JPS6219069B2 - - Google Patents
Info
- Publication number
- JPS6219069B2 JPS6219069B2 JP56172924A JP17292481A JPS6219069B2 JP S6219069 B2 JPS6219069 B2 JP S6219069B2 JP 56172924 A JP56172924 A JP 56172924A JP 17292481 A JP17292481 A JP 17292481A JP S6219069 B2 JPS6219069 B2 JP S6219069B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- epoxy
- acid ester
- boric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56172924A JPS5875856A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56172924A JPS5875856A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5875856A JPS5875856A (ja) | 1983-05-07 |
JPS6219069B2 true JPS6219069B2 (enrdf_load_stackoverflow) | 1987-04-25 |
Family
ID=15950872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56172924A Granted JPS5875856A (ja) | 1981-10-30 | 1981-10-30 | 樹脂封止型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5875856A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425449U (enrdf_load_stackoverflow) * | 1990-06-25 | 1992-02-28 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2557629Y2 (ja) * | 1991-06-17 | 1997-12-10 | 三菱自動車工業株式会社 | サッシュレスドア構造 |
-
1981
- 1981-10-30 JP JP56172924A patent/JPS5875856A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425449U (enrdf_load_stackoverflow) * | 1990-06-25 | 1992-02-28 |
Also Published As
Publication number | Publication date |
---|---|
JPS5875856A (ja) | 1983-05-07 |
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