JPS5881938U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5881938U
JPS5881938U JP17644481U JP17644481U JPS5881938U JP S5881938 U JPS5881938 U JP S5881938U JP 17644481 U JP17644481 U JP 17644481U JP 17644481 U JP17644481 U JP 17644481U JP S5881938 U JPS5881938 U JP S5881938U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor device
protective film
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17644481U
Other languages
English (en)
Japanese (ja)
Other versions
JPS642442Y2 (enrdf_load_stackoverflow
Inventor
谷川　耕一
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17644481U priority Critical patent/JPS5881938U/ja
Publication of JPS5881938U publication Critical patent/JPS5881938U/ja
Application granted granted Critical
Publication of JPS642442Y2 publication Critical patent/JPS642442Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP17644481U 1981-11-26 1981-11-26 半導体装置 Granted JPS5881938U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17644481U JPS5881938U (ja) 1981-11-26 1981-11-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17644481U JPS5881938U (ja) 1981-11-26 1981-11-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS5881938U true JPS5881938U (ja) 1983-06-03
JPS642442Y2 JPS642442Y2 (enrdf_load_stackoverflow) 1989-01-20

Family

ID=29969446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17644481U Granted JPS5881938U (ja) 1981-11-26 1981-11-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS5881938U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034544A (ja) * 1989-05-31 1991-01-10 Nippondenso Co Ltd 位置認識パターン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034544A (ja) * 1989-05-31 1991-01-10 Nippondenso Co Ltd 位置認識パターン

Also Published As

Publication number Publication date
JPS642442Y2 (enrdf_load_stackoverflow) 1989-01-20

Similar Documents

Publication Publication Date Title
JPS5881938U (ja) 半導体装置
JPS5820537U (ja) 半導体装置
JPS5888239U (ja) 半導体装置用マスク
JPS5883149U (ja) 半導体装置
JPS58180403U (ja) 分度器
JPS5885341U (ja) 印刷基板
JPS58109248U (ja) 半導体素子
JPS5917441U (ja) フオトマスク
JPS6071146U (ja) 半導体装置
JPS5821141U (ja) マスクパタ−ン
JPS58192643U (ja) 露光用マスク
JPS59182974U (ja) プリント基板
JPS6041073U (ja) 厚膜回路基板
JPS5984834U (ja) 半導体基板
JPS58150838U (ja) 半導体装置
JPS58136288U (ja) チツプ部品の吸着ノズル
JPS5878676U (ja) セラミツク配線装置
JPS5847117U (ja) 水準器
JPS5868037U (ja) 電子部品
JPS58120661U (ja) 半導体装置
JPS5963462U (ja) セラミツク配線基板
JPS585346U (ja) 半導体装置
JPS58166064U (ja) 触針ランド
JPS5935079U (ja) マグネツト付ホワイトボ−ドマ−カ−
JPS58147796U (ja) 分度器