JPS5885359U - Composite semiconductor device - Google Patents
Composite semiconductor deviceInfo
- Publication number
- JPS5885359U JPS5885359U JP18074481U JP18074481U JPS5885359U JP S5885359 U JPS5885359 U JP S5885359U JP 18074481 U JP18074481 U JP 18074481U JP 18074481 U JP18074481 U JP 18074481U JP S5885359 U JPS5885359 U JP S5885359U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminal board
- composite semiconductor
- main surface
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ乃至りは、従来の複合型半導体装置の構造を示
す斜視図又は平面図、第２図は、本考案に係る複合型半
導体装置の一実施例を示す組立図、第３図は、同上断面
図、第４図は、同上の組立工程を示す斜視図である。
１４・・・・・・「Ｌ」字状端子板、１５・・・・・・
端子部、１６・・・・・・取り付は部、１７・・・・・
・折曲部、１８・・・・・・突起、１９・・・・・・小
「Ｌ」字状端子板、２０・・・・・・端子部、２１・・
・；・・取り付は部、２３・・・・・・半導体チップ、
２４・・・・・・組立体、２５・・・・・・樹脂ケース
、２６・・・・・・複合型半導体装置。1A to 1A are perspective views or plan views showing the structure of a conventional composite semiconductor device, FIG. 2 is an assembled view showing an embodiment of the composite semiconductor device according to the present invention, and FIG. , a sectional view of the same as above, and FIG. 4 are perspective views showing an assembly process of the above. 14... "L" shaped terminal plate, 15...
Terminal part, 16... Installation is part, 17...
・Bending part, 18... Protrusion, 19... Small "L" shaped terminal plate, 20... Terminal part, 21...
・；・・・Installation is in section 23... Semiconductor chip,
24... Assembly, 25... Resin case, 26... Composite semiconductor device.
Claims (1)
た平面形状路「Ｌ」字状の端子板と、前記チップの他方
の主面を接続する端子板と、前記チップを前記端子板の
組み合せによって挾持固定した組立体を収納し、かつ樹
脂封止するケースとを有することを特徴とする複合型半
導体装置。An L-shaped terminal board with a planar path provided with a projection on a portion corresponding to one main surface of the semiconductor chip, a terminal board connecting the other main surface of the chip, and a terminal board connecting the chip to the other main surface of the terminal board. What is claimed is: 1. A composite semiconductor device characterized by having a case that houses an assembly that is clamped and fixed in combination and is sealed with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18074481U JPS5885359U (en) | 1981-12-04 | 1981-12-04 | Composite semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18074481U JPS5885359U (en) | 1981-12-04 | 1981-12-04 | Composite semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5885359U true JPS5885359U (en) | 1983-06-09 |
Family
ID=29977605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18074481U Pending JPS5885359U (en) | 1981-12-04 | 1981-12-04 | Composite semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885359U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS488020U (en) * | 1971-06-09 | 1973-01-29 | ||
| JPS4939229A (en) * | 1972-08-22 | 1974-04-12 |
-
1981
- 1981-12-04 JP JP18074481U patent/JPS5885359U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS488020U (en) * | 1971-06-09 | 1973-01-29 | ||
| JPS4939229A (en) * | 1972-08-22 | 1974-04-12 |
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