JPS5871644A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5871644A
JPS5871644A JP56169757A JP16975781A JPS5871644A JP S5871644 A JPS5871644 A JP S5871644A JP 56169757 A JP56169757 A JP 56169757A JP 16975781 A JP16975781 A JP 16975781A JP S5871644 A JPS5871644 A JP S5871644A
Authority
JP
Japan
Prior art keywords
package
conductive
conductive frame
internal wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56169757A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6237888B2 (enExample
Inventor
Mamoru Yanagisawa
柳沢　守
Takehisa Tsujimura
辻村　剛久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56169757A priority Critical patent/JPS5871644A/ja
Publication of JPS5871644A publication Critical patent/JPS5871644A/ja
Publication of JPS6237888B2 publication Critical patent/JPS6237888B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/60—
    • H10W70/682—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP56169757A 1981-10-23 1981-10-23 半導体装置 Granted JPS5871644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56169757A JPS5871644A (ja) 1981-10-23 1981-10-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56169757A JPS5871644A (ja) 1981-10-23 1981-10-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS5871644A true JPS5871644A (ja) 1983-04-28
JPS6237888B2 JPS6237888B2 (enExample) 1987-08-14

Family

ID=15892279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56169757A Granted JPS5871644A (ja) 1981-10-23 1981-10-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS5871644A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696526A (en) * 1985-07-26 1987-09-29 Intel Corporation Carrier for tape automated bonded semiconductor device
EP2149901A1 (en) * 2008-08-01 2010-02-03 STMicroelectronics Ltd (Malta) Method for manufacturing an electronic device protected against electro static discharge

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696526A (en) * 1985-07-26 1987-09-29 Intel Corporation Carrier for tape automated bonded semiconductor device
EP2149901A1 (en) * 2008-08-01 2010-02-03 STMicroelectronics Ltd (Malta) Method for manufacturing an electronic device protected against electro static discharge
US8742562B2 (en) 2008-08-01 2014-06-03 Stmicroelectronics (Malta) Ltd Electronic device protected against electro static discharge

Also Published As

Publication number Publication date
JPS6237888B2 (enExample) 1987-08-14

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