JPS5885539A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS5885539A
JPS5885539A JP18376881A JP18376881A JPS5885539A JP S5885539 A JPS5885539 A JP S5885539A JP 18376881 A JP18376881 A JP 18376881A JP 18376881 A JP18376881 A JP 18376881A JP S5885539 A JPS5885539 A JP S5885539A
Authority
JP
Japan
Prior art keywords
jig
resin
liquid resin
electronic component
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18376881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS629215B2 (enrdf_load_stackoverflow
Inventor
Ryuichiro Sakai
酒井 隆一郎
Hideya Kokubu
国分 秀弥
Hideo Kano
鹿野 英男
Akio Nadamura
灘村 昭夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP18376881A priority Critical patent/JPS5885539A/ja
Publication of JPS5885539A publication Critical patent/JPS5885539A/ja
Publication of JPS629215B2 publication Critical patent/JPS629215B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP18376881A 1981-11-18 1981-11-18 電子部品の製造方法 Granted JPS5885539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18376881A JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18376881A JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5885539A true JPS5885539A (ja) 1983-05-21
JPS629215B2 JPS629215B2 (enrdf_load_stackoverflow) 1987-02-27

Family

ID=16141620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18376881A Granted JPS5885539A (ja) 1981-11-18 1981-11-18 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5885539A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151282A (ja) * 1974-10-31 1976-05-06 Hitachi Ltd Handotaisochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151282A (ja) * 1974-10-31 1976-05-06 Hitachi Ltd Handotaisochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
JPS629215B2 (enrdf_load_stackoverflow) 1987-02-27

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