JPS5881989A - 部分メツキ方法 - Google Patents

部分メツキ方法

Info

Publication number
JPS5881989A
JPS5881989A JP17811381A JP17811381A JPS5881989A JP S5881989 A JPS5881989 A JP S5881989A JP 17811381 A JP17811381 A JP 17811381A JP 17811381 A JP17811381 A JP 17811381A JP S5881989 A JPS5881989 A JP S5881989A
Authority
JP
Japan
Prior art keywords
pipe
plating
plated
plating solution
main pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17811381A
Other languages
English (en)
Japanese (ja)
Other versions
JPH031392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Toshihiko Fujimori
藤森　敏彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP17811381A priority Critical patent/JPS5881989A/ja
Publication of JPS5881989A publication Critical patent/JPS5881989A/ja
Publication of JPH031392B2 publication Critical patent/JPH031392B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP17811381A 1981-11-06 1981-11-06 部分メツキ方法 Granted JPS5881989A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17811381A JPS5881989A (ja) 1981-11-06 1981-11-06 部分メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17811381A JPS5881989A (ja) 1981-11-06 1981-11-06 部分メツキ方法

Publications (2)

Publication Number Publication Date
JPS5881989A true JPS5881989A (ja) 1983-05-17
JPH031392B2 JPH031392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-10

Family

ID=16042878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17811381A Granted JPS5881989A (ja) 1981-11-06 1981-11-06 部分メツキ方法

Country Status (1)

Country Link
JP (1) JPS5881989A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH031392B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-01-10

Similar Documents

Publication Publication Date Title
Chin Mass transfer and current‐potential relation in pulse electrolysis
CN104357883B (zh) 一种无氰电铸金溶液及电铸金方法
CN105200478A (zh) 一种内腔电镀连续生产设备
CN206916248U (zh) 一种适用于α放射源制备的电沉积样品制备仪
CN211005669U (zh) 一种管内流动电沉积装置
Talbot et al. Application of linear stability and bifurcation analysis to passivation models
JPS5881989A (ja) 部分メツキ方法
US3920526A (en) Process for the electrodeposition of ductile palladium and electroplating bath useful therefor
GB1000721A (en) Improvements in or relating to the electrolytic deposition on a workpiece
CN103849915B (zh) 电镀装置和pcb板导通孔镀铜的方法
JPS6131197B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN206570427U (zh) 一种塑胶件电镀设备
CN205062213U (zh) 内腔电镀连续生产设备
JPS5970790A (ja) 部分メツキ装置
CN111088519A (zh) 一种清洗镀银镀铬夹具的电解设备及电解清洗方法
CN207596992U (zh) 一种全自动电镀加药机
CN206512295U (zh) 一种温控电镀槽
JP3196941B2 (ja) めっき装置
CN211036148U (zh) 一种金属表面镀膜的装置
CN214218885U (zh) 一种液流法局部镀锡的装置
JPS5974292A (ja) 部分メツキ装置
CN205556817U (zh) 一种用于电路板贯孔镀膜的装置
CN221071648U (zh) 一种长盲孔零件的新型化镍上挂工装
Pesco et al. Theory and applications of periodic electrolysis
CN105992839B (zh) 形成金属涂层的方法