JPS5858739A - ボンデイング用ツ−ル - Google Patents

ボンデイング用ツ−ル

Info

Publication number
JPS5858739A
JPS5858739A JP56157519A JP15751981A JPS5858739A JP S5858739 A JPS5858739 A JP S5858739A JP 56157519 A JP56157519 A JP 56157519A JP 15751981 A JP15751981 A JP 15751981A JP S5858739 A JPS5858739 A JP S5858739A
Authority
JP
Japan
Prior art keywords
wire
bonding tool
bonding
wire passage
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56157519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347145B2 (OSRAM
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Shunei Uematsu
俊英 植松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP56157519A priority Critical patent/JPS5858739A/ja
Publication of JPS5858739A publication Critical patent/JPS5858739A/ja
Publication of JPS6347145B2 publication Critical patent/JPS6347145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56157519A 1981-10-05 1981-10-05 ボンデイング用ツ−ル Granted JPS5858739A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56157519A JPS5858739A (ja) 1981-10-05 1981-10-05 ボンデイング用ツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56157519A JPS5858739A (ja) 1981-10-05 1981-10-05 ボンデイング用ツ−ル

Publications (2)

Publication Number Publication Date
JPS5858739A true JPS5858739A (ja) 1983-04-07
JPS6347145B2 JPS6347145B2 (OSRAM) 1988-09-20

Family

ID=15651439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56157519A Granted JPS5858739A (ja) 1981-10-05 1981-10-05 ボンデイング用ツ−ル

Country Status (1)

Country Link
JP (1) JPS5858739A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0424930A (ja) * 1990-05-15 1992-01-28 Nippon Steel Corp ボンディングツール
US6032850A (en) * 1997-03-14 2000-03-07 Texas Instruments Incorporated Fine pitch bonding technique using rectangular wire and capillary bore

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0424930A (ja) * 1990-05-15 1992-01-28 Nippon Steel Corp ボンディングツール
US6032850A (en) * 1997-03-14 2000-03-07 Texas Instruments Incorporated Fine pitch bonding technique using rectangular wire and capillary bore

Also Published As

Publication number Publication date
JPS6347145B2 (OSRAM) 1988-09-20

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