JPS5858740A - 半導体ウエハのそり測定装置 - Google Patents

半導体ウエハのそり測定装置

Info

Publication number
JPS5858740A
JPS5858740A JP15775781A JP15775781A JPS5858740A JP S5858740 A JPS5858740 A JP S5858740A JP 15775781 A JP15775781 A JP 15775781A JP 15775781 A JP15775781 A JP 15775781A JP S5858740 A JPS5858740 A JP S5858740A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
objective lens
reference plate
warpage
measuring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15775781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS629217B2 (enrdf_load_stackoverflow
Inventor
Sunao Nishioka
西岡　直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15775781A priority Critical patent/JPS5858740A/ja
Publication of JPS5858740A publication Critical patent/JPS5858740A/ja
Publication of JPS629217B2 publication Critical patent/JPS629217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP15775781A 1981-10-02 1981-10-02 半導体ウエハのそり測定装置 Granted JPS5858740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15775781A JPS5858740A (ja) 1981-10-02 1981-10-02 半導体ウエハのそり測定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15775781A JPS5858740A (ja) 1981-10-02 1981-10-02 半導体ウエハのそり測定装置

Publications (2)

Publication Number Publication Date
JPS5858740A true JPS5858740A (ja) 1983-04-07
JPS629217B2 JPS629217B2 (enrdf_load_stackoverflow) 1987-02-27

Family

ID=15656665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15775781A Granted JPS5858740A (ja) 1981-10-02 1981-10-02 半導体ウエハのそり測定装置

Country Status (1)

Country Link
JP (1) JPS5858740A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6131911A (ja) * 1984-07-25 1986-02-14 Toshiba Corp 表面検査装置
JPS61124809A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 検査方法および検査装置
JPS6227606A (ja) * 1985-07-29 1987-02-05 Hitachi Electronics Eng Co Ltd フオ−カススキヤンによるパタ−ン検査方法
JPS62156507A (ja) * 1985-12-04 1987-07-11 ケイエルエイ・インストラメンツ・コ−ポレ−シヨン 三次元物体の表面を検査する光学的検査装置
CN113555292A (zh) * 2020-04-23 2021-10-26 海太半导体（无锡）有限公司 一种监控基板弯曲的系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01142511A (ja) * 1987-11-27 1989-06-05 Mitsubishi Cable Ind Ltd 多心光ファイバ心線用コネクタ組立方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6131911A (ja) * 1984-07-25 1986-02-14 Toshiba Corp 表面検査装置
JPS61124809A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 検査方法および検査装置
JPS6227606A (ja) * 1985-07-29 1987-02-05 Hitachi Electronics Eng Co Ltd フオ−カススキヤンによるパタ−ン検査方法
JPS62156507A (ja) * 1985-12-04 1987-07-11 ケイエルエイ・インストラメンツ・コ−ポレ−シヨン 三次元物体の表面を検査する光学的検査装置
CN113555292A (zh) * 2020-04-23 2021-10-26 海太半导体（无锡）有限公司 一种监控基板弯曲的系统

Also Published As

Publication number Publication date
JPS629217B2 (enrdf_load_stackoverflow) 1987-02-27

Similar Documents

Publication Publication Date Title
US7158233B2 (en) Alignment mark, alignment apparatus and method, exposure apparatus, and device manufacturing method
JP3967935B2 (ja) 合わせ精度計測装置及びその方法
US9207189B2 (en) Sample support apparatus
JP4323608B2 (ja) 露光装置およびデバイス製造方法
JP3211491B2 (ja) 投影露光装置及びそれを用いた半導体製造方法並びに装置
JP2010073703A (ja) パターンの検査装置、およびパターンの検査方法
KR101962830B1 (ko) 사전 정렬 측정 장치 및 방법
WO2020153203A1 (ja) 実装装置および実装方法
US4880309A (en) Dark field target design system for alignment of semiconductor wafers
JPH07297119A (ja) 位置検出方法
JPS5858740A (ja) 半導体ウエハのそり測定装置
JP5096852B2 (ja) 線幅測定装置および線幅測定装置の検査方法
JP2539778B2 (ja) 検査方法および検査装置
JPH11307567A (ja) バンプ検査工程を有する半導体装置の製造方法
JP2011002737A (ja) 露光装置及び露光方法
JPH11264718A (ja) ウエハの位置把握方法並びに露光方法及び露光装置
JPS6243505A (ja) 半導体ウエハ上の被検査パターンの欠陥検査方法およびその装置
JP4304413B2 (ja) 半導体露光装置のレチクルのレベル測定方法
JPH0536768A (ja) プローブ装置
JPH06308040A (ja) 異物検査装置
KR20170078902A (ko) 기판 상의 패턴 이미지 검출 방법 및 이를 이용한 기판 검사방법
JP4665679B2 (ja) フォトマスク及びその歪み検出装置及び半導体集積回路の製造方法
US20250233022A1 (en) Wafer bonding overlay measurement system
CN114326337B (zh) 光刻对准方法
JPH1154418A (ja) 信号波形補正方法および装置