JPS5868949A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5868949A JPS5868949A JP56168432A JP16843281A JPS5868949A JP S5868949 A JPS5868949 A JP S5868949A JP 56168432 A JP56168432 A JP 56168432A JP 16843281 A JP16843281 A JP 16843281A JP S5868949 A JPS5868949 A JP S5868949A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- film
- barrier metal
- wiring pattern
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 112
- 230000004888 barrier function Effects 0.000 abstract description 39
- 230000001681 protective effect Effects 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 17
- 238000005530 etching Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 8
- 238000005260 corrosion Methods 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 30
- 239000011347 resin Substances 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 229910052782 aluminium Inorganic materials 0.000 description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- 238000000605 extraction Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 11
- 239000012528 membrane Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 229910010977 Ti—Pd Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000003278 haem Chemical class 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56168432A JPS5868949A (ja) | 1981-10-20 | 1981-10-20 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56168432A JPS5868949A (ja) | 1981-10-20 | 1981-10-20 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5868949A true JPS5868949A (ja) | 1983-04-25 |
| JPS628031B2 JPS628031B2 (enrdf_load_stackoverflow) | 1987-02-20 |
Family
ID=15868003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56168432A Granted JPS5868949A (ja) | 1981-10-20 | 1981-10-20 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5868949A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513194A (ja) * | 1974-06-24 | 1976-01-12 | Fuji Electric Co Ltd | Hinanjudohokojidosetsuteihoho |
| JPS5574159A (en) * | 1978-11-28 | 1980-06-04 | Matsushita Electric Ind Co Ltd | Semiconductor device |
-
1981
- 1981-10-20 JP JP56168432A patent/JPS5868949A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513194A (ja) * | 1974-06-24 | 1976-01-12 | Fuji Electric Co Ltd | Hinanjudohokojidosetsuteihoho |
| JPS5574159A (en) * | 1978-11-28 | 1980-06-04 | Matsushita Electric Ind Co Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628031B2 (enrdf_load_stackoverflow) | 1987-02-20 |
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