JPS5875857A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5875857A
JPS5875857A JP56172925A JP17292581A JPS5875857A JP S5875857 A JPS5875857 A JP S5875857A JP 56172925 A JP56172925 A JP 56172925A JP 17292581 A JP17292581 A JP 17292581A JP S5875857 A JPS5875857 A JP S5875857A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed
compound
boric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56172925A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219070B2 (enrdf_load_stackoverflow
Inventor
Hirotoshi Iketani
池谷　裕俊
Akiko Hatanaka
畑中　章子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56172925A priority Critical patent/JPS5875857A/ja
Publication of JPS5875857A publication Critical patent/JPS5875857A/ja
Publication of JPS6219070B2 publication Critical patent/JPS6219070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP56172925A 1981-10-30 1981-10-30 樹脂封止型半導体装置 Granted JPS5875857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56172925A JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56172925A JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5875857A true JPS5875857A (ja) 1983-05-07
JPS6219070B2 JPS6219070B2 (enrdf_load_stackoverflow) 1987-04-25

Family

ID=15950890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56172925A Granted JPS5875857A (ja) 1981-10-30 1981-10-30 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5875857A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133946A (ja) * 1988-11-14 1990-05-23 Nitto Denko Corp 半導体装置
JPH0820628A (ja) * 1994-07-07 1996-01-23 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
US5523629A (en) * 1993-04-27 1996-06-04 Motorola, Inc. Plastic encapsulated microelectronic device
CN109679045A (zh) * 2018-12-27 2019-04-26 山东圣泉新材料股份有限公司 一种轮胎橡胶用新型绿色补强树脂及其组合物

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133946A (ja) * 1988-11-14 1990-05-23 Nitto Denko Corp 半導体装置
US5523629A (en) * 1993-04-27 1996-06-04 Motorola, Inc. Plastic encapsulated microelectronic device
US5535510A (en) * 1993-04-27 1996-07-16 Motorola Inc. Plastic encapsulated microelectronic device and method
JPH0820628A (ja) * 1994-07-07 1996-01-23 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
CN109679045A (zh) * 2018-12-27 2019-04-26 山东圣泉新材料股份有限公司 一种轮胎橡胶用新型绿色补强树脂及其组合物
CN109679045B (zh) * 2018-12-27 2022-04-12 山东圣泉新材料股份有限公司 一种轮胎橡胶用新型绿色补强树脂及其组合物

Also Published As

Publication number Publication date
JPS6219070B2 (enrdf_load_stackoverflow) 1987-04-25

Similar Documents

Publication Publication Date Title
JP4163162B2 (ja) エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置
TW436509B (en) Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
JPS6360543B2 (enrdf_load_stackoverflow)
JPS5875857A (ja) 樹脂封止型半導体装置
JPH0520447B2 (enrdf_load_stackoverflow)
JPS6181426A (ja) 半導体封止用エポキシ樹脂組成物
JPS5875853A (ja) 樹脂封止型半導体装置
JPS583382B2 (ja) 樹脂封止型半導体装置
JPH0379370B2 (enrdf_load_stackoverflow)
JP4622030B2 (ja) エポキシ樹脂組成物及び半導体装置
JPH0733429B2 (ja) エポキシ樹脂組成物
JPS5999748A (ja) 樹脂封止型半導体装置
JP2846748B2 (ja) 半導体装置
JPS6219069B2 (enrdf_load_stackoverflow)
JPH11158354A (ja) 封止用樹脂組成物および樹脂封止型半導体装置
JP3072099B1 (ja) 封止用樹脂組成物および半導体封止装置
JP2940617B1 (ja) 封止用樹脂組成物および半導体封止装置
JP2654376B2 (ja) 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPS6069130A (ja) 樹脂封止型半導体装置
JPS61204954A (ja) 樹脂封止型半導体装置
JPH0582675A (ja) 半導体装置
JPH0567704A (ja) 半導体装置
JP2846749B2 (ja) 半導体装置
JP2574434B2 (ja) 半導体装置
JPH07165878A (ja) 封止用エポキシ樹脂組成物