JPS586124A - 半導体気相成長装置 - Google Patents
半導体気相成長装置Info
- Publication number
- JPS586124A JPS586124A JP10373281A JP10373281A JPS586124A JP S586124 A JPS586124 A JP S586124A JP 10373281 A JP10373281 A JP 10373281A JP 10373281 A JP10373281 A JP 10373281A JP S586124 A JPS586124 A JP S586124A
- Authority
- JP
- Japan
- Prior art keywords
- observation window
- gas
- bell jar
- temperature sensor
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000011521 glass Substances 0.000 claims abstract description 20
- 238000010926 purge Methods 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000010453 quartz Substances 0.000 claims description 13
- 238000001947 vapour-phase growth Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 19
- 230000006698 induction Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10373281A JPS586124A (ja) | 1981-07-02 | 1981-07-02 | 半導体気相成長装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10373281A JPS586124A (ja) | 1981-07-02 | 1981-07-02 | 半導体気相成長装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS586124A true JPS586124A (ja) | 1983-01-13 |
JPS622698B2 JPS622698B2 (enrdf_load_stackoverflow) | 1987-01-21 |
Family
ID=14361807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10373281A Granted JPS586124A (ja) | 1981-07-02 | 1981-07-02 | 半導体気相成長装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS586124A (enrdf_load_stackoverflow) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4641603A (en) * | 1983-11-01 | 1987-02-10 | Toshiba Kikai Kabushiki Kaisha | Epitaxial growing apparatus |
US6306246B1 (en) * | 2000-01-14 | 2001-10-23 | Advanced Micro Devices, Inc. | Dual window optical port for improved end point detection |
US6712927B1 (en) * | 1998-06-11 | 2004-03-30 | Applied Materials Inc. | Chamber having process monitoring window |
WO2004090961A1 (ja) * | 2003-04-10 | 2004-10-21 | Tokyo Electron Limited | シャワーヘッド構造及び処理装置 |
US6863772B2 (en) * | 2002-10-09 | 2005-03-08 | Taiwan Semiconductor Manufacturing Co., Ltd | Dual-port end point window for plasma etcher |
JP2007258633A (ja) * | 2006-03-27 | 2007-10-04 | Taiyo Nippon Sanso Corp | 気相成長装置 |
US20110253044A1 (en) * | 2010-04-14 | 2011-10-20 | Applied Materials, Inc. | Showerhead assembly with metrology port purge |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019082399A1 (ja) * | 2017-10-28 | 2019-05-02 | mui Lab株式会社 | 操作表示パネル組込物品 |
-
1981
- 1981-07-02 JP JP10373281A patent/JPS586124A/ja active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4641603A (en) * | 1983-11-01 | 1987-02-10 | Toshiba Kikai Kabushiki Kaisha | Epitaxial growing apparatus |
US6712927B1 (en) * | 1998-06-11 | 2004-03-30 | Applied Materials Inc. | Chamber having process monitoring window |
US6306246B1 (en) * | 2000-01-14 | 2001-10-23 | Advanced Micro Devices, Inc. | Dual window optical port for improved end point detection |
US6863772B2 (en) * | 2002-10-09 | 2005-03-08 | Taiwan Semiconductor Manufacturing Co., Ltd | Dual-port end point window for plasma etcher |
WO2004090961A1 (ja) * | 2003-04-10 | 2004-10-21 | Tokyo Electron Limited | シャワーヘッド構造及び処理装置 |
US8070910B2 (en) | 2003-04-10 | 2011-12-06 | Tokyo Electron Limited | Shower head structure and treating device |
JP2007258633A (ja) * | 2006-03-27 | 2007-10-04 | Taiyo Nippon Sanso Corp | 気相成長装置 |
US20110253044A1 (en) * | 2010-04-14 | 2011-10-20 | Applied Materials, Inc. | Showerhead assembly with metrology port purge |
Also Published As
Publication number | Publication date |
---|---|
JPS622698B2 (enrdf_load_stackoverflow) | 1987-01-21 |
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