JPS5872871U - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPS5872871U JPS5872871U JP1981168467U JP16846781U JPS5872871U JP S5872871 U JPS5872871 U JP S5872871U JP 1981168467 U JP1981168467 U JP 1981168467U JP 16846781 U JP16846781 U JP 16846781U JP S5872871 U JPS5872871 U JP S5872871U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- lsi chip
- wiring pattern
- pasted
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図及び第2図は断面図である。
符号、1:基板、2:配線パターン、3.LSIと基板
の半田付部、4 :LSIチップ、5. 5’ :樹
脂A、6:樹脂B17:硬板。
の半田付部、4 :LSIチップ、5. 5’ :樹
脂A、6:樹脂B17:硬板。
Claims (1)
- 所定の配線パターンを形成した基板にLSIチップをボ
ンディングした電子部品に於て、上記LSIチップと反
対側の面に、上記LSIチップと略同形状またはそれよ
り大きな硬板を貼り合わせたことを特徴とする電子部品
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981168467U JPS5872871U (ja) | 1981-11-11 | 1981-11-11 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981168467U JPS5872871U (ja) | 1981-11-11 | 1981-11-11 | 電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5872871U true JPS5872871U (ja) | 1983-05-17 |
Family
ID=29960516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981168467U Pending JPS5872871U (ja) | 1981-11-11 | 1981-11-11 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5872871U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100318317B1 (ko) * | 1999-04-02 | 2001-12-22 | 김영환 | 베어 칩 실장 인쇄회로기판 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5662387A (en) * | 1979-10-26 | 1981-05-28 | Matsushita Electric Ind Co Ltd | Flexible printed circuit board |
-
1981
- 1981-11-11 JP JP1981168467U patent/JPS5872871U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5662387A (en) * | 1979-10-26 | 1981-05-28 | Matsushita Electric Ind Co Ltd | Flexible printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100318317B1 (ko) * | 1999-04-02 | 2001-12-22 | 김영환 | 베어 칩 실장 인쇄회로기판 |
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