JPS5873939A - 撮像管タ−ゲツト面板の製造方法 - Google Patents

撮像管タ−ゲツト面板の製造方法

Info

Publication number
JPS5873939A
JPS5873939A JP17080081A JP17080081A JPS5873939A JP S5873939 A JPS5873939 A JP S5873939A JP 17080081 A JP17080081 A JP 17080081A JP 17080081 A JP17080081 A JP 17080081A JP S5873939 A JPS5873939 A JP S5873939A
Authority
JP
Japan
Prior art keywords
alloy
surface plate
melting point
pickup tube
target surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17080081A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129011B2 (OSRAM
Inventor
Tsuneichi Yoshino
吉野　常一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17080081A priority Critical patent/JPS5873939A/ja
Publication of JPS5873939A publication Critical patent/JPS5873939A/ja
Publication of JPH0129011B2 publication Critical patent/JPH0129011B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/233—Manufacture of photoelectric screens or charge-storage screens

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
JP17080081A 1981-10-27 1981-10-27 撮像管タ−ゲツト面板の製造方法 Granted JPS5873939A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17080081A JPS5873939A (ja) 1981-10-27 1981-10-27 撮像管タ−ゲツト面板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17080081A JPS5873939A (ja) 1981-10-27 1981-10-27 撮像管タ−ゲツト面板の製造方法

Publications (2)

Publication Number Publication Date
JPS5873939A true JPS5873939A (ja) 1983-05-04
JPH0129011B2 JPH0129011B2 (OSRAM) 1989-06-07

Family

ID=15911579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17080081A Granted JPS5873939A (ja) 1981-10-27 1981-10-27 撮像管タ−ゲツト面板の製造方法

Country Status (1)

Country Link
JP (1) JPS5873939A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133569U (ja) * 1984-02-16 1985-09-05 ソニー株式会社 撮像管
KR100516606B1 (ko) * 2002-01-31 2005-09-22 캐논 가부시끼가이샤 표시장치, 기밀용기 및 기밀용기의 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133569U (ja) * 1984-02-16 1985-09-05 ソニー株式会社 撮像管
KR100516606B1 (ko) * 2002-01-31 2005-09-22 캐논 가부시끼가이샤 표시장치, 기밀용기 및 기밀용기의 제조방법

Also Published As

Publication number Publication date
JPH0129011B2 (OSRAM) 1989-06-07

Similar Documents

Publication Publication Date Title
US6437412B1 (en) Surface acoustic wave device having a package including a conductive cap that is coated with sealing material
US4582240A (en) Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components
JP3670008B2 (ja) 気密ろう接合部の作成方法
JPS61204953A (ja) ハ−メチツクシ−ルカバ−及びその製造方法
JP3207150B2 (ja) 半導体パッケージ
JPS5873939A (ja) 撮像管タ−ゲツト面板の製造方法
JP3207149B2 (ja) 低熱伝導率のキャップを高熱伝導率の基板に固定する方法
JP3462479B2 (ja) 表面弾性波フィルターのセラミックパッケージのシーリング方法及び装置
US6543109B1 (en) Method of manufacturing a surface acoustic wave apparatus
JP2503738B2 (ja) リ―ドフレ―ムへの半導体素子の接合方法
JPS58161950A (ja) 気密融着体およびその融着方法
US4863090A (en) Room temperature attachment method employing a mercury-gold amalgam
JP2000216300A (ja) 樹脂封止形プリント回路板の製造方法
JPS61174766A (ja) 固体撮像装置とその製造方法
JPH10256309A5 (OSRAM)
SU585887A1 (ru) Способ сборки пакетных пьезоэлектрических преобразователей
JPH10120474A (ja) アルミニウムとセラミックスとの接合方法
JPH07118075A (ja) 絶縁材と金属基板の接合方法
TW490819B (en) Manufacturing method for chip passive device structure and package
JPH02142165A (ja) 半導体光センサー用ケース
JP3083880B2 (ja) 半導体圧力センサ用ハーメチックシール構造およびその製造方法
JPS63207032A (ja) 蛍光表示管の製造方法
JPS63197345A (ja) 半導体素子のダイスボンデイング方法
JPS6146233B2 (OSRAM)
JPS6245133A (ja) ペレツト付方法