JPS5863938A - Photomask - Google Patents
PhotomaskInfo
- Publication number
- JPS5863938A JPS5863938A JP56163017A JP16301781A JPS5863938A JP S5863938 A JPS5863938 A JP S5863938A JP 56163017 A JP56163017 A JP 56163017A JP 16301781 A JP16301781 A JP 16301781A JP S5863938 A JPS5863938 A JP S5863938A
- Authority
- JP
- Japan
- Prior art keywords
- photomask
- shape
- wafer
- hexagonal
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はトランジスタやダイオードや半導体集積回路素
子等を製造する際、使用するフォトマスクに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photomask used when manufacturing transistors, diodes, semiconductor integrated circuit elements, and the like.
従来のフォトマスク２は、第１図に示すように、正方形
または長方形をしている。一方、＋導体素子を形成する
半導体ウニノー−１は円形をしているため、＠１図に示
すように、フォトマスク２の四隅の部分は実際には使用
せず無駄になっている。A conventional photomask 2 has a square or rectangular shape, as shown in FIG. On the other hand, since the semiconductor unit 1 forming the positive conductor element has a circular shape, the four corner portions of the photomask 2 are not actually used and are wasted, as shown in Figure @1.
一方、半導体ウェハー１の直径は量産効率を高めるため
、近年増々大形化しておシ、またパターンの微細化と合
わせてマスク２の材質も均一で膨張率の少ない石英ＬＥ
ガラス等になる方向であり高価な材料となってきている
。On the other hand, the diameter of the semiconductor wafer 1 has been increasing in recent years in order to increase mass production efficiency, and in conjunction with the miniaturization of patterns, the material of the mask 2 is also made of quartz LE, which is uniform and has a low expansion rate.
The trend is toward glass, etc., and it is becoming an expensive material.
本発明の目的は無駄が少なくかつ、従来の製造技術に何
ら支障のない低価格のフォトマスクを提供することにあ
る。An object of the present invention is to provide a low-cost photomask with little waste and no problems with conventional manufacturing techniques.
本発明によれば、六角形以上の多阿形で、少なくともｌ
りの平行して対向する２辺を有するフォトマスクを得る
。According to the present invention, the polygonal shape is hexagonal or more, and at least l
A photomask having two parallel opposing sides is obtained.
次に図面を用いて本発明をよシ祥細に説明する。Next, the present invention will be explained in detail using the drawings.
＠２図は、本発明の一実施例を説明する図であ）％六角
形のフォトマスク４を半導体ウェハー３に適用した場合
を示している。第１図との比較でもわかるように、フォ
トマスク４には角の無駄な部分すなわち、半導体ウェハ
ー３からはずれる部分がないため、約２２％の材料費の
原価低減となる。この時、実際の製造に当〕、露光機の
マスクホールダとの位置合せや半導体ウェハー３との位
置合せのため、フォトマスク４には少なくとも１対の平
行な辺が必要となる。Figure 2 is a diagram illustrating an embodiment of the present invention.) It shows a case where a hexagonal photomask 4 is applied to a semiconductor wafer 3. As can be seen from a comparison with FIG. 1, the photomask 4 has no wasted corner parts, that is, parts that come off the semiconductor wafer 3, resulting in a material cost reduction of about 22%. At this time, in actual manufacturing, the photomask 4 needs at least one pair of parallel sides for alignment with the mask holder of the exposure machine and alignment with the semiconductor wafer 3.
以上の説明では、八角形の場合を例としたが。In the above explanation, an octagonal shape was used as an example.
六角形あるいはその他の六角形以上の多角形の場合も同
様であることは言うまでもない。Needless to say, the same applies to hexagons and other polygons larger than hexagons.
第１図は従来のフォトマスクと半導体ウェハーとの関係
を示した図である。
第２図は本発明の一実施例である八角形のフォトマスク
と半導体ウェハーとの関係を示した図である。
１．３・・・・・・半導体ウェハー、２・・・・・・従
来のフォトマスク、４・・・・・・本発明の一実施例で
ある八角形のフォトマスク。
笑 ｌ 図
篤 Ｚ 図FIG. 1 is a diagram showing the relationship between a conventional photomask and a semiconductor wafer. FIG. 2 is a diagram showing the relationship between an octagonal photomask and a semiconductor wafer, which is an embodiment of the present invention. 1.3... Semiconductor wafer, 2... Conventional photomask, 4... Octagonal photomask which is an embodiment of the present invention. Lol l Zu Atsushi Z diagram
Claims (1)
て、外形が六角形以上の多角形でかつ、少なくとも１対
の平行な辺があることを特徴とするフォトマスク。A photomask for use in manufacturing semiconductor devices, the photomask having an outer shape of a hexagon or more polygon and having at least one pair of parallel sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56163017A JPS5863938A (en) | 1981-10-13 | 1981-10-13 | Photomask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56163017A JPS5863938A (en) | 1981-10-13 | 1981-10-13 | Photomask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5863938A true JPS5863938A (en) | 1983-04-16 |
Family
ID=15765604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56163017A Pending JPS5863938A (en) | 1981-10-13 | 1981-10-13 | Photomask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5863938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018520386A (en) * | 2015-07-15 | 2018-07-26 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Exposure apparatus and method |
-
1981
- 1981-10-13 JP JP56163017A patent/JPS5863938A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018520386A (en) * | 2015-07-15 | 2018-07-26 | シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド | Exposure apparatus and method |
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