawing]

Fig. 1 is a front view showing a conventional method of assembling electronic components, Fig. 2 is a side view of Fig. 1, Fig. 3 is a perspective view of an assembling device showing an embodiment of the present invention, and Fig. 4. is the third
5 is an enlarged perspective view of a part of the chain in FIG. 4, FIG. 6 is a cross-sectional view of FIG. 4, and FIG. 7 is a plan view of FIG. Figure 8 is a perspective view of the tape magazine, Figure 9 is a configuration diagram of the parts supply unit, Figure 10 is a perspective view showing an example of electronic components, Figure 11 is a perspective view of the magazine, and Figure 12 is a diagram of the parts supply unit. An enlarged view of the main parts, FIG. 13 is a perspective view showing the stick-shaped magazine and the component supply unit, FIG. 14 is a configuration diagram of the loading means, FIG. 15 is an explanatory diagram of the operation of the loading means, and FIG. 16 is an assembling means. FIG. 17 is an explanatory diagram of the operation of the assembling means. A... Assembly means, B... Transfer means, 29... Clamping tool, C... Parts supply means, C ₁ , C ₂ , C ₃ , C ₄ ...
...Component supply unit, D...Loading means, E...Positioning means, F...Assembling means.

Claims (1)

[Claims] 1. A plurality of component supply means and a board on which electronic components supplied from the component supply means are assembled are arranged along a movement path of a chain that moves and circulates intermittently horizontally, and the plurality of component supply means The electronic components are supplied to the lower part of the chain from the above, and the electronic components are loaded onto the chain in accordance with the order of assembly of the electronic components, and the electronic components are assembled onto the board according to the intermittent movement of the chain. In an electronic component assembly device for moving the electronic component to a mounting position and assembling the electronic component onto the board, a plurality of pairs of links facing each other at intervals are connected in series in a rotatable and endless manner. A U-shaped leaf spring is fixed to each of the pair of links so as to face each other at a distance, and each of the plurality of types of electronic components supplied below the chain is configured as follows. A lower chuck, which is connected to a vacuum source and has a tip that sucks electronic components, is disposed so as to be movable up and down, and the electronic component is connected to the vacuum source at a position above the chain and facing the lower chuck. An upper chuck is arranged so as to be movable up and down, and has a distal end for suctioning water, and a large diameter part that extends continuously from the distal end and has an outer diameter successively larger than the outer diameter of the distal end. Each tip has an outer diameter that allows the leaf spring to be inserted between the two leaf springs fixed to the pair of links without deforming the leaf spring, and the large diameter portion of the upper chuck has an outer diameter that allows the leaf spring to be spread apart. The upper chuck is inserted between the leaf springs, the large diameter part of the upper chuck is used to press and spread the leaf springs, and the upper chuck and the lower chuck suck the electronic components and move them between the leaf springs. 1. An apparatus for assembling electronic components, characterized in that the electronic component is loaded into the chain by releasing the pressure of the leaf spring and sandwiching the electronic component between the leaf springs.