JPS5877045U - Positioning structure of woven fabric impregnated resin for semiconductor encapsulation - Google Patents

Positioning structure of woven fabric impregnated resin for semiconductor encapsulation

Info

Publication number
JPS5877045U
JPS5877045U JP17111381U JP17111381U JPS5877045U JP S5877045 U JPS5877045 U JP S5877045U JP 17111381 U JP17111381 U JP 17111381U JP 17111381 U JP17111381 U JP 17111381U JP S5877045 U JPS5877045 U JP S5877045U
Authority
JP
Japan
Prior art keywords
woven fabric
fabric impregnated
semiconductor encapsulation
impregnated resin
positioning structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17111381U
Other languages
Japanese (ja)
Inventor
成瀬　敏計
Original Assignee
リコーエレメックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リコーエレメックス株式会社 filed Critical リコーエレメックス株式会社
Priority to JP17111381U priority Critical patent/JPS5877045U/en
Publication of JPS5877045U publication Critical patent/JPS5877045U/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の実施例を示す断面図、第２図は本考案の
一実施例を示す斜視図、第３図は本考案の他の実施例を
示す斜視図、第４図は本考案の更に他の実施例を示す斜
視図である。 １１・１２・・・・・・シート状織布含浸レジン、１２
・２２・・・・・・回路基板、１３・２３・・・・・・
半導体、１８・・・・・・柱、１５・２９・・・・・・
穴、１６・・・・・・切り欠き。Fig. 1 is a sectional view showing a conventional embodiment, Fig. 2 is a perspective view showing an embodiment of the invention, Fig. 3 is a perspective view showing another embodiment of the invention, and Fig. 4 is a perspective view showing an embodiment of the invention. FIG. 3 is a perspective view showing still another embodiment of the invention. 11・12・・・Sheet-like woven fabric impregnated resin, 12
・22・・・・・・Circuit board, 13・23・・・・・・
Semiconductor, 18... Pillar, 15/29...
Hole, 16...notch.

Claims (4)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）半導体をワイヤボンディングした回路基板と、シ
ート状織布含浸レジンからなり、一方に位置決用の突出
部を他方に穴または切り欠きを設けた事を特徴とする半
導体封止用織布含浸レジンの位置決構造。(1) A woven fabric for semiconductor encapsulation consisting of a circuit board wire-bonded with a semiconductor and a sheet-like woven fabric impregnated with resin, with a protrusion for positioning on one side and a hole or cutout on the other side. Positioning structure of impregnated resin. （２）　　位置決用の突出部が半導体封止レジンの一部
を突出させたものである実用新案登録請求の範囲第１項
記載の半導体封止用織布含浸レジンの位置決構造。(2) The positioning structure of a woven fabric impregnated resin for semiconductor encapsulation according to claim 1, wherein the positioning protrusion is a part of the semiconductor encapsulation resin. （３）突出部がシート状織布含浸レジンの一部を折り曲
げたものである実用新案登録請求の範囲第２項記載の半
導体封止用織布含浸レジンの位置決構造。(3) The positioning structure of a woven fabric impregnated resin for semiconductor encapsulation according to claim 2, wherein the protruding portion is a part of the woven fabric impregnated resin sheet. （４）突出部がシート状織布含浸レジンの一部を成形し
たものである実用新案登録請求の範囲第２項記載の半導
体封止用織布含浸レジンの位置決構造。(4) The positioning structure of a woven fabric impregnated resin for semiconductor encapsulation according to claim 2, wherein the protruding portion is formed by molding a part of a sheet-like woven fabric impregnated resin.
JP17111381U 1981-11-16 1981-11-16 Positioning structure of woven fabric impregnated resin for semiconductor encapsulation Pending JPS5877045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17111381U JPS5877045U (en) 1981-11-16 1981-11-16 Positioning structure of woven fabric impregnated resin for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17111381U JPS5877045U (en) 1981-11-16 1981-11-16 Positioning structure of woven fabric impregnated resin for semiconductor encapsulation

Publications (1)

Publication Number Publication Date
JPS5877045U true JPS5877045U (en) 1983-05-24

Family

ID=29963055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17111381U Pending JPS5877045U (en) 1981-11-16 1981-11-16 Positioning structure of woven fabric impregnated resin for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPS5877045U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077045U (en) * 1983-10-28 1985-05-29 アルプス電気株式会社 Pinch roller switching device
JPS6429840U (en) * 1987-08-17 1989-02-22

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831387A (en) * 1971-08-27 1973-04-24
JPS5178691A (en) * 1974-12-28 1976-07-08 Sony Corp UEHAKYOKYUSOCHI

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831387A (en) * 1971-08-27 1973-04-24
JPS5178691A (en) * 1974-12-28 1976-07-08 Sony Corp UEHAKYOKYUSOCHI

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077045U (en) * 1983-10-28 1985-05-29 アルプス電気株式会社 Pinch roller switching device
JPS6429840U (en) * 1987-08-17 1989-02-22

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